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http://dx.doi.org/10.3795/KSME-A.2004.28.6.774

A Study on the Convective Heat Transfer in Micro Heat Exchanger Embedded in Stacked Multi-Chip Modules  

Shin, Joong-Han (서울대학교 기계항공공학부)
Kang, Moon-Koo (서울대학교 기계항공공학)
Lee, Woo-Il (서울대학교 전기컴퓨터공학부)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.28, no.6, 2004 , pp. 774-782 More about this Journal
Abstract
This article presents a numerical and experimental investigation for the single-phase forced laminar convective heat transfer through arrays of micro-channels in micro heat exchangers to be used for cooling power-intensive semiconductor packages, especially the stacked multi-chip modules. In the numerical analysis, a parametric study was carried out for the parameters affecting the efficiency of heat transfer in the flow of coolants through parallel rectangular micro-channels. In the experimental study, the cooling performance of the micro heat exchanger was tested on prototypes of stacked multi-chip modules with difference channel dimensions. The simulation results and the experiment data were acceptably accordant within a wide range of design variations, suggesting the numerical procedure as a useful method for designing the cooling mechanism in stacked multi-chip packages and similar electronic applications.
Keywords
Multi-Chip Module(MCM); Micro Heat Exchanger; Microchannel; Laminar Convective Heat Transfer; Entry Length Effect;
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