• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.15 no.7 s.100
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• pp.799-805
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• 2005

This paper describes the development process of high stiffness body for ride and handling performance. High stiffness and light weight vehicle is a major target in the refinement of Passenger cars to meet customers' contradictable requirements between ride and handling performance and fuel economy This paper describes the analysis approach process for high stiffness body through the data level of body stiffness. According to the frequency band. we can suggest the design guideline about lg cornering static stiffness, torsional and lateral stiffness, body attachment stiffness. The ride and handling characteristic of a vehicle Is significantly affected by vibration transferred to the body through the chassis mounting points from front and rear suspension. It is known that body attachment stiffness is an important factor of ride and handling performance improvement. And high stiffness helps to improve the flexibility of bushing rate tuning between handling and road noise. It makes possible to design the good handling performance vehicle and save vehicles to be used in tests by using mother car at initial design stage. These improvements can lead to shortening the time needed to develop better vehicles.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.3
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• pp.496-501
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• 2007

In this paper, we suggest postal RFID adaptation model and system architecture which can be used for real time trace and track of parcel processing and pallet management. This paper also shows postal RFID application system testbed based on the proposed postal RFID application model and architecture, and shows recognition performance of tag on parcel and pallet by speed and mounting tag material such as thin cans, water bottles, and paper using implemented postal RFID system to find the best solution for RFID adaptation in postal logistics environment. In the experiment, we can know recognition performance of paper and aluminium foil is better than water bottles and thin cans.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.10
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• pp.866-872
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• 2008

Torsional oscillations of the mechanical drivetrain in electric vehicles are generated under rapid driving conditions. These lead to an uncomfortable jerking of the vehicle and to an increased stress of the mechanical components. To analyze this phenomenon, a drivetrain model is constructed with lumped parameters. The model parameters are identified by geometrical design data and experimental tests. The proposed model is validated by simulation and experimental tests in the time and the frequency domains. As a result, the torsional oscillations are observed at 7Hz of a low damped natural frequency. Also, the analysis of the effect of the parameter variations on the oscillations shows that the oscillation characteristic is mainly dependent on the rotor inertia, and the stiffness of the mounting of the drive aggregate and the driveshaft. The results will be utilized on the basis of the design of an electric drivetrain and an active control of drivetrain oscillations.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.19 no.6
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• pp.583-590
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• 2009

An engine is one of the most dominant noise and vibration sources in vehicle systems. Therefore, in order to resolve noise and vibration problems due to engine, various types of engine mounts have been proposed. This work presents a new type of active engine mount system featuring a magneto-rheological (MR) fluid and a piezostack actuator. As a first step, six degrees-of freedom dynamic model of an in-line four-cylinder engine which has three points mounting system is derived by considering the dynamic behaviors of MR mount and piezostack mount. In the configuration of engine mount system, two MR mounts are installed for vibration control of roll mode motion whose energy is very high in low frequency range, while one piezostack mount is installed for vibration control of bounce and pitch mode motion whose energy is relatively high in high frequency range. As a second step, linear quadratic regulator (LQR) controller is synthesized to actively control the imposed vibration. In order to demonstrate the effectiveness of the proposed active engine mount, vibration control performances are evaluated under various engine operating speeds(wide frequency range) and presented in time domain.

• Transactions of the Korean Society of Automotive Engineers
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• v.7 no.5
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• pp.96-106
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• 1999

In this study, the advanced shift control algorithm for parallel type hybrid drivetrain system with automated manual transmission(AMT) is proposed. The AMT can be easily realized by mounting the pneumatic actuators and sensors on the clutch and shift levers of the conventional manual transmission. By using the electronic-controlled AMT, engine and induction machine, it is possible to achieve the integrated control of overall system for the efficiency and the performance of the vehicle. Performing the speed control of the induction machine and the engine, the synchronization at gear shifting and the smooth engagement of clutch can be guaranteed. And it enables to reduce the shift shock and shorten the shift time. Hence, it results in the improvement of shift quality and the driving comfort of the vehicle. Dynamometer-based experiments are carried out to prove the validity of the proposed shift control algorithm.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.30 no.6_2
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• pp.593-605
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• 2012

LiDAR systems provide dense and accurate topographic information. A pre-requisite to achieving the potential accuracy of LiDAR is having a proper system calibration, which aims at estimating all the systematic errors in the system measurements and the mounting parameters relating the different components. This paper presents a rigorous and two approximate methods for LiDAR system calibration. The rigorous approach makes use of the LiDAR equation and the system raw measurements. The approximate approaches utilize simplified LiDAR equations using some assumptions, which allow for less strict requirements regarding the raw measurements. The first presented approximate method, denoted as quasi-rigorous, assumes that we are dealing with a vertical platform (i.e., small pitch and roll angles). This method requires time-tagged point cloud and trajectory position data. The second approximate method, denoted as simplified, assumes that we are dealing with parallel strips, vertical platform, and minor terrain elevation variations compared to the flying height above ground. Such method can be performed using the LiDAR point cloud only. Experimental results using a real dataset, whose characteristics deviate to some extent from the utilized assumptions in the approximate methods, are presented to provide a comparative analysis of the outcome from the introduced methods.

• Korean Journal of Materials Research
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• v.17 no.8
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• pp.402-407
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• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.857-858
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• 2006

Estrangement hierarchical by bipolarization is deepened and time space that social welfare by graying corresponds great so. Specially, is real condition that indifference by patient's increase which is solitary life string is come to involve by social problem. Together, Jaetaek bone fracture patient's ratio is zooming. Domestic BT technology, medical treatment solution technology offer more important role than role assistance enemy of modern technology and utilize by creative technology can . Specially, if apply supersonic waves in bone fracture treatment, there is treatise data that can reduce bone fracture treatment period of bone that bone does not stick well about 40%. Supersonic waves operation frequency used on both end because do 1m Hz, 1.3mHz, supersonic waves origination that have 1.5mHz's Piezo-ceramic crystal tranducer material each 4 premature senilitys in this research, and outside diameter according to impedance and Phase d used Gakgak4mm, 5.4mm, Dukke0.5mm, transformer deuce of length 70mm. Manufactured, and investigated supersonic waves distribution chart by capacity 50m W. Supersonic waves used by diagnosis mainly but is seen to become convenient medical treatment mounting in bone fracture patient's treatment if supplement clinically. If supplement system furthermore, is going to apply to osteoporosis patient, and this research tried to design poetic theme width directly and study rain standardization special quality and approach basic form because do modelling.