• 한국재료학회지
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• 제15권1호
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• pp.54-60
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• 2005

Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. ion migration phenomena has been observed in the field of exposing the specific environment and using for a long tin e. This study was evaluated the generation time of ion migration and was investigated properly test method through water drop test and high temperature high humidity test. Also we observed direct causes and confirmed generation mechanism of dendritic growth as we reproduced the ion migration phenomena. We utilized PCB(printed circuit board) having a comb pattern as follows 0.5, 1.0, 2.0 mm pattern distance. Cu, SnPb and Au were electroplated on the comb pattern. 6.5 V and 15 V were applied in the comb pattern and then we measured the electrical short time causing by ion migration. In these results, we examined a difference of ion migration time depending on pattern materials, applied voltage and pattern spacing of PCB conductor.

• 반도체디스플레이기술학회지
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• 제18권2호
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• pp.82-86
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• 2019

The reliability of 3D NAND flash memory cell is affected by the charge migration which can be divided into the vertical migration and the lateral migration. To clarify the difference of two migrations, the activation energy of the charge loss is extracted and compared in a conventional square device pattern and a new test pattern where the perimeter of the gate is exaggerated but the area is same. The charge loss is larger in the suggested test pattern and the activation energy is extracted to be 0.058 eV while the activation energy is 0.28 eV in the square pattern.

• 한국신뢰성학회지:신뢰성응용연구
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• 제16권3호
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• pp.202-207
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• 2016

Purpose: The purpose of this study is main factors (environmental conditions, pattern spacing, pattern material) that effect the ion-migration of PCB. Methods: Recently, the electronic components are becoming more high density of electronic device, so that electronic circuits have smaller pitches between the patten and more vulnerable to insulation failure. so the reliability of electric insulation of device has become an ever important issue as device contact pitches of pattern. Usually, ion-migration occurs in high temperature and high humidity environment as voltage is applied to the circuit. Under high temperature and high humidity, voltage applied electronic components respond to applied voltages by metals's electrochemical ionization and a conducting filament forms between the anode and cathode across a nonmetallic medium. This leads to short-circuit failure of the electronic component. Results: we studied ion-migration that occurs in accordance with the main factors (environmental conditions, pitches, pattern material). The PCB pattern material was made by two different types of material (free solder, OSP) for this research and pitches of pattern is 0.15mm, 0.3mm, 0.5mm. PCB was experimented in the environmental conditions (high temperature $120^{\circ}C$, high temperature and high humidity $85^{\circ}C$, 85%RH) and was analyzed for ion-migration through the experiment results. Conclusion: We confirmed that environmental condition, pitches of pattern, pattern material had effect on ion-migration of PCB.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년 추계학술발표대회 개요집
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• pp.136-138
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• 2006

Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. Ion migration phenomena has been observed in the field of exposing the specific environment and using for a long time. Also as the RoHS restriction was started in July 1st, 2006, Pb-free solder was utilized in electronics assemblies. In this case, it is very important to compatible between components and printed circuit board(PCB), thus surface treatment materials of PCB was changed to Sn, Sn-3.0Ag-0.5Cu, Cu. Therefore these new application become to need to reevaluate the sensitivity about electrochemical ion migration. This study was evaluated the occurrence time of electrochemical ion migration using by water drop test. We utilized PCB(printed circuit board) having a comb pattern as follows 0.1, 0.318, 0.5, 1.0 mm pattern distance. Sn-3.0Ag-0.5Cu and Sn-37Pb were electroplated on the comb pattern. 6.5V and 15.0V were applied in the comb pattern and then we measured the electrical short time causing by occurring the ion migration. In these results, we evaluate the sensitivity and derived the prediction models of ion migration occurrence time depending on the pattern materials, applied voltage and pattern spacing of PCB conductor.

• Journal of Ecology and Environment
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• 제44권3호
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• pp.185-195
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• 2020

Background: The flathead grey mullet Mugil cephalus has the widest distribution among mugilid species. Recent studies based on mitochondrial DNA sequences showed that the species comprises at least 14 different groups, three of which occur in the northwest Pacific. We analyzed the otolith microchemistry of M. cephalus at several locations in Korea to improve understanding of migration pattern and population origin. Results: We collected 123 sagittal otoliths from seven locations and determined their concentrations of eight elements (⁷Li, ²⁴Mg, ⁵⁵Mn, ⁵⁷Fe, ⁶⁰Ni, ⁶³Cu, ⁸⁸Sr, and ¹³⁸Ba) using laser ablation inductively coupled plasma mass spectrometry. Mean otolith elemental ratios differed significantly among the locations. The Sr:Ca, Fe:Ca, and Ba:Ca ratios were significantly higher than others, and useful chemical signatures for investigating the habitat use of M. cephalus populations. We identified five diverse and complicated migration patterns using the otolith data that we collected: estuarine resident (type I), freshwater migrant (type II), estuarine migrant (type III), seawater resident (type IV), and seawater migrant (type V). A canonical discriminant analysis plot revealed separation of two groups (type II in the Yellow Sea vs. other types in remaining locations). Two locations on Jeju Island, despite their close proximity, had fish with quite different migration patterns, corroborating previous molecular studies that distinguished two groups of fishes. Conclusion: We successfully showed that the migration patterns of the Korean mullet varied by location. Only fish from the western sector of Jeju had a unique migration pattern, which is likely confined population in this area. Among the eight otolith elements measured, the Sr:Ca ratio was found to be the best indicator of migration pattern and population origin.

• 농촌계획
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• 제23권2호
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• pp.67-74
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• 2017

Migration is defined as the movement of people between residential places, and represents interactions between regions. Changes in migration involve changes in both the number of migrants toward/from regions and migration patterns across regions. However, most migration studies have focused only on the change in migrants, while no empirical study captures changes in migration patterns. In this paper, I present a function using the cosine similarity to measure changes in migration patterns, and apply it to 2001-2016 migration data of Korea. The results show that the migration patterns of Korea shifted in 2007, resulting in two distinct clusters. Local areas experienced various migration pattern changes despite few changes in the number of migrants.

• 농촌계획
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• 제22권1호
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• pp.49-56
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• 2016

Throughout the economic development era of Korea, migration occurred within a spatial hierarchy, with upward flows from rural areas to urban. The concept of step migration is a typical theory to explain these upward migration flows. Recent migration data and trends, however, indicate that migration-pattern regime shows strongly opposite-direction flows, with many of the major migration flowing downward on this national-spatial hierarchy, away from urban areas. In this study, we examine the most recent structure of migration flows up and down within the national-spatial hierarchy. We define seven tiers to tabulate origin-destination migration flows from population density of local administrative districts for the period 2001-2014, and then analyze the migration patterns between the tiers over time. The results show differentiated patterns of migration within the national-spatial hierarchy over time including specific states of migrants' life cycles.

• ALGAE
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• 제17권1호
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• pp.1-9
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• 2002

Diel vertical distribution of phytoflagellates and interactions between the phytoplankton components and environmental and biological factors were studied in a small artificial pond for three days on the December 18, 1998 and April 9 to 10, 1999. The phytoplankton population was dominated by Mallomonas akrokomos of chrysophytes and Cryptomonas marssonii and Chroomonas sp. of cryptophytes. The vertical distribution of these phytoflagellates taxa exhibited clear diel migration pattern. Moreover their migration patterns are showed differential fluctuation between M. akrokomos, C. marssonii and Chroomonas sp. The later two species upward migrated in the evening as well as night, whereas the former species migrated downward. Their distinctive migration pattern was found during the night but was not observed in the morning. During daytime C. marssonii and Chroomonas sp. showed maximum density above 2 m depth but M. akrokomos below 2 m depth. The diel vertical distribution of the dominant phytoflagellates did not show significant correlation between physical, chemical and biotic factors.

• 국제지역연구
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• 제21권4호
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• pp.125-139
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• 2017

본 연구는 미얀마의 지역 간 인구이동의 결정요인과 패턴을 분석한다. 인구이동은 경제적 요인과 사회적 요인뿐만 아니라 지역적 특성 등 다양한 요인에 의해 영향을 받는다. 소득과 취업 그리고 사회간접자본과 같은 요소에 의해 영향을 받는다. 따라서 본 연구는 다음의 두 가지 연구문제를 분석하려고 한다. 첫째로, 미얀마의 개혁과 개방으로 농촌에서 도시로의 인구이동이 일어나고 있는 지 분석하려고 한다. 미얀마에서도 다른 개도국들이 경험했던 인구이동의 패턴이 발생하는 지를 검증하려고 한다. 둘째로, 미얀마의 인구이동에 사회간접자본이 미치는 영향을 분석한다. 도로, 전기, 수도 등 기본적 사회간접자본이 인구이동에 미치는 영향을 분석한다. 이는 지역 균형 발전을 위한 사회간접자본의 투자 정책 결정에 시사점을 줄 것이다. 분석결과 첫째로, 미얀마의 인구이동 패턴은 다른 개도국이 경험한 것과 같이 농촌에서 도시지역으로의 인구이동이 일어나고 있다. 미얀마의 도시지역인 양곤과 만달레이 지역으로 인구이동이 이루어지고 있는 것으로 분석되었다. 둘째로 도로를 비롯한 사회간접자본은 인구를 흡입하는 능력이 있는 것으로 분석되었다. 셋째로, 취업기회는 미얀마 인구이동에 가장 큰 영향을 미치는 것으로 분석되었다. 경제개발 초기 단계이지만 해외 자본이 들어오고 있는 상황에서 취업의 기회가 높은 지역으로 인구가 이동하는 것으로 분석되었다. 이는 해외자본을 통해서 경제개발이 이루어지고 있는 상황에서 해외자본의 유입의 방향과 지역의 발전의 불균형 정도가 결정될 것으로 분석된다.

• 한국표면공학회지
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• 제47권2호
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• pp.63-67
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• 2014

As the demand for fine-pitch FPCB (Flexible Printed Circuit Board) increases, so do the number of applications of sputtered FCCL (Flexible Copper Clad Laminate). Furthermore, as the width between the circuit patterns decreases, greater defects are observed in the migration phenomenon. In this study we observed changes in ion migration in real circuit-pattern width using sputtered FCCL. We found that as the applied voltage and residue thickness of the NiCr seeds increase, ion migration occurs faster. If the NiCr seed layer thickens due to a high cathode power and long deposition time while being sputtered, the NiCr will form a residue that quickly becomes a factor for incurring ion migration.