• Korean Journal of Materials Research
• /
• v.15 no.1
• /
• pp.54-60
• /
• 2005

Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. ion migration phenomena has been observed in the field of exposing the specific environment and using for a long tin e. This study was evaluated the generation time of ion migration and was investigated properly test method through water drop test and high temperature high humidity test. Also we observed direct causes and confirmed generation mechanism of dendritic growth as we reproduced the ion migration phenomena. We utilized PCB(printed circuit board) having a comb pattern as follows 0.5, 1.0, 2.0 mm pattern distance. Cu, SnPb and Au were electroplated on the comb pattern. 6.5 V and 15 V were applied in the comb pattern and then we measured the electrical short time causing by ion migration. In these results, we examined a difference of ion migration time depending on pattern materials, applied voltage and pattern spacing of PCB conductor.

• Journal of the Semiconductor & Display Technology
• /
• v.18 no.2
• /
• pp.82-86
• /
• 2019

The reliability of 3D NAND flash memory cell is affected by the charge migration which can be divided into the vertical migration and the lateral migration. To clarify the difference of two migrations, the activation energy of the charge loss is extracted and compared in a conventional square device pattern and a new test pattern where the perimeter of the gate is exaggerated but the area is same. The charge loss is larger in the suggested test pattern and the activation energy is extracted to be 0.058 eV while the activation energy is 0.28 eV in the square pattern.

• Journal of Applied Reliability
• /
• v.16 no.3
• /
• pp.202-207
• /
• 2016

Purpose: The purpose of this study is main factors (environmental conditions, pattern spacing, pattern material) that effect the ion-migration of PCB. Methods: Recently, the electronic components are becoming more high density of electronic device, so that electronic circuits have smaller pitches between the patten and more vulnerable to insulation failure. so the reliability of electric insulation of device has become an ever important issue as device contact pitches of pattern. Usually, ion-migration occurs in high temperature and high humidity environment as voltage is applied to the circuit. Under high temperature and high humidity, voltage applied electronic components respond to applied voltages by metals's electrochemical ionization and a conducting filament forms between the anode and cathode across a nonmetallic medium. This leads to short-circuit failure of the electronic component. Results: we studied ion-migration that occurs in accordance with the main factors (environmental conditions, pitches, pattern material). The PCB pattern material was made by two different types of material (free solder, OSP) for this research and pitches of pattern is 0.15mm, 0.3mm, 0.5mm. PCB was experimented in the environmental conditions (high temperature $120^{\circ}C$, high temperature and high humidity $85^{\circ}C$, 85%RH) and was analyzed for ion-migration through the experiment results. Conclusion: We confirmed that environmental condition, pitches of pattern, pattern material had effect on ion-migration of PCB.

• Proceedings of the KWS Conference
• /
• 2006.10a
• /
• pp.136-138
• /
• 2006

Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. Ion migration phenomena has been observed in the field of exposing the specific environment and using for a long time. Also as the RoHS restriction was started in July 1st, 2006, Pb-free solder was utilized in electronics assemblies. In this case, it is very important to compatible between components and printed circuit board(PCB), thus surface treatment materials of PCB was changed to Sn, Sn-3.0Ag-0.5Cu, Cu. Therefore these new application become to need to reevaluate the sensitivity about electrochemical ion migration. This study was evaluated the occurrence time of electrochemical ion migration using by water drop test. We utilized PCB(printed circuit board) having a comb pattern as follows 0.1, 0.318, 0.5, 1.0 mm pattern distance. Sn-3.0Ag-0.5Cu and Sn-37Pb were electroplated on the comb pattern. 6.5V and 15.0V were applied in the comb pattern and then we measured the electrical short time causing by occurring the ion migration. In these results, we evaluate the sensitivity and derived the prediction models of ion migration occurrence time depending on the pattern materials, applied voltage and pattern spacing of PCB conductor.

• Journal of Ecology and Environment
• /
• v.44 no.3
• /
• pp.185-195
• /
• 2020

Background: The flathead grey mullet Mugil cephalus has the widest distribution among mugilid species. Recent studies based on mitochondrial DNA sequences showed that the species comprises at least 14 different groups, three of which occur in the northwest Pacific. We analyzed the otolith microchemistry of M. cephalus at several locations in Korea to improve understanding of migration pattern and population origin. Results: We collected 123 sagittal otoliths from seven locations and determined their concentrations of eight elements (⁷Li, ²⁴Mg, ⁵⁵Mn, ⁵⁷Fe, ⁶⁰Ni, ⁶³Cu, ⁸⁸Sr, and ¹³⁸Ba) using laser ablation inductively coupled plasma mass spectrometry. Mean otolith elemental ratios differed significantly among the locations. The Sr:Ca, Fe:Ca, and Ba:Ca ratios were significantly higher than others, and useful chemical signatures for investigating the habitat use of M. cephalus populations. We identified five diverse and complicated migration patterns using the otolith data that we collected: estuarine resident (type I), freshwater migrant (type II), estuarine migrant (type III), seawater resident (type IV), and seawater migrant (type V). A canonical discriminant analysis plot revealed separation of two groups (type II in the Yellow Sea vs. other types in remaining locations). Two locations on Jeju Island, despite their close proximity, had fish with quite different migration patterns, corroborating previous molecular studies that distinguished two groups of fishes. Conclusion: We successfully showed that the migration patterns of the Korean mullet varied by location. Only fish from the western sector of Jeju had a unique migration pattern, which is likely confined population in this area. Among the eight otolith elements measured, the Sr:Ca ratio was found to be the best indicator of migration pattern and population origin.

• Journal of Korean Society of Rural Planning
• /
• v.23 no.2
• /
• pp.67-74
• /
• 2017

Migration is defined as the movement of people between residential places, and represents interactions between regions. Changes in migration involve changes in both the number of migrants toward/from regions and migration patterns across regions. However, most migration studies have focused only on the change in migrants, while no empirical study captures changes in migration patterns. In this paper, I present a function using the cosine similarity to measure changes in migration patterns, and apply it to 2001-2016 migration data of Korea. The results show that the migration patterns of Korea shifted in 2007, resulting in two distinct clusters. Local areas experienced various migration pattern changes despite few changes in the number of migrants.

• Journal of Korean Society of Rural Planning
• /
• v.22 no.1
• /
• pp.49-56
• /
• 2016

Throughout the economic development era of Korea, migration occurred within a spatial hierarchy, with upward flows from rural areas to urban. The concept of step migration is a typical theory to explain these upward migration flows. Recent migration data and trends, however, indicate that migration-pattern regime shows strongly opposite-direction flows, with many of the major migration flowing downward on this national-spatial hierarchy, away from urban areas. In this study, we examine the most recent structure of migration flows up and down within the national-spatial hierarchy. We define seven tiers to tabulate origin-destination migration flows from population density of local administrative districts for the period 2001-2014, and then analyze the migration patterns between the tiers over time. The results show differentiated patterns of migration within the national-spatial hierarchy over time including specific states of migrants' life cycles.

• ALGAE
• /
• v.17 no.1
• /
• pp.1-9
• /
• 2002

Diel vertical distribution of phytoflagellates and interactions between the phytoplankton components and environmental and biological factors were studied in a small artificial pond for three days on the December 18, 1998 and April 9 to 10, 1999. The phytoplankton population was dominated by Mallomonas akrokomos of chrysophytes and Cryptomonas marssonii and Chroomonas sp. of cryptophytes. The vertical distribution of these phytoflagellates taxa exhibited clear diel migration pattern. Moreover their migration patterns are showed differential fluctuation between M. akrokomos, C. marssonii and Chroomonas sp. The later two species upward migrated in the evening as well as night, whereas the former species migrated downward. Their distinctive migration pattern was found during the night but was not observed in the morning. During daytime C. marssonii and Chroomonas sp. showed maximum density above 2 m depth but M. akrokomos below 2 m depth. The diel vertical distribution of the dominant phytoflagellates did not show significant correlation between physical, chemical and biotic factors.

• International Area Studies Review
• /
• v.21 no.4
• /
• pp.125-139
• /
• 2017

This study analyzes the determinants and patterns of regional migration in Myanmar. Population migration is affected by various factors such as economic and social factors as well as regional characteristics. It is affected by factors such as income, employment and social overhead capital. Therefore, this study attempts to analyze the following two research problems. First, I would like to analyze whether the reform and opening of Myanmar is causing the migration of rural to urban population. Myanmar is also trying to verify the pattern of population migration experienced by other developing countries. Second, we analyze the impact of social overhead capital on population migration in Myanmar. We analyze the impact of basic infrastructure such as roads, electricity and water on population movements. This will give implications for investment policy decision of social overhead capital for balanced regional development. First, the pattern of population migration in Myanmar is shifting from rural to urban areas, as other developing countries have experienced. Myanmar's urban areas of Yangon and Mandalay have been analyzed as having migration. Second, the expansion of social overhead capital was found to have an impact. Social overhead capital such as roads and educational environments were analyzed to have the capacity to inhale the population. Especially, the educational environment of the region has a great effect on population migration. It is analyzed that education reform is an important policy issue for the balanced regional development of Myanmar. Fourth, employment opportunities were analyzed to have the greatest impact on Myanmar population movements. In the early stage of economic development, it is analyzed that the population moves to a region where employment opportunity is high in the situation where foreign capital is coming in. It is analyzed that the direction of inflow of foreign capital and the imbalance of development in the region will be determined in the situation where the economic development is carried out through foreign capital.

• Journal of the Korean institute of surface engineering
• /
• v.47 no.2
• /
• pp.63-67
• /
• 2014

As the demand for fine-pitch FPCB (Flexible Printed Circuit Board) increases, so do the number of applications of sputtered FCCL (Flexible Copper Clad Laminate). Furthermore, as the width between the circuit patterns decreases, greater defects are observed in the migration phenomenon. In this study we observed changes in ion migration in real circuit-pattern width using sputtered FCCL. We found that as the applied voltage and residue thickness of the NiCr seeds increase, ion migration occurs faster. If the NiCr seed layer thickens due to a high cathode power and long deposition time while being sputtered, the NiCr will form a residue that quickly becomes a factor for incurring ion migration.