• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.2004-2006
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• 1996

A thermally driven polysilicon micro actuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS (tetracthylorthosilicate) as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And the newly developed HF VPE (vapor phase etching) process was also used as an effective release method for the elimination of sacrificial TEOS layer. The thickneas of polysilicon is $2{\mu}m$ and the lengths of active and passive polysilicon cantilevers are $500{\mu}m$ and $260{\mu}m$, respectively. The actuation is incurred by die thermal expansion due to the current flow in the active polysilicon cantilever, which motion is amplified by lever mechanism. The moving distance of polysilicon micro actuator was experimentally conformed as large as $21{\mu}m$ at the input voltage level of 10V and 50Hz square wave. The actuating characteristics are investigated by simulating the phenomena of heat transfer and thermal expansion in the polysilicon layer. The displacement of actuator is analyzed to be proportional to the square of input voltage. These micro actuator technology can be utilized for the fabrication of MEMS (microelectromechanical system) such as micro relay, which requires large displacement or contact force but relatively slow response.

• Journal of Sensor Science and Technology
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• v.8 no.4
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• pp.320-326
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• 1999

A small cartridge, with a nozzle system for washing off the dirt from the surfaces of sensing gates, was fabricated. The proposed nozzle structure was designed for cartridge by using the simulation tool of fluid (CFD-ACE). Whole size of the fabricated cartridge by using micromachining techniques is about $2.6\;cm{\times}1.5\;cm$, the size of the washing nozzle is $0.2\;mm{\times}0.6\;mm$ and its dead volume is only about $20\;{\mu}l$. A micro-reference electrode was achieved by employing a differential system with ISFETs/QRE (quasi-reference electrode)/REFET (reference field-effect transistor). Metal electrodes was deposited at both ends of blowing channel were used to check the presence of bubble in the microchannel. The pH-ISFET was inserted into the fabricated cartridge and the washing effect of the nozzle system in cartridge was invested.

• Journal of Sensor Science and Technology
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• v.9 no.5
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• pp.380-388
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• 2000

The finite element analysis of a micro turbine was made to investigate safety margin of its operating condition for the high aspect ratio nickel micro turbine blades fabricated by conventional LIGA-like method. From our study, we found that the fabricated turbine could not exceed its yield strength even if the pressure difference between inlet and outlet of turbine blade was about 44kPa, and the correlation of friction coefficient and the maximum stress, caused by contact friction between outer diameter of shaft and inner diameter of turbine blade, was somewhat reciprocal. The maximum stress was decreased with the increasing contact friction, when turbine blade was in its state of rotation. By the results of our study, we conclude that it is possible to fabricate metal micro turbine more easily han surface micromachining technology and to operate with no risk of metal structure's damage, which is caused by yield strength, if the operating condition with the design of micro turbine itself are optimized. It is useful to adopt other applications which have the contact problems between a moving part and the fixed one in micro structures.

• Laser Solutions
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• v.11 no.4
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• pp.29-34
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• 2008

Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-density, multi-layer, and multi material components is in a strong demand. Due to the ever-decreasing size of electronic products such as cellular phones, MP3 players, digital cameras, etc., flexible printed circuit board (FPCB), multi-layered with polymers and metals, tends to be thicker. In present, multi-layered FPCBs are being mechanically cut with a punching die. The mechanical cutting of FPCBs causes such defects as burr on layer edges, cracks in terminals, delamination and chipping of layers. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PI and FCCL, which are base materials of FPCB, was carried out using a pico-second laser(355nm, 532nm) and nano-second UV laser with adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Points which special attention should be paid are that a fast scanning speed, low repetition rate and high peak power are required for precision machining.

• Laser Solutions
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• v.17 no.1
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• pp.1-6
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• 2014

Indium tin oxide (ITO) is an important transparent conducting oxide (TCO). ITO films have been widely used as transparent electrodes in optoelectronic devices such as organic light-emitting devices (OLED) because of their high electrical conductivity and high transmission in the visible wavelength. Finding ways to control ITO micromachining depth is important role in the fabrication and assembly of display field. This study presented the depth control of ITO patterns on glass substrate using a femtosecond laser and slit. In the proposed approach, a gaussian beam was transformed into a quasi-flat top beam by slit. In addition, pattern of square type shaped by slit were fabricated on the surfaces of ITO films using femtosecond laser pulse irradiation, under 1030nm, single pulse. Using femtosecond laser and slit, we selectively controlled forming depth and removed the ITO thin films with thickness 145nm on glass substrates. In particular, we studied the effect of pulse number on the ablation of ITO. Clean removal of the ITO layer was observed when the 6 pulse number at $2.8TW/cm^2$. Furthermore, the morphologies and fabricated depth were characterized using a optical microscope, atomic force microscope (AFM), and energy dispersive X-ray spectroscopy (EDS).

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.12
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• pp.1292-1299
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• 2003

In this paper, we fabricated new GaAs-based dielectric-supported air gapped microstriplines(DAMLs) using the surface MEMS and the LPF for Ka-band using the fabricated DAMLs. We elevated the signal lines from the substrate, in order to reduce the substrate dielectric loss and obtain low losses at millimeter-wave frequency band with wide impedance range. We fabricated LPF with DAMLs for Ka-band. Due to reducing the dielectric loss of DAMLs, the insertion loss of LPF can be reduced. Miniature is essential to integrate LPF with active devices, so that we fabricated LPF with the slot on the ground to reduce the size of the LPF. We compared a characteristic to LPF with the slot and LPF without the slot.

• Korean Journal of Optics and Photonics
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• v.27 no.4
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• pp.127-132
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• 2016

In this paper, a trench structure was fabricated by femtosecond-laser machining to eliminate thermal crosstalk in a multichannel variable optical attenuator (VOA), to prevent decreasing attenuation efficiency of the VOA. Trenches of a variety of widths and depths were fabricated on the VOA chips by femtosecond-laser processing. After the machining, attenuation according to current change was observed in each VOA chip module with trenches. As a result, we could observe high responsivity of attenuation and low power consumption, and that the heat of each channel barely influenced other channels.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.109-110
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• 2006

In bio applications, high temperature coefficient of resistance (TCR) at $30^{\circ}C{\sim}40^{\circ}C$ is especially important for a temperature sensor. In this work, single phase-vanadium dioxide ($VO_2$) thin films for temperature sensor were fabricated by reactive DC magnetron sputtering and post-annealing method. VOx thin films deposited by reactive sputtering in a controlled $Ar/O_2$ atmosphere can be transformed into single phase-$VO_2$ films by post-annealing in $N_2$ atmosphere. The grown $VO_2$ thin films have a moderate resistance at room temperature and very high TCR at room temperature and transition temperature, respectively 2.88%/K and 15.8%/K. A detailed structural characterization is performed by SEM, XRD and RBS. SEM morphology image indicates that grains of fabricated $VO_2$films are homogeneous and ball-like in shape. A fact that the films contain only single phase-$VO_2$ is obtained by XRD and RBS analysis. After deposition, the sensors were fabricated by micromachining technology. Silicon nitride membrane and black nickel were used for a thermal isolation structure and absorption layer. In the vicinity of room temperature, the TCR of sensors was enough high to apply for bio sensors.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.1
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• pp.1-6
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• 2009

Air core based transformers have been designed, simulated and fabricated by using micromachining process for the application of wireless power transmission with the range of frequency from 1 GHz to 20 GHz. Fabricated transformers are the types of solenoid transformers with primary and secondary coils. the size of fabricated transformer is $1.1{\times}1.5{\sim}2.15\;mm$ including ground shield. Transformers have been measured by dividing two groups based on the turns ratio between primary coil and secondary coil which are 1:1 transformers(the number of turns of primary coil and secondary coil: 3/3, 5/5, 7/7) and l:n transformers(the number of turns of primary coil and secondary coil: 3/3, 3/6, 3/9). As a result of the measurement, the lowest insertion loss of transformers ranged from 2 dB to 2.8 dB according to the number of turns between primary coil and secondary coil. And the lowest insertion loss from the transformers was measured at the frequency from 7 GHz to 11 GHz according to the number of turns between primary coil and secondary coil. Based on the measurement data from the microfabricated transformers, the transformer with the 3/3 turns in the primary coil and secondary coil showed best performance compared to others in terms of lowest insertion loss, lowest insertion loss frequency and bandwidth.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.11
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• pp.1765-1771
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• 2010

In the case of micro.electro-mechanical system (MEMS) devices, the quality of punched via hole is one of the most important factors governing the performance of the device. The common features that affect the laser micromachining of via holes drilled by using Nd:$YVO_4$ laser are described, and efficient optimization methods to measure them are presented. The analysis methods involving an orthogonal array, analysis of variance (ANOVA), and response surface optimization are employed to determine the main effects and to determine the optimal laser process parameters. The significant laser process parameters were identified and their effects on the quality of via holes were studied. Finally, an experiment in which the optimal levels of the laser process parameters were used was carried out to demonstrate the effectiveness of the optimization method.