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http://dx.doi.org/10.3807/KJOP.2016.27.4.127

Femtosecond-Laser Micromachining of a Thermal Blocking Trench for an Enhanced PLC Variable Optical Attenuator  

Yoo, Dongyoon (Advanced Photonics Research Institute, Gwangju Institute of Science and Technology)
Choi, Hun-Kook (Advanced Photonics Research Institute, Gwangju Institute of Science and Technology)
Sohn, Ik-Bu (Advanced Photonics Research Institute, Gwangju Institute of Science and Technology)
Kim, Youngsic (Interdisciplinary Program for Photonic Engineering, Chonnam national university)
Kim, Suyong (Interdisciplinary Program for Photonic Engineering, Chonnam national university)
Kim, Wanchun (Interdisciplinary Program for Photonic Engineering, Chonnam national university)
Kim, Jinbong (Interdisciplinary Program for Photonic Engineering, Chonnam national university)
Publication Information
Korean Journal of Optics and Photonics / v.27, no.4, 2016 , pp. 127-132 More about this Journal
Abstract
In this paper, a trench structure was fabricated by femtosecond-laser machining to eliminate thermal crosstalk in a multichannel variable optical attenuator (VOA), to prevent decreasing attenuation efficiency of the VOA. Trenches of a variety of widths and depths were fabricated on the VOA chips by femtosecond-laser processing. After the machining, attenuation according to current change was observed in each VOA chip module with trenches. As a result, we could observe high responsivity of attenuation and low power consumption, and that the heat of each channel barely influenced other channels.
Keywords
Variable optical attenuator; Trench; Femtosecond laser; Laser machining;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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