Transactions of the Korean Society of Mechanical Engineers A (대한기계학회논문집A)

The Korean Society of Mechanical Engineers (대한기계학회)
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Optimization of Laser Process Parameters for Realizing Optimal Via Holes for MEMS Devices

MEMS 소자의 비아 홀에 대한 레이저 공정변수의 최적화

  • Received : 2010.06.07
  • Accepted : 2010.08.27
  • Published : 2010.11.01
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Abstract

In the case of micro.electro-mechanical system (MEMS) devices, the quality of punched via hole is one of the most important factors governing the performance of the device. The common features that affect the laser micromachining of via holes drilled by using Nd:$YVO_4$ laser are described, and efficient optimization methods to measure them are presented. The analysis methods involving an orthogonal array, analysis of variance (ANOVA), and response surface optimization are employed to determine the main effects and to determine the optimal laser process parameters. The significant laser process parameters were identified and their effects on the quality of via holes were studied. Finally, an experiment in which the optimal levels of the laser process parameters were used was carried out to demonstrate the effectiveness of the optimization method.

MEMS 소자의 공정에서 가공된 비아 홀 품질은 소자의 성능에 가장 중요한 요소의 하나이다. Nd:$YVO_4$ 레이저로 가공한 비아 홀에 대한 레이저 미세가공의 일반적인 특징을 설명하고 그것의 측정에 대한 효율적인 최적화 방법을 소개한다. 본 논문의 최적화 방법은 직교다항식, 분산분석과 반응표면최적화는 최적 레이저 공정변수를 결정하고 주요 영향을 이해하는데 사용된다. 유의한 레이저 공정변수를 확인하고 이의 비아 홀 품질에 관한 영향을 고찰하였다. 레이저 공정변수의 최적 수준을 가지는 확인 실험은 최적화 방법의 유효성을 설명하기 위해 수행하였다.

Keywords

References

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