• Journal of Welding and Joining
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• v.29 no.6
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• pp.49-55
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• 2011

With the development of pre-painted steel sheets for automotive body application, a new joining method is required such as hybrid joining with combination of adhesive bonding and mechanical joining. The objective of this study is to investigate the effect of pre- and post-baking of adhesive bonding on failure mode and strength of hybrid joining of automotive steel sheets. Experiments show that the hybrid joining exhibits better bonding strength and displacement than conventional adhesive joining and mechanical fastening each. Comparison of pre- and post-baked hybrid joining results suggested that baking at $160^{\circ}C$ after mechanical joining was found to have higher joining properties than pre-baking condition. The prebaking condition changed its fracture mode from interfacial to button fracture. The changes in fracture mode with post-baking of hybrid joining was attributed to variation in neck thickness and undercut of joint.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.387-390
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for 2 inch SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECVD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using IR camera and SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of $5.3 kgf/cm^2$ to $15.5 kgf/cm^2$

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.883-888
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECYD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of 5.3 kgf/cm$^2$to 15.5 kgf/cm$^2$.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.27 no.2
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• pp.87-93
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• 2015

Recently, the heat exchangers are requiring higher performance and reliability since they are being used under the operating condition of high temperature and pressure. To satisfy these requirements, we need special materials and bonding technology. This study presents a manufacturing technology for high temperature and high pressure micro channel heat exchanger using Inconel 617. The bonding performance for diffusion bonded heat exchanger was examined and analyzed. The analysis were conducted by measuring thermal and mechanical properties such as thermal diffusivity and tensile strength, and parametric studies about bonding temperature and pressing force were also carried out. The results provided insight for bonding evaluation and the bonding condition of $1200^{\circ}C$, and 50 tons was found to be suitable for this heat exchanger. From the results, we were able to establish the base technology for the manufacturing of Inconel 617 heat exchanger through the application of the diffusion bonding.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

• Restorative Dentistry and Endodontics
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• v.28 no.3
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• pp.203-208
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• 2003

The purpose of this study was to evaluate the effect of salivary contamination of teeth on bonding efficacy of self-priming and self-etching DBSs. The materials used were Single Bond(SB, self-priming system, 3M), Unifil Bond(UB, self-etching system, GC), and Scotchbond Multi-Purpose Plus(SM, 3M) as control. Forty five human molars randomly allocated to three groups as dentin bonding systems tested and embedded in epoxy resin. Then the specimens were wet-ground to expose flat buccal enamel surface or flat occlusal dentin surface and cut bucco-lingually to form two halves with slow speed diamond saw. One of them was used under non-contamination, other under contamination with saliva. The bonding procedure was according to the manufacturer's directions and resin composite(Z-100, 3M Dental Products, St. Paul, MN) was built-up on the bonded surface 5mm high. The specimens were ground carefully at the enamel-composite interface with fine finishing round diamond bur to create an hour-glass shape yielding bonded surface areas of $1.5{\pm}0.1\textrm{mm}^2$. The specimens were bonded to the modified microtensile testing apparatus with cyanoacrylate, attached to the universal testing machine and stressed in tension at a CHS of 1mm/min. The tensile force at failure was recorded and converted to a tensile stress(MPa). Mean values and standard deviations of the bond strength are listed in table. One-way ANOVA was used to determine significant difference at the 95% level. The bond strength of SBMP and SB were not affected by salivary contamination, but that of UB was significantly affected by salivary contamination. These results indicate that DBSs with total etch technique seems less likely affected by salivary contamination in bonding procedure.

• Journal of Oral Medicine and Pain
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• v.31 no.3
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• pp.211-221
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• 2006

Purpose The aims of this study were to evaluate micro-tensile bond strength of composite resin bonded to dentin following high-speed rotary handpiece preparation or Er:YAG laser preparation with two different adhesive systems and to assess the influence of different Er:YAG laser energies on the micro-tensile bond strength. Materials and Methods In this study, 40 third morlars were used. Flat dentin specimans were obtained and randomly assigned to eight groups. Dentin surfaces were prepared with one of four cutting types: carbide bur, Er:YAG laser (2 W, 3 W and 4 W) and conditioned with two bonding systems, Scotchbond Multipurpose Plus (SM), Clearfil SE bond (SE) and composite resin-build ups were created. After storage for 24 hours, each specimen was serially sectioned perpendicular to the bonded surface to produce more than thirty slabs in each group. Micro-tensile bond strength test was performed at a crosshead speed of 1.0 mm/min. Micro-tensile bond strengths (${\mu}TBS$) were expressed as means$\pm$SD. Data were submitted to statistical analysis using two-way ANOVA, one-way ANOVA, Student-Newman-Keuls' multiple comparison test and t-test. Results and Conclusion 1. Regardless of bonding systems, the ${\mu}TBS$ according to cutting types were from highest to lowest : 3 W, 2 W, Bur, and 4 W. In addition, there was no significant difference between Bur and 4 W (p<0.001). 2. Regardless of cutting types, SM showed significantly higher ${\mu}TBS$ than SE (p<0.001). 3. Bonding to dentin conditioned with SM resulted in higher ${\mu}TBS$ for 3 W compared to Bur, 2 W, and 4 W. There was no significant difference between 2 W and Bur (p<0.001). 4. Bonding to dentin conditioned with SE resulted in higher ${\mu}TBS$ for 3 W compared to 2 W, 4 W, and Bur. Bur exhibited significant lower ${\mu}TBS$ than all other cutting types. There were no significant differences between 3 W, 2 W and between 4 W and Bur (p<0.001). 5. The ${\mu}TBS$ of laser cutting groups were shown in order from highest to lowest: 3 W, 2 W and 4 W in two bonding systems. There was no significant difference between 2 W and 3 W in SE (p<0.001). : The ${\mu}TBS$ of composite resin bonded dentin was significantly affected by interaction between the cutting type and bonding system. In the range of 2 W-3 W, cavity preparation of the Er:YAG laser seems to supply good adhesion of composite resin restoration no less than bur preparation. In particular, if you want to use the self-etching system, including Clearfil SE bond for the purpose of a simplification of the bonding procedures and prevention of adverse effects by excessive etching, an Er:YAG laser may offer better adhesion than a bur.

• Proceedings of the KACD Conference
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• 2002.11a
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• pp.706-706
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• 2002

No Abstract, See Full Text

• Advances in concrete construction
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• v.13 no.3
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• pp.265-279
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• 2022

The roughness of substrate concrete interfaces before new concrete placement has a major effect on the interface bond behaviour. However, there are challenges associated with the consistency of the final roughness interface prepared using conventional roughness preparation methods which influences the interface bond performance. In this study, five quantitative interface roughness textures with different roughness tooth angles, depths, and tooth distribution were created to ensure consistency of interface roughness and to evaluate the bond behaviour at a precast and new concrete interface using the splitting tensile test, slant shear test, and double-shear test. In addition, smooth interface specimens and two separate the pitting interface roughness were also utilized. Obtained results indicate that the quantitative roughness has a very limited effect on the interface tensile bond strength if no extra micro-roughness or bonding agent is added at the interface. The roughness method however causes enhanced shear bond strength at the interface. Increased tooth depth improved both the tensile and shear bond strength of the interfaces, while the tooth distribution mainly influenced the shear bond strength. Major failure modes of the test specimens include interface failure, splitting cracks, and sliding failure, and are influenced by the tooth depth and tooth distribution. Furthermore, the interface properties were obtained and presented while a comparison between the different testing methods, in terms of bond strength, was performed.

• Journal of Korea Foundry Society
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• v.15 no.2
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• pp.138-145
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• 1995

The mechanical properties of $Al/Al_2O_3$ composites have been investigated in relation with manufacturing factors such as applied pressure of casting and binder amount of preform. It was found that tensile strength increases with an increase of applied pressure, but decreases with binder amount. Increase of tensile strength is attributable to refinement of microstructure, improvement of intefacial bonding between $Al_2O_3$ short fiber and matrix, decrease of porosity in the matrix. Due to the high thermal stability of alumina short fiber, tensile strength of composites at $150^{\circ}C$ was superior to matrix alloy at room temperature. To evaluate the strength of composites, modified Kelly-Tyson's equation was introduced. Manufacturing factor M was obtained calculating from experimental data. M values were increased with applied pressure, but decreased with binder amount. The initiation of microcrack appeared to be at interface and reinforcement colony. Amount of micro-dimple was increased with applied pressure, and interfacial debonding phenomenon was remarkable with an increase of binder amount.