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http://dx.doi.org/10.6110/KJACR.2015.27.2.087

A Study of Diffusion Bonding Process for High Temperature and High Pressure Micro Channel Heat Exchanger Using Inconel 617  

Song, Chan Ho (Department of Extreme Thermal Systems, Korea Institute of Machinery and Materials)
Yoon, Seok Ho (Department of Extreme Thermal Systems, Korea Institute of Machinery and Materials)
Choi, Joon Seok (Department of Extreme Thermal Systems, Korea Institute of Machinery and Materials)
Publication Information
Korean Journal of Air-Conditioning and Refrigeration Engineering / v.27, no.2, 2015 , pp. 87-93 More about this Journal
Abstract
Recently, the heat exchangers are requiring higher performance and reliability since they are being used under the operating condition of high temperature and pressure. To satisfy these requirements, we need special materials and bonding technology. This study presents a manufacturing technology for high temperature and high pressure micro channel heat exchanger using Inconel 617. The bonding performance for diffusion bonded heat exchanger was examined and analyzed. The analysis were conducted by measuring thermal and mechanical properties such as thermal diffusivity and tensile strength, and parametric studies about bonding temperature and pressing force were also carried out. The results provided insight for bonding evaluation and the bonding condition of $1200^{\circ}C$, and 50 tons was found to be suitable for this heat exchanger. From the results, we were able to establish the base technology for the manufacturing of Inconel 617 heat exchanger through the application of the diffusion bonding.
Keywords
Micro channel heat exchanger; PCHE; Inconel 617; Diffusion bonding; Thermal diffusivity;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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