• Journal of the korean academy of Pediatric Dentistry
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• v.29 no.3
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• pp.389-396
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• 2002

The purpose of this study was to compare the microtensile bonding strength of chemomechanically excavated dentin($Carisolv^{TM}$) to conventional caries removal(bur). The following adhesive systems were used; AB: All-Bond 2(3M, USA), PB: Prime & Bond 2.1(Dentsply, DE), AQ: AQ Bond(sun medical, Japan). 42 human molars with occlusal caries were assigned to 6 groups. Sequential caries removal was controlled with laser fluorescence. Each group was devided as follows; group A, B, C were $Carisolv^{TM}$ applied, group D,E,F were bur used. In group A and D, AB was used as a dentin adhesive. group B,E and group C,F was AQ and AQ was used each. The cavity was filled with composite resin(Z-100). The specimens were sectioned vertically into multiple serial 0.7 mm thick slabs. And then those slabs were sectioned into rectangular parts under 0.7 mm width. Finally 0.7-1.0 mm a right hexahedron shape stick become. Microtensile bonding test was carried out with testing apparatus at cross-head speed of $0.5\;mm/min^{-1}$ and fractured surfaces were observed with scanning electron microscope(JSM-6400, Jeol, Japan). The obtained results were summarized as follows ; 1. In the group of caries removal with $Carisolv^{TM}$, micro-tensile bonding strength decreased to $75.8{\sim}80$ percent of bur used group. 2. In the group of caries removal with $Carisolv^{TM}$, decreased degree of micro-tensile bonding strength is not so different in 3 kinds of dentin adhesives(p<0.05). 3. In the group of caries removal with $Carisolv^{TM}$, microtensile bonding strength of AB, PB, AQ was 32.6MPa(2.4), 30.1Mpa (1.8), 21.2Mpa(1.9). 4. In the group of caries removal with Bur and $Carisolv^{TM}$, microtensile bonding strength of AQ was significantly lower than that of AB and PB(p<0.01).

• The Journal of Advanced Prosthodontics
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• v.12 no.4
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• pp.189-196
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• 2020

PURPOSE. The aim of the present study was to investigate the effects of surface treatments on the bond strengths between polymer-containing restorative materials and two dual-cure resin cements. MATERIALS AND METHODS. In the present study, rectangular samples prepared from Lava Ultimate (LU) and Vita Enamic (VE) blocks were used. The specimen surfaces were treated using CoJet sandblasting, 50 ㎛ Al₂O₃ sandblasting, % 9 HF (hydrofluoric) acid, ER,Cr:YSGG laser treatment, and Z-Prime. Dual-cure resin cements (TheraCem and 3M RelyX U 200) were applied on each specimen's treated surface. A micro-tensile device was used to evaluate shear bond strength. Statistical analysis was performed using the SAS 9.4v3. RESULTS. While the bond strength using TheraCem with LU or VE was not statistically significant (P=.164), the bond strength using U200 with VE was statistically significant (P=.006). In the TheraCem applied VE groups, Z-Prime and HF acid were statistically different from CoJet, Laser, and Sandblast groups. In comparison of TheraCem used LU group, there was a statistically significant difference between HF acid and other surface treatments. CONCLUSION. The bonding performance between the restorative materials and cements were material type-dependent and surface treatment had a large effect on the bond strength. Within the limitations of the study, the use of both U200 and TheraCem may be suggested if Z-prime was applied to intaglio surfaces of VE. The cementation of LU using TheraCem is suitable after HF acid conditioning of the restoration surfaces.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.2
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• pp.25-30
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• 2015

This study involved the fabrication of precision machine tools using a polycrystalline diamond tip [sintered PCD and cemented carbide (WC-Co) tip] and WC-Co shanks via diffusion bonding with a paste-type nickel alloy filler metal. Diffusion bonding is a process whereby two materials are pressed together at high temperature and high pressure for a sufficient period of time to allow significant atomic diffusion to occur. For smooth progress, a filler metal of nickel alloy was used at the interface. Optical microscopy images were used to observe the copula of the bonded layer. It was confirmed that cracks occurred near the junction in all cases. The tensile strength of the bond was measured using a universal testing machine (UTM) with WC-Co proportional test specimens.

• Journal of Oral Medicine and Pain
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• v.30 no.2
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• pp.269-276
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• 2005

This in vitro study evaluated the influence of a flowable composite resin on the tensile bond strength of resin to enamel and dentin treated with Er:YAG laser and diamond bur. 96 Buccal enamel and mid-coronal dentin were laser-irradiated using an Er:YAG laser and treated with diamond bur. Each groups(48) were divided two small groups depends on acid-etching procedure. Light-cure flowable resin(Metafil Flo) and self-cure resin(Clearfil FII New Bond) were used in this study. After surface etching with 37% phosphoric acid and the application of an adhesive system, specimens were prepared with a hybrid composite resin. After 24hours storage in distilled water at 37$^{\circ}C$, all samples were submitted to the tensile bond strength evaluation, using a universal testing machine(Z020, Zwick, Germany). The obtained results were as follows: 1. TBS of acid-etching group were higher than those of non-etching group in both enamel and dentin treated with Er:YAG laser and diamond bur. Laser 'conditioning' was clearly less effective than acid-etching. Moreover, acid etching lased enamel and dentin significantly improved the microTBS of M-Flo. 2. In enamel, TBS of laser-irradiated group were lower than those of bur-prepared group. However, in flowable resin subgroup, there were not differed those between two groups in dentin. 3. In laser-treated group, TBS of flowable composite resin were higher than those of self-curing resin in dentin, however, there was no difference in enamel. From this study, we can conclude that the self- and light-cure composite resin bonded significantly less effective to lased than to bur-cut enamel and dentin, and that acid-etch procedure remains mandatory even after laser ablation. We suggest that Er:YAG laser was useful for preparing dentin cavity with flowable resin filling.

• Transactions of the Korean Society of Mechanical Engineers
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• v.7 no.3
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• pp.263-269
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• 1983

Underwater welding by a gravity arc welding process was investigated by using six types of coated electrodes and SM41A steel plates of 10 mm thickness as base metal and it was ascertained that this process may be put to practical use. Main results obtained are summarized as follows: 1. Angle of electrode affects no influence on bead appearance and the proper range of welding current and diameter of electrode for the high titanium oxide type is relatively wider than that for the ilmenite type. And the lime titania type, high titanium oxide type and ilmenite type of domestic coated arc welding electrodes of .phi.4 mm could attain the soundest underwater welded joints which contain no welding imperfection. 2. According to macro-structure, micro-structure and hardness distribution inspectionson underwater welded joint, the area between the HAZ and the surface of the weld in neighbourhood of the bond has the maximum hardness value. The structure of these parts is martensite and bainite. Other parts contain mocro-ferrite, micro-pearlite structure, which contain soundness of welded joint free from weld imperfection. 3. On consideration of both tensile strength of more than 100% joint efficiency and sufficient impact value, the welding condition which can get optimal welding strength is heat input of 1,400-1,500 J/mm, current of 200-215 ampere (voltage of 32-33 volts) in the case of lime titania type electrode. 4. Underwater welding strength (tensile strength, impact strength) depends on heat input (or current) quantitatively and they have the relationship of parabolic function. Each experimental equation has a high reliability and its percent of mean error is 4.14%. 5. It is suggested that the optimal design of weld strength by welding condition (current, heat input) could be utilized for a quality control of underwater welding.

• Restorative Dentistry and Endodontics
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• v.32 no.1
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• pp.9-18
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• 2007

The purposes of this study were to examine the variability of adhesive thickness on the different site of the cavity wall when used total-etch system without filler and simplified self-etch system with filler and to evaluate the relationship between variable adhesive thickness and microtensile bond strength to the cavity wall. A class I cavity in six human molars was prepared to expose all dentinal walls. Three teeth were bonded with a filled adhesive, $Clearfil^{TM}$ SE bond ana the other three teeth were bonded with unfilled adhesives, $Scotchbond^{TM}$ Multi Purpose. Morphology and thickness of adhesive layer were examined using fluorescence microscope. Bonding agent thickness was measured at three points along the axial cavity wall edge of cavity margin (rim). halfway down each cavity wall (h1f), internal angle of the cavity (ang). After reproducing the adhesive thickness at rim, h1f and ang, micro-tensile bond strength were evaluated. For both bonding agents, adhesive thickness of ang was significantly thicker than that of rim and h1f (P <0.05). As reproduced the adhesive thickness, microtensile bond strength was increased as adhesive thickness was increased in two bonding agents. Adhesive thickness of internal angle of the cavity was significantly thicker than that of the cavity margin and the halfway cavity wall for both bonding agents. Microtensile bond strength of the thick adhesive layer at the internal angle of the cavity was higher than that of the thin adhesive layer at 1,he cavity margin and the halfway cavity in the two bonding systems.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.3
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• pp.29-35
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• 2020

This paper studies the main parameters of tube-to-bar dissimilar material and shape friction welding for piping materials. The weldability of joint parts was investigated with respect to tensile tests, micro-Vickers hardness, the bond of area, and optical microstructure. The specimens are tested as-welded. Optimal welding conditions are n = 2000 rpm, HP = 50 MPa, UP = 100 MPa, HT = 5 sec, and UT = 10 sec when the metal loss (Mo) is 11 mm. Moreover, the same two materials for friction welding are strongly mixed with a well-combined structure of micro-particles without any molten material, particle growth, or defects. Therefore, the expected result of dissimilar material friction welding includes a reduction of cost and material in the welding process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

• Journal of Dental Rehabilitation and Applied Science
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• v.29 no.1
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• pp.37-44
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• 2013

Sodium hypochlorite and ethylene diamine tetra acetic acid are substances usually used during endodontic treatment. Several studies found that the bonding was negated with certain irrigants and some of the used irrigants have demineralizing and chealating effects, so it was advocated to omit the etching step in etch and rinse adhesive systems. The purpose of this in vitro study was to evaluate the influence of NaOCl & EDTA on the bonding strength of ethanol wet bonding. Thirty human molars were selected and mesiodistally sectioned into halves, thus providing sixty specimens. The specimens were randomly assigned to 4 groups(n=15) according to the irrigant regimen used : (1) irrigated with distilled water for 10min (control); (2) irrigated with 5.25% NaOCl(10min), flushed with 5.25% NaOCl(1min) (3) irrigated with 5.25% NaOCl, flushed with 17% EDTA (4) irrigated with 5.25% NaOCl, flushed with 17% EDTA. Each group was acid-etched with 37% phosphoric acid(except group 4) and had their dentin surfaces dehydrated with ethanol solutions : 50%, 70%, 80%, 95%, 3x100%, 30s for each application. After dehydration, a primer( 50% all bond 3 resin + 50% ethanol) was used, followed by the adhesive(ALL-BOND 3 RESIN) application. Resin composite build-ups were then prepared using an incremental technique. Specimens were sectioned into beams and submitted to a tensile load using a Micro Tensile Tester(Bisco Inc.). The data were statistically analyzed using one-way ANOVA and Tukey HSD at p<0.5 level. There was no significant difference on G1(control) and G2(irrigated with NaOCl only ). (p>0.05). G3(flushed with EDTA) showed significantly high tensile bonding strength compared to the G2 (p<0.05). G4( treated with EDTA but no acid-etching) was significantly lower value than G3. (p<0.05) Although there was no significant difference, 5.25% NaOCl seemed to have an adverse effect on the bonding strength of ethanol wet bonding. The flushing with EDTA after NaOCl irrigation prevents the decrease of bonding strength. The use of 17% EDTA as a final flush can enhance the bonding strength but EDTA flushing can't substitute for a acid-etching.

• The Journal of Korean Academy of Prosthodontics
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• v.46 no.2
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• pp.148-156
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• 2008

Statement of problems: Self-etch adhesives exhibit some clinical benefits such as ease of manipulation and reduced technique-sensitivity. Nevertheless, some concern remains regarding the bonding effectiveness of self-etch adhesives to enamel, in particular when so-called 'mild' self-etch adhesives are employed. This study compared the microtensile bond strengths to ground enamel of the two-step self-etch adhesive Clearfil SE Bond (Kuraray) to the three-step etch-and- rinse adhesive Scotchbond Multi-Purpose (3M ESPE) and the one-step self-etch adhesive iBond (Heraeus Kulzer). Purpose: The purpose of this study was to determine the effect of a preceding phosphoric acid conditioning step on the bonding effectiveness of a two-step self-etch adhesive to ground enamel. Material and methods: The two-step self-etch adhesive Clearfil SE Bond non-etch group, Clearfil SE Bond etch group with prior 35% phosphoric acid etching, and the one-step self-etch adhesive iBond group were used as experimental groups. The three-step etch-and-rinse adhesive Scotchbond Multi-Purpose was used as a control group. The facial surfaces of bovine incisors were divided in four equal parts cruciformly, and randomly distributed into each group. The facial surface of each incisor was ground with 800-grit silicon carbide paper. Each adhesive group was applied according to the manufacturer's instructions to ground enamel, after which the surface was built up using Light-Core (Bisco). After storage in distilled water at $37^{\circ}C$ for 1 week, the restored teeth were sectioned into enamel beams approximately 0.8*0.8mm in cross section using a low speed precision diamond saw (TOPMET Metsaw-LS). After storage in distilled water at $37^{\circ}C$ for 1 month, 3 months, microtensile bond strength evaluations were performed using microspecimens. The microtensile bond strength (MPa) was derived by dividing the imposed force (N) at time of fracture by the bond area ($mm^2$). The mode of failure at the interface was determined with a microscope (Microscope-B nocular, Nikon). The data of microtensile bond strength were statistically analyzed using a one-way ANOVA, followed by Least Significant Difference Post Hoc Test at a significance level of 5%. Results: The mean microtensile bond strength after 1 month of storage showed no statistically significant difference between all adhesive groups (P>0.05). After 3 months of storage, adhesion to ground enamel of iBond was not significantly different from Clearfil SE Bond etch (P>>0.05), while Clearfil SE Bond non-etch and Scotchbond Multi-Purpose demonstrated significantly lower bond strengths (P<0.05), with no significant differences between the two adhesives. Conclusion: In this study the microtensile bond strength to ground enamel of two-step self-etch adhesive Clearfil SE Bond was not significantly different from three-step etch-and-rinse adhesive Scotchbond Multi-Purpose, and prior etching with 35% phosphoric acid significantly increased the bonding effectiveness of Clearfil SE Bond to enamel at 3 months.