AN EXPERIMENTAL STUDY ON THE MICROTENSILE BONDING STRENGTH OF DENTIN TREATED BY $CARISOLV^{TM}$

$Carisolv^{TM}$ 에 의한 우식제거후 Microtensile Bonding Strength에 관한 연구

The purpose of this study was to compare the microtensile bonding strength of chemomechanically excavated dentin($Carisolv^{TM}$) to conventional caries removal(bur). The following adhesive systems were used; AB: All-Bond 2(3M, USA), PB: Prime & Bond 2.1(Dentsply, DE), AQ: AQ Bond(sun medical, Japan). 42 human molars with occlusal caries were assigned to 6 groups. Sequential caries removal was controlled with laser fluorescence. Each group was devided as follows; group A, B, C were $Carisolv^{TM}$ applied, group D,E,F were bur used. In group A and D, AB was used as a dentin adhesive. group B,E and group C,F was AQ and AQ was used each. The cavity was filled with composite resin(Z-100). The specimens were sectioned vertically into multiple serial 0.7 mm thick slabs. And then those slabs were sectioned into rectangular parts under 0.7 mm width. Finally 0.7-1.0 mm a right hexahedron shape stick become. Microtensile bonding test was carried out with testing apparatus at cross-head speed of $0.5\;mm/min^{-1}$ and fractured surfaces were observed with scanning electron microscope(JSM-6400, Jeol, Japan). The obtained results were summarized as follows ; 1. In the group of caries removal with $Carisolv^{TM}$, micro-tensile bonding strength decreased to $75.8{\sim}80$ percent of bur used group. 2. In the group of caries removal with $Carisolv^{TM}$, decreased degree of micro-tensile bonding strength is not so different in 3 kinds of dentin adhesives(p<0.05). 3. In the group of caries removal with $Carisolv^{TM}$, microtensile bonding strength of AB, PB, AQ was 32.6MPa(2.4), 30.1Mpa (1.8), 21.2Mpa(1.9). 4. In the group of caries removal with Bur and $Carisolv^{TM}$, microtensile bonding strength of AQ was significantly lower than that of AB and PB(p<0.01).

이 연구의 목적은 전형적인 우식제거(bur)와 기계화학적으로 제거된 상아질($Carisolv^{TM}$)의 microtensile bonding strength를 비교하는 것이다. 다음과 같은 결합 system이 사용되었다; AB: All Bond 2(3M, USA), PB: Prime & Bond 2.1(Dentsply, DE), AQ: AQ Bond(sun medical, Japan). 교합면 우식증을 가지고 있는 42개의 사람 대구치를 6개 그룹으로 나누었다. 각각의 그룹은 다음과 같이 나누었다; $Carisolv^{TM}$를 적용한 그룹 A, B, C와 bur를 사용한 그룹 D, E, F, A와 D 그룹에서는 AB가 상아질 결합제로 사용하였고, 그룹 B, E는 PB를 그룹 C, F는 AQ를 사용하였다. 그 후 와동은 복합레진(Z-100)으로 충전하였다. 각각의 시편을 0.7 mm 두께로 자르고 0.7 mm의 넓이로 다시 잘랐다. Microtensile bonding strength test는 $0.5\;mm/min^{-1}$의 crosshead에서 시행하여 파절면을 scanning electron microscope(JSM-6400, Jeol, Japan)로 관찰하여 다음과 같은 결과를 얻었다. 1. $Carisolv^{TM}$로 우식을 제거했을 때 Microtensile bonding strength는 bur를 사용한 것에 비해서 75.8-80%로 감소하였다(p<0.05). 2. $Carisolv^{TM}$로 우식을 제거했을 때 Microtensile bonding strength가 감소된 정도는 상아질 결합제의 종류에 따라 각 군별로 차이가 없었다(p<0.05). 3. $Carisolv^{TM}$로 우식을 제거했을 때 All bonds는 32.6 MPa, Prime & bond는 30.1 Mpa, AQ bond는 21.2 Mpa이었다. 4. Bur와 $Carisolv^{TM}$로 우식제거시 AQ bond는 All bond와 Prime & bond 2.1보다 유의하게 낮은 결합강도를 가졌다(p<0.01).