• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.1-13
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• 2014

The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1541_1542
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• 2009

본 논문에서는 바이오/환경센서 응용을 위해 실리콘 기판위에 나노 동공구조 백금 전극을 작동전극으로 갖는 소형화된 용존산소센서를 설계 및 제작하고 그 특성을 분석하였다. 제작된 용존산소 센서는 15 mm $\times$ 8 mm $\times$ 0.6 mm의 소형화된 크기를 가졌으며, -0.9 V의 인가전위 시에 각각 산소 포화 상태와 무산소 상태에서 2.14 mA와 0.8 mA의 환원전류 특성을 보였다. 또한, 다양한 산소 농도상태에서 각기 다른 전류응답 차이를 보였다. 이를 통해서 다양한 산소농도에 대한 센싱특성을 검증하였다. 한편, 제작된 용존산소 센서는 전극제작에 사용된 나노 동공구조 백금 전극의 높은 촉매 특성에 기인하여 90% 전류응답시간이 7초 이내로 기발표된 다른 연구들에 비해 현저히 향상된 응답특성을 보였다.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.39 no.2 s.120
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• pp.54-59
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• 2007

Cereal, computer software, wine, small appliances, and fast foods are examples of products that have switched from folding carton to microflute corrugated paperboard. Microflute corrugated paperboards have their unique wonderful packaging characteristics that are driving forces for people to use more and more. Good strength property, excellent shock absorbing ability, and beautiful outer appearance of microflute corrugated paperboards go hand and hand with their environmental advantages. It is known that physical properties of microflute corrugated paperboards depend on not only properties of base paper but corrugator operating conditions. This study was carried out to investigate on the corrugator's optimum operating conditions for making micro flute corrugated paperboards. Lab-scaled micro flute corrugator was installed and run with systematic changes of operation conditions to investigate the effects of operation conditions on physical properties of micro flute corrugated paperboards.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.278-279
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• 2007

본 논문에서는 메조포러스 백금 전극이 적용된 무효소 혈당센서를 실리콘 기판 위에 제작하여 향후 CMOS 회로와의 집적이 가능하도록 설계하였으며, 초소형 무효소 혈당센서 구조의 최적화를 위하여 동일한 면적에서 여러 가지 구조의 센서를 설계 및 제작을 하고 그 결과를 비교 분석하였다. 제작된 무효소 혈당센서는 3전극시스템으로 구성되고 그 특성은 작동전극과 타 전극사이의 간격에 가장 민감한 변화를 보였다. 최적화된 구조를 갖는 센서는 11.1mM glucose실험에서 12.9${\mu}A$의 응답전류를 얻었으며 이 값은 효소를 사용한 센서와 비교하여도 월등히 큰 응답임을 알 수 있었다. 또한 제작된 센서들은 구조 최적화를 위하여 $9mm^2$로 동일한 크기로 실험을 하였지만, 이 크기는 응답전류가 매우 크므로 더욱더 소형화가 가능함을 알 수 있다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.29-33
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• 2000

MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than ＄9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1627-1628
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• 2006

In this paper, mesoporous only platinum electrode and micro pore platinum electrode with mesoporous Pt are fabricated and characterized on a silicon substrate to check their usability as enzymeless sensing electrodes for developing non-disposable glucose sensors integrated with silicon CMOS read out circuitry. Since most of electrochemical glucose sensors are disposable due to the use of the enzymes that are living creatures, these are limited to use in the in-vivo and continuous monitoring system applications. The proposed mesoporous Pt electrode with approximately 2.5nm in pore diameter and 150nm in height was fabricated by using a nonionic surfactant $C_{16}EO_8$ and an electroplating technique. The micro pore Pt electrode with mesoporous Pt means the mesoporous Pt electrode fabricated on top of micro pore arrayed Pt electrode with approximately $10{\mu}m$ in pore diameter and $80{\mu}m$ in height. The measured current responses at 10mM glucose solution of plane Pt, micro pore Pt, micro pore with mesoporus Pt, and mesoporous Pt electrodes are approximately $9.9nA/mm^2$, $92.4nA/mm^2$, $3320nA/mm^2$ and $44620nA/mm^2$, respectively. These data indicate that the mesoporous Pt electrode is much more sensitive than the other Pt electrodes. Thus, it is promising for non-disposable glucose sensor and electrochemical sensor applications.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.7-13
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• 2019

In this paper, the principles, types and characteristics of the laser and laser soldering are introduced. Laser soldering methods for electronics, metals, semiconductors are also presented. Laser soldering is a non-contact process that transfers energy to solder joint by a precisely controlled beam. Demands for laser soldering are increasing due to bonding for complex circuits and local heating in micro joint. Laser absorption ratio depends on materials, and each material has different absorption or reflectivity of the laser beam, which requires fine adjustment of the laser beam. Laser types and operating conditions are also important factors for laser soldering performance. In this paper, the performance of Nd:YAG laser soldering is compared to the hot blast reflow. Meanwhile, a diode laser gives different wavelength and smaller parts with high performance, but it has various reliability issues such as heat loss, high power, and cooling technology. These issues need to be improved in the future, and further studies for laser micro-joining and soldering are required.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.04a
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• pp.39-64
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• 2003

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.207-235
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• 2001