• Design & Manufacturing
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• v.13 no.4
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• Journal of the Korean Vacuum Society
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• v.7 no.1
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• pp.17-23
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• 1998

$Pb(Fe_{0.5}Nb_{0.5}O_3(PFN)$ thin films were prepared by rf magnetron co-sputtering method on $SiO_2/Si$, ITO/glass, and $Pt/Ti/SiO_2/Si$ substrates and post-annealed at the $N_2$ atmosphere by RTA(rapid thermal annerling). The degree of crystallinity of PFN films was identified on various substrates. Electrical properties of PFN films was characterized for $Pt/PFN/Pt/Ti/SiO_2/Si$ structure. The composition of PFN films was estimated by EPMA (electron probe micro analysis). PFN films would be crystallized better to perovskite phase on ITO/glass substrate than $SiO_2/Si$ substrate. This may be induced by the deformation of Pb deficient pyrochlore phase due to Pb diffusion into $SiO_2/Si$ substrate. PFN films on $Pt/Ti/SiO_2/Si$ substrate. PFN films with 5-10% Pb excess were crystallized to perovskite phase from $500^{\circ}C$ temperature. In summary, we show that Pb composition and annealing temperature were critically influenced on crystallinity to perovskite phase. When PFN film with 17% Pb excess was annealed at $600^{\circ}C$ at the $N_2$ atmosphere for 300kV/cm and 88. Its remnant polarization coercive field $2.0 MC/cm^2$ and 144kV/cm, respectively.

• Polymer(Korea)
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• v.39 no.2
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• pp.323-328
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• 2015

Poly(${\varepsilon}$-caprolactone) (PCL) nanofibers and PCL/silica membranes were synthesized by sol-gel derived electrospinning and casting, respectively. Smooth PCL nanofibers were obtained from the precursor containing N,N-dimethylformamide (DMF). PCL/silica membranes were prepared by varying the tetraethyl orthosilicate (TEOS) contents from 0 to 40 vol% to investigate the effect of silica addition on mechanical properties and cytotoxicity of the membranes. Although the strength of the membranes decreased from 12 to 8 MPa with increasing the silica content, the strength remained almost constant 7 weeks after dipping in phosphate buffered saline solution (PBS). The strength reduction was attributed to the presence of a patterned surface pores and micro-pores present in the walls between pores. The crystal structure of the membranes was orthorhombic and the crystallite size decreased from 57 to 18 nm with increasing the silica content. From the agar overlay test, the PCL/silica membranes exhibited neither deformation and discoloration nor lysis of L-929 fibroblast cells.

• Journal of Conservation Science
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• v.32 no.4
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• pp.459-469
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• 2016

The goal of this study was to examine property changes induced by the choice of filler used with an epoxy resin that was developed in 2014 to restore cultural assets and consider the applicability of the resin as a restorative agent. The properties of putty mixed with 9 types of fillers and as-developed resins were compared with those of existing materials with regard to stability, superiority and applicability. The potential of the putty as an alternative material was also examined. The materials produced the best adhesiveness, color change and hardness results when mixed with lime. Micro balloon produced the best wear rates and hardening times, while diatomite produced the best tensile and compressive strengths. A plaster and white mineral pigment mixture produced the best specific gravity. Every material except for lime exhibited about 2.5-20 times higher wear rates than the existing material, which is thought to exhibit an excellent cutting force. The hardening time was enhanced by about 0.5-9 times to improve convenience. The stability of the relic was also ensured by improving hand staining without any shrinkage or deformation. The material exhibited about 0.5-27 times less yellowing. Thus, it is thought to be a material that can reduce property changes and reduce the degree of relic fatigue which occurs during reprocessing and sense of difference from relic.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.37-42
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• 2022

Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.

• Journal of Adhesion and Interface
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• v.25 no.1
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• pp.169-274
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• 2024

Recent attention has been drawn to materials that undergo reversible expansion and contraction in response to external stimuli, leading to morphological changes. These materials hold potential applications in various fields including soft robotics, sensors, and artificial muscles. In this study, a novel material capable of responding to high temperatures for protection or encapsulation is proposed. To achieve this, liquid crystal elastomer (LCE) with nematic-isotropic transition properties and polyimide (PI) with high mechanical strength and thermal stability were utilized. To utilize a solution process, a dope solution was synthesized and introduced into micro-printing techniques to develop a two-dimensional pattern of LCE/PI bilayer structures with sub-millimeter widths. The honeycomb-patterned LCE/PI bilayer mesh combined the mechanical strength of PI with the high-temperature contraction behavior of LCE, and selective printing of LCE facilitated deformation in desired directions at high temperatures. Consequently, the functionality of selectively and reversibly encapsulating specific high-temperature materials was achieved. This study suggests potential applications in various actuator fields where functionalities can be implemented across different temperature ranges without the need for electrical energy input, contingent upon molecular changes in LCE.

• Korean Journal of Poultry Science
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• v.44 no.1
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• pp.19-28
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• 2017

The eggshell is an intricate and highly ordered structure composed of multiple layers and a calcified matrix. The eggshell is formed at the uterine segment of the chicken oviduct. In this study, histological changes in the uterine endometrium and the expression of the eggshell-related genes were investigated according to hen age. We analyzed the expression of eggshell protein-related genes, such as OCX-32, OCX-36, OC-17, OC-116, and eggshell-ion-related genes, such as CABL-1, SPP1, SCNN1G, ATP2A2, CA2, and CALM1. In chicken uterine endometrium, histological deformation, fibrosis, atrophy and elimination of micro-villi were found with increasing hen age. The concentration of blood-ion components did not significantly change with age. The amount of telomeric DNA in uterine endometrial cells decreased with increasing hen age. The expression of most of the eggshell-related genes changed significantly with increasing hen age. The expression of some ovo-proteins, which play a role in eggshell formation, increased with increasing hen age; however, there were no significant correlations among eggshell protein genes. Eggshell ion-related genes, such as ATP2A2, SCNN1G, CA2, and CALM1, were closely related to each other. The OCX-32 and OCX-36 genes were closely related to some of the eggshell ion genes. Eggshell protein-related genes, such as the OCX-32, OCX-36 genes and ion-related genes such as CALB-1, ATP2A2, SCNN1G, CA2, CALM1, affected eggshell formation, mutually or independently. This study shows that, uterine although endometrial cell damage occurs with increasing hen age, normal eggshells can be formed in old hens. This suggests that eggshell protein-and eggshell ion-related genes also control the homeostasis of eggshell formation.

• Journal of Bio-Environment Control
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• v.22 no.2
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• pp.100-107
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• 2013

Unlike general microwave, QRD (Quadratic Residue Diffusor) Microwave used in this study is known as a new technology that enhances the sterilization effect with low power because it is possible to induce the average sterilization by changing wavelength phase difference. Therefore, basic research was conducted on the function that could sterilize culture media for plant factory by using environmentally friendly and low energy consuming QRD Microwave. The results are as follows: It was confirmed that there was no external deformation in the polyurethane foam and rock wool medium when changing the microwave level between 2 and 8 kW in different water content of culture media. However, PDA solid media at 2 kW were not dissolved in 60 and 180 seconds. All of the media were dissolved in other processing. There was little difference in the microwave irradiation level and surface temperature of the strain according to the processing time between Bacillus sp. and Burkholderia sp. In the sterility test according to the microwave irradiation level and processing time, it was confirmed that both Bacillus sp. and Burkholderia sp. grew in the microwave level 2 kW regardless of time. In the microwave level 6 kW, all experimental groups except the processing of Burkholderia sp. for 60 seconds were sterilized, and all of Bacillus sp. was killed in the all experimental groups. In the microwave level 8 kW, it was confirmed that both Bacillus sp. and Burkholderia sp. were sterilized regardless of time. The temperature in microwave-processed media after contaminating strains to each medium was maintained at more than 100 in polyurethane foam and rock wool medium after 60 seconds. In general, it was shown that it was possible to sterilize after 60 seconds. Therefore, it is considered that Bacillus sp. and Burkholderia sp. which are the biggest problems in the plant factory can be adequately sterilized by QRD Microwave used in this study.