• Journal of Aerospace System Engineering
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• v.16 no.5
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• pp.35-42
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• 2022

This paper deals with predicting comparable mechanical properties of laminated composite plates. The stiffness of an equivalent anisotropic composite plate is derived based on classical lamination theory. A novel failure criterion is defined to describe the failure behaviour of laminated composite plates based on micro-mechanics failure criteria. Finally, the theory's validation of finite element analysis results was verified. We concluded that this theory is very suitable for failure analysis of laminated composite plates for aerospace applications due to their relative simplicity and computational efficiency.

• Corrosion Science and Technology
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• v.4 no.3
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• pp.100-107
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• 2005

Reinforcing steel bars in reinforced concrete structures are protected from corrosion by passive film on the steel surface inside concrete with high alkalinity. However, when the passive film breaks down due to chloride ion ingressed into the RC structures, a corrosion initiates at the surface of steel bars. Then, internal pressure by volume expansion of corrosion products in reinforcing bars induces cracking and spalling of cover concrete, which reduces not only durability performance but also structural performance in RC structures. In this paper, a service life prediction of RC structures is carried out by using a micro-mechanics based corrosion model. The corrosion model is composed of a chloride penetration model to evaluate the initiation of corrosion and an electric corrosion cell model and an oxygen diffusion model to evaluate the rate and the accumulated amounts of corrosion. Then, a corrosion cracking model is combined to the models to evaluate critical amount of corrosion product for initiation cracking in cover concrete. By implementing the models into a finite element analysis program, a time and space dependent corrosion analysis and a service life prediction of RC structures due to chloride attack are simulated and the results of the analysis are compared with test results. The effect of crack width on the corrosion and the service life of the RC structures are analyzed and discussed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.4
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• pp.447-451
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• 2015

The objective of this study is to predict the structural characteristics of a heat exchanger mounted on an aircraft engine using finite element analysis. The plastic fracture and life of the heat exchanger were estimated by a thermo-mechanical analysis. Tensile tests were conducted under high temperature conditions (700, 800, 900, 1000 K) using five specimens to obtain the mechanical properties of the Inconel 625 tubes. To assess the structural characteristics of the heat exchanger, the full and partial models were applied under the operating conditions given by the thermo-mechanical and inertial load. As a result, the case, tubesheet, flange, and mounting components have a reasonable safety margin to the allowable stress assuming a fatigue strength of Inconel 625 of 10000 cycles under 1000 K.

• Interaction and multiscale mechanics
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• v.2 no.3
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• pp.321-332
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• 2009

Recent development in composites containing phase-transforming particles, such as vanadium dioxide or barium titanate, reveals the overall stiffness and viscoelastic damping of the composites may be unbounded (Lakes et al. 2001, Jaglinski et al. 2007). Negative stiffness is induced from phase transformation predicted by the Landau phase transformation theory. Although this unbounded phenomenon is theoretically supported with the composite homogenization theory, detailed stress analyses of the composites are still lacking. In this work, we analyze the stress distribution of the Hashin-Shtrikman (HS) composite and its two-dimensional variant, namely a circular inclusion in a square plate, under the assumption that the Young's modulus of the inclusion is negative. Assumption of negative stiffness is a priori in the present analysis. For stress analysis, a closed form solution for the HS model and finite element solutions for the 2D composite are presented. A static loading condition is adopted to estimate the effective modulus of the composites by the ratio of stress to average strain on the loading edges. It is found that the interfacial stresses between the circular inclusion and matrix increase dramatically when the negative stiffness is so tuned that overall stiffness is unbounded. Furthermore, it is found that stress distributions in the inclusion are not uniform, contrary to Eshelby's theorem, which states, for two-phase, infinite composites, the inclusion's stress distribution is uniform when the shape of the inclusion has higher symmetry than an ellipse. The stability of the composites is discussed from the viewpoint of deterioration of perfect interface conditions due to excessive interfacial stresses.

• Current Optics and Photonics
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• v.1 no.2
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• pp.143-149
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• 2017

LED arrays with pixel numbers of $3{\times}3$, $4{\times}4$, and $5{\times}5$ have been studied in this paper in order to enhance the optical output power and decrease heat dissipation of an AlGaInP-based light emitting diode display device (pixel size of $280{\times}280{\mu}m$) fabricated by micro-opto-electro-mechanical systems. Simulation results showed that the thermal resistances of the $3{\times}3$, $4{\times}4$, $5{\times}5$ arrays were $52^{\circ}C/W$, $69.7^{\circ}C/W$, and $84.3^{\circ}C/W$. The junction temperature was calculated by the peak wavelength shift method, which showed that the maximum value appears at the center pixel due to thermal crosstalk from neighboring pixels. The central temperature would be minimized with $40{\mu}m$ pixel pitch and $150{\mu}m$ substrate thickness as calculated by thermal modeling using finite element analysis. The modeling can be used to optimize parameters of highly integrated AlGaInP-based LED arrays fabricated by micro-opto-electro-mechanical systems technology.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.7
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• pp.4093-4099
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• 2014

In this study, the thermal-structural behavior of the combustor assembly of 200 kW micro gas turbine system was performed. The typical combustor assembly consists of a Liner, Inner & Outer Case, Burner and Nozzle ring, etc. There are some gaps and friction elements between the components to compensate for the different thermal expansions of various components. Therefore, the developed finite element model includes nonlinear elements. The boundary support conditions of the combustor assembly significantly affect the stress distribution due to the high temperature gradient. This paper deals with parametric studies to quantitatively determine the effects of the variation of the support conditions on the stress distribution and deformation of various components of combustor assembly. These results may be useful for the design of the combustor assembly.

• Journal of Biomedical Engineering Research
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• v.25 no.6
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• pp.519-523
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• 2004

This study investigates micro-structural and mechanical properties of trabecular bone in human femoral head with and without osteoporosis using Micro-CT and finite element-model. 15 cored trabecular bone specimens with 20min of diameter were obtained from femoral heads with osteoporosis (T-score > -2.5 ) resected for total hip arthroplasty, and 5 specimens were removed from femoral head of cadavers, which has no history of musculoskeletal diseases. A high-resolution micro-CT system was used to scan each specimen to obtain histomorphometry indices. Based on obtained micro-images(pixel size=21.31㎛), a FE-model was created to determine mechanical property indices. While non-osteoporosis group had increases trabecular thickness, bone volume, bone volume fraction, degree of anisotropy and trabecular number compared with those of non-osteoporotic group, the non-osteoporotic group showed decreases in trabecular separation and structure model index. Regarding the mechanical property indices, reaction force, apparent stress and young's modulus were 1ower in osteoporotic group than in non-osteoporotic group. Our data shows salient deteriorations in trabecular micro-structural and mechanical properties in human femoral head with osteoporosis.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.24-24
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• 2003

Research activity in the III-V nitrides materials system has increased markedly in the past several years ever since high-brightness blue light-emitting diodes (LEDs) became commercially available. Despite of excellent optical properties of the GaN, however, inherently poor thermal property of the sapphire used as a substrate material n these devices may lead to thermal degradation of devices, especially during their high power operation. Therefore, dependable thermal analysis and packaging schemes of GaN-based LEDs are necessary for solid lighting applications under high power operation. In this paper, emphasis will be placed upon thermal design of GaN-based LEDs. Thermal measurements of LEDs on chip and packaging scale were performed using the liquid crystal thermographic technology and micro thermocouples for different bias conditions. By a series of optical arrangement, hot spots with specific transition temperatures were obtained with increasing input power. Thermal design of LEDS was made using the finite element method and analytical unit temperature profile approach with optimal boundary conditions. The experimental results were compared to the simulated data and the results agree well enough for the establishment of dependable prediction of thermal behavior in these devices. The paper will present a more detailed understanding of the thermal analysis of the GaN-based blue and white LEDs for high power applications.

• Steel and Composite Structures
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• v.15 no.2
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• pp.203-220
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• 2013

The study of the tensile strength of composite materials is far more complex than analysis of the properties of elasticity and plasticity. Indeed, during mechanical loading, micro-cracks in the matrix, the fibers break, debonding of the interfaces are created. The failure process of composites is of great diversity and cannot be described if even we know: the strength criterion of each individual component, the state of stress and strain in the material, the propagation phenomena cracks in the structure and nature of the interface between the matrix and the reinforcement. This information is only partially known and the obtained by the analysis of a stress limit beyond which there is destruction of the material is almost impossible. To partially process the issue, a solution lies in a mesoscopic approach of seeking a law to locate the ultimate strength of the material for a plane stress state. Tests on rectangular plates in bending PEEK/APC2 and T300/914 three were made and this in order to validate our approach, the calculation has been implemented in a nonlinear finite element code (Castem 2000), in order to make comparison with the numerical results. The results show good agreement between numerical simulation and the two materials; however, it would be interesting to consider other phenomena in the criterion.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.