• 대한기계학회논문집B
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• 제37권12호
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• pp.1159-1165
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• 2013

파우더 블라스팅은 미세 유리가공법으로서 가공속도가 빠르고 저비용의 장점이 있지만 유리를 취성파괴 시키기 때문에 표면거칠기가 좋지않다. 블라스팅된 표면에 저압의 워터젯을 분사하여 표면에서의 연마 슬러리의 흐름을 통해 표면거칠기를 저감할 수 있다. 본 연구에서는 소다라임 유리에 블라스팅으로 마이크로 채널을 가공한 후 워터젯을 연속 적용하고, 마이크로 채널의 표면거칠기 및 단면 형상의 변화의 과정을 관찰하였다. 워터젯의 적용결과, 초기단계에서는 블라스팅에 의한 미세 요철이 제거되었고, 이후 표면하부의 크랙이 제거되어 평균 표면거칠기 50 nm 근방의 매끈한 표면을 얻을 수 있었다. 표면거칠기 저감에 동반하여 채널단면의 확장 과정도 함께 관측하였다. 마지막으로 제안한 방법에 의해 미세유체칩의 가공 결과를 제시하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.100-103
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• 2005

In this study, tool path control algorithm for aspherical surface grinding was derived and discussed. The aspherical surface actually means contact points between lens and tool. Tool positions are generally defined at the center of a tool, so there is difference between tool path and lens surface. The path was obtained from contact angle and relative position from the contact point. The angle could be calculated after differentiating an aspheric equation and complex algebraic operations. The assumption of the control algorithm was that x moves by constant velocity while z velocity varies. X was normal to the radial direction of lens, but z was tangential. The z velocities and accelerations were determined from current error and next position in each step. In the experiment, accuracy of the control algorithm was checked on a micro-precision machine. The result showed that the control error tended to be diminished when the tool diameter increased, and the error was under sub-micro level.

• International Journal of Precision Engineering and Manufacturing
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• 제5권1호
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• pp.47-54
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• 2004

In this study, the electrorheological (ER) fluid was used as finishing agent. Since the apparent viscosity can be controlled by an electric field, the ER fluid can be one of efficient materials in finishing processes. To finish small 3-dimensional structures such as the aspherical surface in optical elements, the possible arrangement of a tool, part and auxiliary electrode was described. We examined the influence of the addition of a few abrasive particles on the performance of the ER fluid by measuring yield stress and observed the behavior of abrasive particles in the ER fluid by a CCD camera, which had been also theoretically predicted from the electromechanical principles of particles. On the basis of the above results, the steady flow analysis around the rotating micro tool was performed considering the non-uniform electric field. Finally, borosilicate glass was finished using the mixture of the ER fluid and abrasive particles and material removal with field strength and surface roughness were investigated.

• Transactions on Electrical and Electronic Materials
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• 제7권4호
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• pp.157-162
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• 2006

Chemical-mechanical polishing (CMP), one of the dominant technology for ULSI planarization, is used to flatten the micro electro-mechanical systems (MEMS) structures. The objective of this paper is to achieve good planarization of the deposited film and to improve deposition efficiency of subsequent layer structures by using surface-micromachining process in MEMS technology. Planarization characteristic of poly-Si film deposited on thin oxide layer with MEMS structures is evaluated with different slurries. Patterns used for this research have shapes of square, density, line, hole, pillar, and micro engine part. Advantages of CMP process for MEMS structures are observed respectively by using the test patterns with structures larger than 1 urn line width. Preliminary tests for material selectivity of poly-Si and oxide are conducted with two types of silica slurries: $ILD1300^{TM}\;and\;Nalco2371^{TM}$. And then, the experiments were conducted based on the pretest. A selectivity and pH adjustment of slurry affected largely step heights of MEMS structures. These results would be anticipated as an important bridge stone to manufacture MEMS CMP slurry.

• 공업화학
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• 제25권1호
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• pp.53-57
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• 2014

본 연구에서는 micro-contact printing을 통하여 니오븀 호일 표면 위에 균일한 에칭 pits를 형성하였다. 균일한 보호층을 형성하고자 전해연마의 효과를 확인하였으며, 기존의 $O_2$ 플라즈마 공정 없이 손쉽게 균일한 에칭 pits를 형성시킬 수 있는 조건을 확인하였다. 메탄올 혼합 전해질을 사용하여 10 min 동안 에칭을 진행한 결과 니오븀 호일 표면 위에 지름과 간격이 각각 $10{\mu}m$와 $5{\mu}m$로 잘 정렬된 에칭 pits를 관찰하였다.

• 한국안전학회지
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• 제25권5호
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• pp.1-6
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• 2010

When the ceramic material is being machined, micro crack and brittle fracture dominate the process of material removal. Generally, ceramics are very difficult-to-cut materials and machined using conventional method such as grinding and polishing. However, such processes are generally cost-expensive and have low material removal rate. Machinable ceramics used in this study contain BN powder to overcome these problem and for productivity elevation. This paper focuses on machinability evaluation during end mill process with CNC machining center in this study. Experiment for this purpose is performed for tool wear patterns and mechanism.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.874-877
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• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.

• The Korean Journal of Ceramics
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• 제5권4호
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• pp.363-367
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• 1999

New glass ceramics were investigated for the application as substrates to be used in hard disk devices. The glass system to precipitate lithium di-silicate was studied so as to optimize the composition to realize very high surface flatness. The addition of small amount of several metal oxides with high valences had very drastic effects on the microstructure, because they played a role of crystallization agents, and consequently it determined surface flatness even after the polishing process. The possible mechanism changes of crystal growth due to the addition of metal oxides were discussed in relation to the final micro-texture development. The glass ceramics with very high surface flatness(Ra=7.1 $\AA$) was obtained by the addition of the mixture of $P-2O_5 \;and \;MoO_3$ as crystallization agents.

• 한국생산제조학회지
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• 제20권1호
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• pp.86-95
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• 2011

Ultra-precision machining technology is the essential core technology in today's micro-electronics and electro-optical industries. The needs for processing systems to manufacture products to nanometer(nm) accuracy and sub-nanometer resolutions are increased recently. By using ion beam, it is possible to fabricate ultra-precision and ultra-fine products with nm accuracy and sub-nm resolution. In this paper, the basic research trends of ultra precision machining technology in domestic are surveyed, and the ways to reach to the world-leading level of basic research capabilities in the field of ultra-precision machining technology in domestic is suggested.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1992년도 추계학술대회 논문집
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• pp.115-120
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• 1992

Mirror-surface machining is very important machining technology to manufacture optical parts. especially brittle materials. In case of optical plastics, it is produced through both grinding and polishing till now. New machining method which is more efficient and contributed to the protection of the environmental pollution is, therefore, studied. In this , experimental results and an analysis of surface roughness in ultrasonic vibration cutting of optical plastic (CR-39) which is used for optical lens is presented. In results, a comparison of the micro-structure of machined surfaces produced by cutting with ultrasonic vibration and conventional turning is presented by analyzing S.E.M. photograph. Also, wavelength spectrum analysis is performed to investigate the surface-characteristics machined by ultrasonic vibration cutting.