• Journal of the Korean Society for Precision Engineering
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• v.19 no.1
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• pp.99-106
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• 2002

For the development of a ultra-precision CNC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We calculated unit removal profiles for various flat type polishing tools and polishing tool positions. Using these results we simulate the corrective polishing process based on dwell time control. We calculate dwell time distributions and residual error of the polishing simulation method and the FFT calculation method. We test corrective polishing algorithm with an optical glass. The target removal shape is a sine wave that has amplitude 0.3 micro meters. We find this polishing process has a machining resolution of nanometer order and is effective for sub-micrometer order machining. This result will be used for the software development of the CNC polishing system.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.30 no.2
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• pp.8-14
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• 2007

The powder blasting process has become an important machining technique for the cost effective fabrication of micro devices. This process is similar to sand blasting, and effectively removes hard and brittle materials. A large number of investigations on the abrasive jet machining with such output parameters as material removal rate, penetration and surface roughness have been carried out and reported by various authors. To achieve higher surface roughness, to increase material removal rate and to identify the influence of blasting parameters on the output parameters, we use the taguchi method which is one of the design methods of experiments. We can select process parameters to optimize the blasting process of glass. Experimental results indicate that the taguchi method is useful as a robust design methodology for the powder blasting process.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.4
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• pp.472-477
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• 2011

This paper shows the method of fabrication of a micro lens array comprised of a Nipkow disk used in a large-area, high-speed confocal microscopy. A Nipkow disk has two components, a micro lens array disk and a pinhole array disk. The microlens array focuses illumination light onto the pinhole array disk and redirects reflected light from a surface to a sensor. The micro lens which are positioned in order on a disk have a hemispheric shape with a few tens of micron in diameter, and can be fabricated by a variety of methods like mechanical machining, semiconductor process, replication process like imprinting process. This paper shows how to fabricate the micro lens array which has a long focal length by reflow and imprinting process.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.117-129
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• 1998

Micro-hole drilling (holes less than 0.5 mm in diameter with aspect ratio larger than 10) is recently having more attention in a wide spectrum of precision production industries. Alternative methods such as EDM. laser drilling, etc. can sometimes replace the mechanical micro-hole drilling but are not acceptable in PCB manufacture because of the inferior hole quality and accuracy. The major difficulties in micro-hole drilling are related to small signal to noise ratios, wandering motions of the inlet stage, high aspect ratios, high temperatures and so forth. Of all the difficulties. the most undesirable one is the increase of drilling force as the drill proceeds deeper into the hole. This is caused mainly from the chip effects. Peck-drilling is thus widely used for deep hole drilling despite that it suffers from low productivity. In the paper, a method of cutting force regulation is proposed to achieve continuous drilling. A PD and a sliding mode control algorithms were implemented through controlling the spindle rotating frequency. Experimental results show that the sliding mode control reduces the nominal cutting force and the variation of the cutting force better than the PD control. The advantages of the regulation, such as increase of drill life, fast stabilization of a wandering motion, and the precise positioning of the hole are verified in experiment.

• Journal of the Korean institute of surface engineering
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• v.45 no.1
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• pp.37-42
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• 2012

$WS_2$ powder was added to the Cu/Sn bond metal of diamond micro-blades for machining of semi-conductor and IC chips to improve cutting efficiency. The effect of $WS_2$ additive on cutting efficiency was investigated and compared with the micro-blades with $MoS_2$ developed in previous research. Flexural strength, frictional coefficient, and wear resistance of blades decreased with $WS_2$ but wear depth increased. It was found that the blades including $WS_2$ consumed less momentary energy than the blades containing $MoS_2$ during dicing test. Micro-blades containing $WS_2$ exhibited lower flexural strength than the blades with $MoS_2$ resulting from higher amount of sintering defects relevant to the less effectiveness of $WS_2$ on fluidity. The effect of $WS_2$ and $MoS_2$ on fluidity during sintering was analyzed in terms of mismatching degree between the longitudinal direction of lubricant particles and the perpendicular direction to the compact loading. The blade with 8.1 vol.% of $WS_2$ showed the best cutting efficiency.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.1
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• pp.85-91
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• 2004

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by chemical and mechanical polishing process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of sapphire crystalline wafer at surfaces has a full width at half maximum of 89 arcsec. The surfaces of sapphire wafer were mechanically affected by residual stress during the polishing process. The wave pattern of optical interference of sapphire wafer implies higher abrasion rate in the edge of the wafer than its center from the Newton's ring.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.6
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• pp.7-16
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• 2010

Physical fundamentals of ultrashort femtosecond lasers are addressed along with emerging applications for precision manufacturing and metrology. Femtosecond lasers emit short pulses whose temporal width is in the range of less than a picosecond to a few femtoseconds, thereby enabling extremely high peak-power machining with less thermal damages. Besides, the broad spectral bandwidth of femtosecond lasers constructed in the form of frequency comb permits absolute distance measurements leading to ultraprecision positioning control and dimensional metrology.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.10
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• pp.88-94
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• 2021

Machining operations require the removal of chips to keep the water-soluble cutting oil clean and fresh throughout the operation time. Water-soluble cutting oil for metal processing is diluted using a 3-8% solution in water which is generally replaced every three to six months. This study aims to develop multiple purification devices to efficiently remove fine contaminating particles from water-soluble cutting oil. The 2D concept designs were created using AutoCAD. The designs were drawn using the 3D modelling feature of CATIA. Flow analysis was performed in a bubble purifier using Ansys computational fluid dynamics (CFD). This analysis has aided in improving the design and structure of the device to create the final prototype. Experiments were conducted to check the prototype's performance. Comparisons of the effects of each process variable on the experiment was carried out using ANOVA.

• Korean Journal of Materials Research
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• v.18 no.12
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• pp.635-639
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• 2008

In this paper, experimental studies of the regrinding of tungsten carbide (WC-Co) tools for high-speed machining were conducted. Regrinding and a subsequent evaluation test were carried out for a flat endmill tool with diameters of 10 mm and 3 mm using a CNC five-axis tool grinder and a CNC three-axis machining center. Tool wear on the two types of endmill tools increased as the cutting length increased, and the tool wear was not influenced by the regrinding state. In case of the micro endmill with a tool diameter of 3 mm, the effective regrinding time was determined for a flank wear threshold of 0.3 mm considering the tool life according to cutting length. The tool lives of the 10 mm and 3 mm endmill tools were increased by 80% and 72%, respectively. This conclusion proves the Feasibility of the recycling of tungsten carbide materials in the high-speed machining of high-hardened materials for industrial applications.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.2
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• pp.322-328
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• 2002

In wire-electrical discharge machining (W-EDM), the dielectric plays an important role as the working fluid. It affects the material removal rate and the properties of the machined surface. This paper deals with the effects of the electrical conductivity of dielectric and cobalt percentage of sintered carbides on the machining characteristics and the machined surface integrities with deionized water as dielectric. A series of experiments have been performed on sintered carbides having different cobalt contents. Experimental results show that a higher cobalt content of WC decreases the metal removal rate and worsens the surface quality. Lower electrical conductivity of the dielectric results in a higher metal removal rate as the gap between wire electrode and workpiece reduced. Especially, the surface integrities of rough-cut workpiece, wire electrode, and debris were analyzed also through scanning electron microscopy(SEM) and surface roughness tester. By energy dispersive spectrometry(EDS), it is confirmed that micro cracks and some of electrode material are found on the workpiece surface.