• Journal of Welding and Joining
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• v.29 no.1
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• pp.115-122
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• 2011

This study is to propose an in-process monitoring system for micro resistance spot welding processes using minute accelerometer. A minute accelerometer is mounted on the upper moving electrode tip holder. With its high sensitivity and frequency response characteristics, accelerometer output signal has been successfully recorded and integrated twice to reflect electrode expansion during micro spot welding processes. The analysis of electrode expansion pattern was attempted to find its correlation with spot weld quality. Major previous findings1-6) regarding spot weld quality assessment with the electrode expansion signal in large scale resistance spot welding processes were proved to be true in this in-process monitoring system.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.245-247
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• 2007

Sn-base solder bump is mainly used in micro-joining for flip chip package. The quantity of intermetallic compounds that was formed between Cu pad and solder interface importantly affects reliability. In this research, micro-bump was fabricated by two binary electroplating and the intermetallic compounds(IMCs) was estimated quantitatively. When the micro Sn-Ag solder bump was made by electroplating, SiC powder was added in the plating solution for protecting of intermetallic growth. Then, the intermetallic compounds growth was decrease with increase of amount of SiC power. However, if the mount of SiC particle exceeds 4 g/L, the effect of the growth restraint decrease rapidly.

• Proceedings of the KWS Conference
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• 2000.10a
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• pp.281-283
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• 2000

• Journal of Welding and Joining
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• v.31 no.3
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

• Journal of Welding and Joining
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• v.22 no.2
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• pp.3-7
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• 2004

재료에 단순 인장시험에 의해 구한 항복강도의 2/3의 축응력을 부가하면, 소성변형과 파괴는 일어나지 않지만, 상당한 사이클로 반복하여 부가하면, 파괴가 일어난다. 이것을 피로파괴라고 한다 대부분의 구조물이나 기계부품은 재료의 항복응력 이하의 반복하중을 받으면서 작동되므로, 피로파괴가 자주 발생한다.(중략)

• Journal of Welding and Joining
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• v.29 no.1
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• pp.29-32
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• 2011

• Journal of Welding and Joining
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• v.22 no.4
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• pp.24-28
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• 2004

마이크로 접합 공정은 미세 부품이나 박판의 접합에 사용되며, 이를 위해 다양한 공정이 개발되었다. 최근 MEMS(Micro Electro Mechanical System)활용 범위가 증가하고 있으며, MEMS에 사용되는 미세한 구조물의 접합이나 패키징에 접합 공정이 활용되고 있다. MEMS는 발전 단계이지만 전자 패키징(electronic packaging)은 성숙 단계인 반도체 산업에 사용되고 있다.(중략)

• Journal of Welding and Joining
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• v.22 no.4
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• pp.12-19
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• 2004

오늘날 IT산업의 괄목할 만한 성장으로 IT관련 휴대장비의 시장은 폭발적으로 증가하고 있다. 전통 제조업분야에서도 IT산업과 메카트로닉스의 발전 덕택에 경량화, 소형화된 전자소자나 전기소자 및 관련 센서, 액츄에이터를 활용할 수 있데 됨에 따라 기계 장비 및 장치가 점점 더 소형화되고 있다.(중략)

• Journal of Welding and Joining
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• v.13 no.2
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• Journal of Welding and Joining
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• v.19 no.1
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• pp.88-94
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• 2001

DUPIC (Direct use of spent PWR fuel in CANDU reactors) nuclear fuel is a CANDU fuel fabricated remotely from spent PWR fuel materials in a hot cell. The soundness of the end closure welds of nuclear fuel elements is an important factor for the safety and performance of nuclear fuel. To evaluate the soundness of the end closure welds of DUPIC fuel element, a precise X-ray inspection system is developed using a micro-focus X-ray generator with an image intensifier and a real time camera system. The fuel elements made of Zircaloy-4 and stainless steel by an Nd:YAG laser welding and a TIG welding aye inspected by the developed inspection system. The soundness of the welds of the fuel elements was confirmed by the X-ray inspection process, and the irradiation test of DUPIC fuel elements has been successfully completed at the HANARO research reactor.