• Title/Summary/Keyword: Micro Simulation Analysis

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Dynamic Analysis of the Piezo-Actuator for a New Generation Lithography System (차세대 리소그라피 시스템을 위한 압전구동기의 동적 해석)

  • Park, Jae-Hak;Jung, Jong-Chul;Huh, Kun-Soo;Chung, Chung-Choo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.3
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    • pp.472-477
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    • 2003
  • A piezo-actuator is an important component for an E-beam lithography system. But it is very difficult to model its characteristics due to nonlinearities such as hysteresis and creep, to the input voltage. In this paper, one-axis micro stage with a piezo-actuator is modeled including the nonlinear properties. Hysteresis and creep are modeled as the first order differential equation and a time-dependent logarithmic function, respectively. The dynamic motion of the stage is also modeled as a mass-spring-damper system and the parameters are determined by utilizing the system identification technique. The simulation tool for a micro stage is constructed using the commercial software and its simulation results are compared with the experimental data.

Improvement of Filling Characteristics of Micro-Bumps in the Stencil Printing Process (스텐실 프린팅 공정에서 미세범프의 성형성 향상을 위한 연구)

  • Seo, W.S.;Min, B.W.;Park, K.;Lee, H.J.;Kim, J.B.
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.21 no.1
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    • pp.26-32
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    • 2012
  • In the present study, the stencil printing process using solder paste are numerically analyzed. The key design parameters in the stencil printing process are the printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of printing conditions including the squeegee angle and squeegee pressure are investigated through finite element (FE) analysis. However, the FE analysis for the stencil printing process requires tremendous computational loads and time because this process carries micro-filling through thousands of micro-apertures in stencil. To overcome this difficulty in simulation, the present study proposes a two-step approach to sequentially perform the global domain analysis and the local domain analysis. That is, the pressure development under the squeegee are firstly calculated in the full analysis domain through the global analysis. The filling stage of the solder paste into a micro-aperture is then analyzed in the local analysis domain based on the results of the preceding global analysis.

Analysis of Flow in a Microchannel Branch by Using Micro-PIV Method (마이크로 PIV를 이용한 마이크로 분지관에서의 유동해석)

  • Yoon, Sang-Youl;Kim, Kyung-Chun
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.28 no.9
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    • pp.1015-1021
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    • 2004
  • Micro-resolution Particle Image Velocimetry(Micro-PIV) was used to measure the flow in a micro-branch(Micro-Bypass). In this paper, effects of particle lump at the tip of a Micro-branch and difficulties of Micro-PIV measurements for microfluidics with branch passage were described. Micro-bypass was composed of a straight channel(200(100)${\mu}$m width ${\times}$ 80${\mu}$m height) and two branches which has 100(50)${\mu}$m width ${\times}$ 80${\mu}$m height. One of branches was straight and the other was curved. Experiments were performed at three regions along streamwise direction(entrance, middle and exit of branch) and five planes along vertical direction (0, ${\pm}$10, ${\pm}$20 ${\mu}$m) for the range of Re=0.24, 1.2, 2.4. Numerical simulation was done to compare with the measurements and understand the effects of particle lump at the tip of branch. And another fluid(3% poly vinyl Alcohol aqueous solution) were adapted for this study, so there were no particle sticking. In this case, we could get velocity difference between straight and curved branches.

A Study on the Modeling and Analysis of the Micro-Grid (마이크로그리드의 모델링 및 해석에 관한 기초 연구)

  • Son, Kwang-M.;Lee, Kye-B.
    • Proceedings of the KIEE Conference
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    • 2006.07a
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    • pp.533-534
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    • 2006
  • Micro-source units having power ratings in thousands of watts can provide power quality with higher reliability and efficiency than the conventional large scale units. This paper develops switching level model of micro-source and studies the characteristics of the micro-grid consisting of multiple micro-sources and interfaced with electric power system. The developed model adopts the space vector PWM to fully utilize the capacity of inverter. The interaction of the grid connected micro-sources and the characteristics of the control system parameters are investigated. Micro-sources and micro-grid are implemented using PSCAD/EMTDC. Simulation results show that the proposed model is efficient for studying micro-grid system.

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Numerical Analysis and Experimental Study of Thread Rolling Process for Micro-sized Screws(Part II: Application to a Micro-screw with Diameter of 800㎛) (마이크로 체결부품 전조성형공정에 관한 해석 및 실험적 고찰(Part II: M0.8급 마이크로 스크류 전조공정 적용))

  • Song, J.H.;Lee, J.;Lee, H.J.;Lee, G.A.;Park, K.D.;Ra, S.W.;Lee, H.W.
    • Transactions of Materials Processing
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    • v.21 no.3
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    • pp.179-185
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    • 2012
  • In this paper, it is proposed to produce high precision screws with a diameter of $800{\mu}m$ and a thread pitch of $200{\mu}m$ ($M0.8{\times}P0.2$) by means of a cold thread rolling process. In this part II of the study, the focus is on the production and reliability testing of the prototype $M0.8{\times}P0.2$ micro-screw. Designs for two flat dies were developed with the aid of the literature and previous studies. Process parameters during the cold thread rolling process were established through FE simulations. The simulation results showed that the threads of the micro-screw are completely formed through the rolling process. Prototype $M0.8{\times}P0.2$ micro-screw were fabricated with a high precision thread rolling machine. In order to verify the simulation results, the deformed shape and dimensions obtained from the experiment were compared with those from the simulations. Hardness and failure torque of the fabricated micro-screw were also measured. The values obtained indicate that the CAE based process design used in this paper is very appropriate for the thread rolling of micro-sized screws.

Numerical simulation of hot embossing filling (핫엠보싱 충전공정에 관한 수치해석)

  • Kang T. G.;Kwon T. H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.05a
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    • pp.43-46
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    • 2005
  • Micro molding technology is a promising mass production technology for polymer based microstructures. Mass production technologies such as the micro injection/compression molding, hot embossing, and micro reaction molding are already in use. In the present study, we have developed a numerical analysis system to simulate three-dimensional non-isothermal cavity filling for hot embossing, with a special emphasis on the free surface capturing. Precise free surface capturing has been successfully accomplished with the level set method, which is solved by means of the Runge-Kutta discontinuous Galerkin (RKDG) method. The RKDG method turns out to be excellent from the viewpoint of both numerical stability and accuracy of volume conservation. The Stokes equations are solved by the stabilized finite element method using the equal order tri-linear interpolation function. To prevent possible numerical oscillation in temperature Held we employ the streamline upwind Petrov-Galerkin (SUPG) method. With the developed code we investigated the detailed change of free surface shape in time during the mold filling. In the filling simulation of a simple rectangular cavity with repeating protruded parts, we find out that filling patterns are significantly influenced by the geometric characteristics such as the thickness of base plate and the aspect ratio and pitch of repeating microstructures. The numerical analysis system enables us to understand the basic flow and material deformation taking place during the cavity filling stage in microstructure fabrications.

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The Development of Optimal Design and Control System for Ultra-Precision Positioning on Single Plane X-Y Stage (평면 X-Y 스테이지의 초정밀 위치결정을 위한 최적 설계 및 제어시스템 개발)

  • 한재호;김재열;심재기;김창현;조영태;김항우
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.05a
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    • pp.348-352
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    • 2002
  • a basis such as IT(Information Technology), NT(Nano Technology) and BT(Bio Technology). Recently, NT is applied to various fields that are composed of science, industry, media and semiconductor-micro technology. It has need of IT that is ultra-precision positioning technology with strokes of many hundreds mm and maintenance of nm precision in fields of ultra micro process, ultra precision measurement, photo communication part and photo magnetic memory. This thesis represents optimal design on ultra-precision positioning with single plane X-Y stage and development of artificial control system for adequacy of industrial demand. Also, dynamic simulation on global stage is performed by using ADAMS (Automated Dynamic Analysis of Mechanical System) for the purpose of grasping dynamic characteristic on user designed X-Y global stage. The error between displacements from micro stage and from FEM(Finite Element Method) is 3.53% by verifications of stability on micro stage and control performance. As maximum Von-mises stress on hinge of micro stage is 5.981kg/mm$^2$ that is 1.5% of yield stress, stability on hinge is secured. Preparing previous results, optimal design of micro stage can be possible, and reliance of results with FEM can be secured.

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Design, Simulation, and Optimization of a Meander Micro Hotplate for Gas Sensors

  • Souhir, Bedoui;Sami, Gomri;Hekmet, Charfeddine Samet;Abdennaceur, Kachouri
    • Transactions on Electrical and Electronic Materials
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    • v.17 no.4
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    • pp.189-195
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    • 2016
  • Micro Hotplate (MHP) is the key component in micro-sensors, particularly gas sensors. Indeed, in metal oxide gas sensors MOX, micro-heater is used as a hotplate in order to control the temperature of the sensing layer which should be in the requisite temperature range over the heater area, so as to detect the resistive changes as a function of varying concentration of different gases. Hence, their design is a very important aspect. In this paper, we have presented the design and simulation results of a meander micro heater based on three different materials - platinum, titanium and tungsten. The dielectric membrane size is 1.4 mm × 1.6 mm with a thickness of 1.4 μm. Above the membrane, a meander heating film was deposed with a thickness of 100 nm. In order to optimize the geometry, a comparative study by simulating two different heater thicknesses, then two inter track widths has also been presented. Power consumption and temperature distribution were determined in the micro heater´s structure over a supply voltage of 5, 6, and 7 V.