• 제어로봇시스템학회:학술대회논문집
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• 2002.10a
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• pp.109.1-109
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• 2002

This paper presents a macro/micro flip chip mounting head system for precise force control. In the proposed macro/ micro system, the macro actuator is conventional do servomotor with a ball screw mechanism and the micro actuator is a voice coil motor(VCM) that consists of four NdFeB magnets and a winded moving coil. For force control, a sensitive strain-gauge force sensor is mounted in the micro actuator. Through harmonic motion between macro and micro actuator, we would like to get precise contact force control when small sized flip chip is mounted on flexible substrate in high speed. In order to show the effectiveness of the proposed macro/micro flip chip mounting head system, we com...

• Journal of Biomedical Engineering Research
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• v.34 no.4
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• pp.189-196
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• 2013

Dielectrophoresis(DEP) is useful in manipulation and separation of micro-sized particles including biological samples such as bacteria, blood cells, and cancer cells in a micro-fluidic device. Especially, those separation and manipulation techniques using DEP in combination of micro fabrication technique have been researched more and more. Recently, it is revealed that a window structure of insulating layer in microfluidic DEP chip is key role in trap of micro-particles around the window structure. However, the trap phenomenon-driven by DEP force gradient did not fully understand and is still illusive. In this study, we characterize the trap mechanism and efficiency with different shapes of window in a microfluidic DEP chip. To do this characterization, we fabricated 4 different windows shapes such as rhombus, circle, squares, and hexagon inside a micro-fluidic chip, and performed micro-sized particles manipulation experiments as varying the frequency and voltage of AC signal. Moreover, the numerical simulation with the same parameters that were used in the experiment was also performed in order to compare the simulation results and the experimental results. Those comparison shows that both results are closely matched. This study may be helpful in design and development of microfluidic DEP chip for trapping micro-scaled biological particle.

• Journal of the Korean Society for Precision Engineering
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• v.10 no.4
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• pp.206-215
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• 1993

The finite element method is applied to analyze the mechanism of metal cutting, especially micro metal cutting. This paper introduces some effects, such as constitutive deformation laws of workpiece material, friction of tool-chip contact interfaces, tool rake angle and also simulate the cutting process, chip formation and geometry, tool-chip contact, reaction force of tool. Under the usual plane strain assumption, quasi-static analysis were performed with variation of tool-chip interface friction coefficients and tool rake angles. In this analysis, cutting speed, cutting depth set to 8m/sec, 0.02mm, respectively. Some cutting parameters are affected to cutting force, plastic deformation of chip, shear plane angle, chip thickness and tool-chip contact length and reaction forces on tool. Several aspects of the metal cutting process predicted by the finite element analysis provide information about tool shape design and optimal cutting conditions.

• Transactions of Materials Processing
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• v.20 no.1
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• pp.17-22
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• 2011

Recently, analyzing system is studying for applying to biomedical engineering field, actively. Micro fluidics control system has been manufactured using LIGA (Lithographie Galvanoformung und Abformung), Etching, Lithography and Laser etc. However, it is difficult that above-mentioned methods are applied to fabrication of precision mold master efficiently because of long processing time and rising cost of equipments. Therefore, in this study, micro EDM and micro WEDG system were developed to analyze machining characteristics with tool wear, surface roughness and process time. Then, optimal machining conditions could be obtained from the results of analysis. As the results, mold master of staggered herringbone mixer which has a high mixing efficiency, one of passive mixer of Lab-on-a-chip, could be fabricated from micro pattern(< 50um) using micro EDM successfully.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.1
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• pp.47-52
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• 2019

Micro-LEDs show lower efficiencies compared to general LEDs having large areas. Simulations were carried out using ray-tracing software to investigate the change in light extraction efficiency and light distribution according to chip-size of blue flip-chip micro-LEDs (FC ${\mu}-LEDs$). After fixing the height of the square FC ${\mu}-LED$ chip at $158{\mu}m$, the length of one side was varied, with dimensions of 2, 5, 10, 30, 50, 100, 300, and $500{\mu}m$. The highest light-extraction efficiency was obtained at $10{\mu}m$, beyond which the efficiency decreased as the chip-size increased. The chip size-dependence of the FC ${\mu}-LEDs$ both without the patterned sapphire substrate, as well as vertical FC ${\mu}-LEDs$, were analyzed.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.53 no.4
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• pp.166-170
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• 2004

In this paper, it has been proposed the simultaneous control of PFC (power factor corrector) and electronic ballast for fluorescent lamp by one chip micro-controller. Boost DC-DC converter is adopted for PFC, and half bridge inverter for electronic ballast. It controls, simultaneously and independently, the boost DC-DC converter and the half bridge inverter. As PFC and electronic ballast are controlled by one chip micro-controller, it is possible to achieve the simpler and the cheaper controller for fluorescent lamp. Experimental results have shown the feasibility of the proposed simultaneous control of PFC and electronic ballast by one chip micro-controller.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.365-368
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• 2001

입사면에서 발생하는 열을 효율적으로 제거하기 위하여 Yb:YAG 결정의 표면에 sapphire 창을 부착하여 레이저를 발진 시켰다. Yb:YAG 결정에서 발생하는 열이 sapphire 창을 통하여 구리판으로 전달되는 경우 와 Yb:YAG 결정의 측면에서 냉각하는 경우의 레이저 출력을 측정하여 각각의 레이저 발진 특성을 비교하여 보았다. 여기면을 sapphire 창으로 냉각하는 micro-chip Yb:YAG 레이저의 레이저 에너지 전환 효율은 38%였으며 레이저 발진 문턱값은 4 kw/mm$^2$, slope efficiency는 56%로 측정되었다. Sapphire 창을 사용하는 경우 표면에서의 열전달도는 10 W/mm$^2$이상으로 관측되었다. Yb:YAG의 도핑율, 출력경의 반사율 등을 레이저 변수를 최적화할 경우 같은 구조에서 50 W급 레이저도 발진 가능할 것으로 예상된다.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.9
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• pp.55-62
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• 2003

This paper investigates the micro-cutting of cemented carbides using PCD (polycrystalline diamond) and PCBN (polycrystalline cubic boron nitride) cutting tools are performed with SEM direct observation method. The purpose of this study is to make clear the cutting mechanism of cemented carbides and the fracture of WC particles at the plastic deformation zone in orthogonal micro-cutting. And also to achieve systematic understanding, the effect of machining parameter on chip formation and machined surface was studied, including cutting speed, depth of cut and various tool rake angle. Summary of the results are shown below. (1) Three type of chip formation process have been proposed by the results of the direct observation in orthogonal micro-cutting of cemented carbide materials. (2) From the whole observation of chip formation, primary WC particles are crushed and/or fine grained in the shearing deformation zone. A part of them are observed to collide directly with a cutting edge of tool by following the micro-cutting. (3) Surface finish, surface morphology and surface integrity is good to obtain by cutting with PCD cutting tool compared with PCBN. (4) The machined surface has the best quality near the low cutting speed of 10${\mu}m$/sec with a cutting depth of 10 ${\mu}m$ using 0$^\circ$ rake angle and 3$^\circ$ flank angle in this condition, but it was found that excessively low speed, for example the extent of 1 ${\mu}m$/sec, is not good enough to select for various reason.

• 유체기계공업학회:학술대회논문집
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• 2006.08a
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• pp.305-308
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• 2006

For controlling micro-flows inside a LOC (lab-on-a-chip) a syringe pump or an electronic device for EOF(electro-osmotic flow) have been used in general. However, these devices are so large and heavy that they are burdensome in the development of a portable micro-TAS (total analysis system). In this study, a new flow control system employing pressure chambers, digital switches and speed controllers was developed. This system could effectively control the micro-scale flows inside a LOC without any mechanical actuators or electronic devices We also checked the feasibility of this new control system by applying it to a LOC of micro-mixer type. Performance tests show that the developed control system has very good performance. Because the flow rate in LOC is controlled easily by throttling the speed controller, the flows in complicate microchannels network can be also controlled precisely.