• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.54.1-54
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• 2003

• Proceedings of the KIEE Conference
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• 1994.11a
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• pp.422-424
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• 1994

A comb drive electrostatic micro gripper was designed and fabricated. We designed it analytically using electrostatic force and cantilever deflection equation. In fabrication, we used LIGA-like technology consisted of Ni electroplating through polyimide patterned by $O_2$ Plasma RIE and Al sacrificial layer. This micro gripper was designed to handle an optical fiber which is $125{\mu}m$ in diameter.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.11
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• pp.1314-1319
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• 2009

The design methods of mechanical systems are largely classified into deterministic methods and stochastic methods. In deterministic methods, design parameters are assumed to have fixed values. On the other hand, in stochastic methods, design parameters are assumed to be statistically distributed. When a stochastic method is employed, statistical characteristics of the populations of design variables are assumed to be known. However, very often, it is almost impossible or very expensive to obtain the statistical characteristics of the populations. Therefore a sample survey method is usually employed for stochastic methods. This paper describes the procedure of estimating the statistical characteristics of populations by employing sample data sets. An example of AFM micro cantilever beam is employed to show the effectiveness of the procedure.

• ETRI Journal
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• v.27 no.4
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• pp.433-438
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• 2005

We present a new type of silicon micro-probe card using a three-dimensional probe beam of the cantilever type. It was fabricated using KOH and dry etching, a porous silicon micromachining technique, and an Au electroplating process. The cantilever-type probe beam had a thickness of $5 {\mu}m$, and a width of $50{\mu}$ and a length of $800 {\mu}m$. The probe beam for pad contact was formed by the thermal expansion coefficient difference between the films. The maximum height of the curled probe beam was $170 {\mu}m$, and an annealing process was performed for 20 min at $500^{\circ}C$. The contact resistance of the newly fabricated probe card was less than $2{\Omega}$, and its lifetime was more than 20,000 turns.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.6
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• pp.96-104
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• 2007

Calibration of the spring constants of atomic force microscopy (AFM) cantilevers is one of the issues in biomechanics and nanomechanies for quantified force metrology at pieo- or nano Newton level. In this paper, we present an AFM cantilever calibration system: the Nano Force Calibrator (NFC), which consists of a precision balance and a one-dimensional stage. Three types of AFM cantilevers (contact and tapping mode) with different shapes (beam and V) and spring constants (42, 1, 0.06 N $m^{-1}$) are investigated using the NFC. The calibration results show that the NFC can calibrate the micro cantilevers ranging from 0.01 ${\sim}$ 100 N $m^{-1}$ with relative uncertainties of less than 2%.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2395-2397
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• 2005

A low voltage operated piezoelectric RF MEMS in-line switch has been realized by using silicon bulk micromachining technologies for advanced mobile/wireless applications. The developed RF MEMS in-line switches were comprised of four piezoelectric cantilever actuators with an Au contact metal electrode and a suspended Au signal transmission line above the silicon substrate. The measured operation dc bias voltages were ranged from 2.5 to 4 volts by varying the thickness and the length of the piezoelectric cantilever actuators, which are well agreed with the simulation results. The measured isolation and insertion loss of the switch with series configuration were -43dB and -0.21dB (including parasitic effects of the silicon substrate) at a frequency of 2GHz and an actuation voltage of 3 volts.

• Journal of Sensor Science and Technology
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• v.22 no.5
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• pp.374-378
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• 2013

In this paper, a new structure of probe unit is designed and fabricated with PDMS, which is well-known elastic material, as a buffer layer for increasing overdrive force and mechanical strength. In general, PDMS is widely used as actuation material due to its elasticity and compatibility of fabrication process. In this work, PDMS layer is chosen for mechanical elasticity of the proposed probe unit. We achieved the high overdrive force by placing PDMS buffer layer under the silicon based cantilever due to its elasticity. Moreover, the relation between prove length and overdrive force was measured by experiment in this work. Therefore, the various specifications of the micro prove unit can be designed by using the results of this work.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2019.05a
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• pp.65-66
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• 2019

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.146-150
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• 1996

A thermal micro actualtor has been fabricated using surface micromachining techniques. It consists of doped ploysilicon as a moving part and TEOS(Tetra Ethyl Ortho Silicate) as a sacrificial layer. The polysilicon was annealed for the reduction of residual stress which is the main cause to its deformation such as bending and buckling. And the newly developed HF VPE(vapor phase etching)process was also used as an effective release method for the elimination of sacrificaial layer. With noliquid involved during any of the steps for relasing, unlike other reported relase techniques, the HF VPE pocess has produced polysilicon microstructures with virtually no process-induced stiction problem. The actuation is incured by the thermal expasion due to current flow in active polysilicon cantilever, which motion is amplified bylever mechanism. The thickness of pllysilicon is 2 .mu. m and the length of active and passive polysilicon cantilever are 500 .mu. m, respectively. The moving distance of polysilicon actuator was experimentally conformed as large as 21 .mu. m at the input voltage level of 10 V and 50Hz square wave. These micro actuator technology can be utilized for the fabrication of MEMS (microlectromechanical system) such as microrelay, which requires large displacement or contact force but relatively slow response.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.5
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• pp.550-555
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• 2007

The effective fracture toughness testing of materials intended for application in Micro Electro Mechanical Systems (MEMS) devices is required in order to improve understanding of how micro sized material used in device may be expected to perform upon the micro scale. ${\gamma}$-TiAl based materials are being considered for application in MEMS devices at elevated temperatures. Especially, in Alloy 4, both ${\alpha}_2$ and ${\gamma}$ lamellae were altered markedly in 3,000 h, $700^{\circ}C$ exposure. Parallel decomposition of coarse ${\alpha}_2$ into bunches of very fine (${\alpha}_2+{\gamma}$) lamellae. Parallel decomposition of coarse ${\alpha}_2$ into bunches of very fine (${\alpha}_2+{\gamma}$) lamellae. The materials were examined 2 types Alloy 4 on heat exposed specimen($700^{\circ}C$, 3,000 h) and no heat exposed one. Micro sized cantilever beams were prepared mechanical polishing on both side at $25{\sim}30{\mu}m$ and electro final stage polishing to observe lamellar orientation of same colony with EBSD (Electron Backscatter Diffraction Pattern). Through lamellar orientation as inter-lamellae or trans-lamellae, Cantilever beam was fabricated with Focused Ion Beam(FIB). The directional behavior of the lamellar structure was important property in single material, because of the effects of the different processing method and variations in properties according to lamellar orientation. In MEMS application, it is first necessary to have a reliable understanding of the manufacturing methods to be used to produce micro structure.