• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.7
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• pp.1042-1049
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• 1997

LMFBR(Liquid Metal Fast Breeder Reactor) vessel is operated under the high temperatures of 500-550.deg. C. Thus, transient thermal loads were severe enough to cause inelastic deformation due to creep-fatigue and plasticity. For reduction of such inelastic deformations, Y-piece structure in the form of a thermal sleeve is used in LMFBR vessel under repeated start-up, service and shut-down conditions. Therefore, a systematic method for inelastic analysis is needed for design of the Y-piece structure subjected to such loading conditions. In the present investigation, finite element analysis of heat transfer and inelastic thermal stress were carried out for the Y-piece structure in LMFBR vessel under service conditions. For such analysis, ABAQUS program was employed based on the elasto-plastic and Chaboche viscoplastic constitutive equations. Based on numerical data obtained from the analysis, creep-fatigue damage estimation according to ASME Code Case N-47 was made and compared to each other. Finally, it was found out that the numerical predictio of damage level due to creep based on Chaboche unified viscoplastic constitutive equation was relatively better compared to elasto-plastic constitutive formulation.

• Journal of Welding and Joining
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• v.30 no.3
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• pp.38-43
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• 2012

In this study, active metal brazing methods for $ZrO_2$ and Ti alloy were discussed. To get a successful metal-ceramic bonding, various factors (melting temperature, corrosion, sag resistance, thermal expansion coefficient etc. of base materilas and filler metal) should be considered. Moreover, in order to clarify bonding between the metal and ceramic, the mechanism of the interfacial structure of the joints should be identified. The driving force for the formation of metal and ceramic interfaces is the reduction of the free energy which occurs when their contact becomes complete. Interfacial bonding depends on the material combinations and the bonding processes. This study describes the bonding between ceramic and metal in an active metal brazing.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.25-37
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• 2020

In this study, hybridization of graphene oxide and metal was carried out by the functional groups containing oxygen and thermal treatment for reduction in order to enhance the electrical conductivity and magnetic properties of graphene materials. Graphene-metal hybrid materials were synthesized using the oxygen-containing functional groups (-OH, -COOH and so on) on the surface of graphene oxide by replacing them with metal ions via ion exchange method as well as thermal reduction. The metals used in this study were Fe, Ag, Ni, Zn, and Fe/Ag, and it was confirmed that metal particles of uniform size were well dispersed on the graphene surface through SEM, TEM, and EDS. All of the metal particles on the graphene surface had an oxide-crystalline structure. To check the electrical properties, sheet resistance of the rGO-metal hybrid sample was measured on the PET film made by the dip-coating, and the specific resistance was calculated by measuring the thickness of the specimen through SEM. As a result, the specific resistance was in the range of 2.14×10-5 and 3.5×10-3 ohm/cm.

• Transactions of the Korean Society of Automotive Engineers
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• v.6 no.3
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• pp.1-10
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• 1998

In this paper, we investigated the improvement of characteristics of knock, emission and fuel consumption rate by optimizing the location and size of water transfer holes in cylinder head gasket without change of engine water jacket design itself. The cooling system was modified in the direction of reducing the metal temperature in the head and increasing the metal temperature in the block. The optimization of water transfer holes in cylinder head gasket was obtained by "flow visualization test". The water transfer holes were concentrated in front side of the engine in order to reduce thermal boundary layer in the water jacket of No. 2 and No. 3 combustion changer in the cylinder head, which would have a large knock intensity, and increase thermal boundary layer in the water jacket of the cylinder block. When the modified coolant flow pattern was applied as proposed in this paper, the knock characteristic was improved. The spark timing was advanced up to 2$^{\circ}$ in low and middle speed range at a full load. In addition, HC emission at MBT was reduced by 5.2%, and the fuel consumption rate was decreased up to 1% in the driving condition of 2400 rpm and 250 KPa. However, since this coolant flow pattern mentioned in this paper might deteriorate the performance of vehicle cooling system due to the coolant flow rate reduction, a properly optimized point should be obtained. obtained.

• Nuclear Engineering and Technology
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• v.55 no.10
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• pp.3860-3865
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• 2023

A metallic microcell UO₂ pellet has a microstructure where a metal wall is connected to overcome the low thermal conductivity of the UO₂ fuel pellet. It has been verified that metallic microcell fuel pellets provide an impressive reduction of the fuel centerline temperature through a Halden irradiation test. However, it is difficult to predict the effective thermal conductivity of these pellets and researchers have had to rely on measurement and use of the finite element method. In this study, we designed a unit microcell model using a thermal resistance circuit to calculate the effective thermal conductivity on the basis of the microstructure characteristics by using the aspect ratio and compared the results with those of reported metallic UO₂ microcell pellets. In particular, using the thermal conductivity calculated by our model, the fuel centerline temperature of Cr microcell pellets on the 5th day of the Halden irradiation test was predicted within 6% error from the measured value.

• Journal of Welding and Joining
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• v.6 no.1
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• pp.21-27
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• 1988

This paper describes weldability of dissimilar metal plates with YAG laser for the use of a small-size electronic spring parts. Effects of welding conditions, combination of plates, thickness of upper plate are examined in relation to welding strength and microstructure of welded region. The obtained results are summarized as follows. Welding defects such as cavity and crack showed a tendency to easily occur in the case where 1) pulse duration is short, 2) laser power is high, 3) PBS plate with high thermal diffusivity is used for lower plate. Among these defects, the occurrence of cavity cased a drop of welding strength. This results from the reduction of welding area between upper and lower plates. In SK-5/SUS304 plates (thickness: 0.2/0.4mm/, welding strength was the highest in welding conditions: laser power is 30J/pulse, pulse duration 9ms, amount of defocus +2mm.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.23-33
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• 1999

A finite element method was employed fort thermal and stress analyses of an IGBT module of 3-phase full bridge. The effect of material parameters such as substrate material, substrate area, solder thickness on the temperature and stress distributions of the module packages has been investigated. Thermal analysis results have also been compared by setting of boundary conditions such as equivalent heat transfer coefficient or constant temperature at a base metal surface of the package. The increase of ceramic substrate area up to 3 times does little contribution to the reduction(8.9%) of thermal resistance, while contributed a lot to the reduction(60%) of thermal stress. Thicker solder resulted in higher thermal resistance but did slightly reduced thermal stresses. It is revealed by the stress analysis that maximum stress was induced at the region of copper pads which are bonded with ceramic substrate.

• Progress in Superconductivity and Cryogenics
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• v.23 no.4
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• pp.61-69
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• 2021

This paper presents the analysis and experiment results on the electrical and thermal characteristics of metal insulation (MI) REBCO racetrack coil, which was wound with stainless steel (SS) tape between turn-to-turn layers, under rotating magnetic field and conduction cooling system. Although the field windings of superconducting rotating machine are designed to operate on a direct current, they may be subjected to external magnetic field due to the unsynchronized armature windings during electrical or mechanical load fluctuations. The field windings show the voltage and magnetic field fluctuations and the critical current reduction when they are exposed to an external magnetic field. Moreover, the cryogenic cooling conditions are also identified as the factors that affect the electrical and thermal characteristics of the HTS coil because the characteristic resistance changes according to the cryogenic cooling conditions. Therefore, it is necessary to investigate the effect of external magnetic field on the electrical and thermal characteristics of MI-SS racetrack coil for further development reliable HTS field windings of superconducting rotating machine. First, the major components of the experiment test (i.e., HTS racetrack coil construction, armature winding of 75 kW class induction motor, and conduction cooling system) were fabricated and assembled. Then, the MI racetrack coil was performed under liquid nitrogen bath and conduction cooling conditions to estimate the key parameters (i.e., critical current, time constant, and characteristic resistance) for the test coil in the steady state operation. Further, the test coil was charged to the target value under conduction cooling of 35 K then exposed to the rotating magnetic field, which was generated by three phrase armature windings of 75 kW class induction motor, to investigate the electrical and thermal characteristics during the transient state.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.293.1-293.1
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• 2016

Various materials including conductive, dielectric, and semi-conductive materials, constitute suitable candidates for printed electronics. Metal nanoparticles (e.g. Ag, Cu, Ni, Au) are typically used in conductive ink. However, easily oxidized metals, such as Cu, must be processed at low temperatures and as such, photonic sintering has gained significant attention as a new low-temperature processing method. This method is based on the principle of selective heating of a strongly absorbent film, without light-source-induced damage to the transparent substrate. However, Cu nanoparticles used in inks are susceptible to the growth of a native copper-oxide layer on their surface. Copper-oxide-nanoparticle ink subjected to a reduction mechanism has therefore been introduced in an attempt to achieve long-term stability and reliability. In this work, a flash-light sintering process was used for the reduction of an inkjet-printed Cu(II)O thin film to a Cu film. Using a photographic lighting instrument, the intensity of the light (or intense pulse light) was controlled by the charged power (Ws). The resulting changes in the structure, as well as the optical and electrical properties of the light-irradiated Cu(II)O films, were investigated. A Cu thin film was obtained from Cu(II)O via photo-thermal reduction at 2500 Ws. More importantly, at one shot of 3000 Ws, a low sheet resistance value ($0.2527{\Omega}/sq.$) and a high resistivity (${\sim}5.05-6.32{\times}10^{-8}{\Omega}m$), which was ~3.0-3.8 times that of bulk Cu was achieved for the ~200-250-nm-thick film.