• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.379-381
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• 2009

The simulation model for metal-supported Solid Oxide Fuel Cell(SOFC) is developed in this study. Open circuit voltage is calculated using Nernst equation and Gibbs free energy is required by thermodynamic. The exchange current densities are compared with experimental results since exchange current density is most effective factor for the activation loss. Liu's study is used for the exchange current density of cathode, BSCF, and Koide's result is applied for the exchange current density of anode, Ni/YSZ. For the ohmic loss, ionic conductivity of YSZ is described from Kilner's mode and the data are compared with Wanzenberg's experimental data. Diffusivity is an important factor for the mass transfer through the porous medium. Both binary diffusion and Knudsen diffusion are considered as the diffusion mechanism. For validation, simulation results at this work are compared with our experimental results.

• ETRI Journal
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• v.29 no.6
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• pp.808-810
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• 2007

We demonstrate 10 Gbps optical signal transmission via long-range surface plasmon polaritons (LR-SPPs) in a very thin metal strip-guided geometry. The LR-SPP waveguide was fabricated as a 14 nm thick, 2.5 ${\mu}m$ wide, and 4 cm long gold strip embedded in a polymer and pigtailed with single-mode fibers. The total insertion loss of 16 dB was achieved at a wavelength of 1.55 ${\mu}m$ as a carrier wave. In a 10 Gbps optical signal transmission experiment, the LR-SPP waveguide exhibits an excellent eye opening and a 2.2 dB power penalty at $10^{-12}$ bit error rate. We confirm, for the first time, that LR-SPPs can efficiently transfer data signals as well as the carrier light.

• Nuclear Engineering and Technology
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• v.41 no.1
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• pp.21-38
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• 2009

The use of multi scale modeling concepts and simulation techniques to study the destabilization of an ultrathin layer of oxide interface between a metal substrate and the surrounding environment is considered. Of particular interest are chemo-mechanical behavior of this interface in the context of a molecular-level description of stress corrosion cracking. Motivated by our previous molecular dynamics simulations of unit processes in materials strength and toughness, we examine the challenges of dealing with chemical reactivity on an equal footing with mechanical deformation, (a) understanding electron transfer processes using first-principles methods, (b) modeling cation transport and associated charged defect migration kinetics, and (c) simulation of pit nucleation and intergranular deformation to initiate the breakdown of the oxide interlayer. These problems illustrate a level of multi-scale complexity that would be practically impossible to attack by other means; they also point to a perspective framework that could guide future research in the broad computational science community.

• Journal of Welding and Joining
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• v.3 no.1
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• pp.40-45
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• 1985

Wire meling characteristics were examined with variation of gas formers such as $MgCO_3, CaCO_3 and Li_ 2CO_ 3$ by self-shielded flux cored arc welding. The flux cored wire of overlap type was welded by DCRP. The results obtainedareas follows. 1) Drop type was observed with no gas former, repelled type with MgCO_3$ added and short circuit type with $Li_2CO_3$ added. The variation of transfer mode was related to the blowing force of $CO_2$ gas and the surface tension of the slag. 2) Droplet size increased with adding gas formers due to the effect of $CO_2$ gas cushion. 3) Core spikes were observed more frequently with increasing the amount of gas formers.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.26 no.5
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• pp.682-687
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• 2022

In this paper, the research results on monolithic three-dimensional integrated-circuit (M3DICs) stacked with tunneling field effect transistors (TFETs) are introduced. Unlike metal-oxide-semiconductor field-effect transistors (MOSFETs), TFETs are designed differently from the layout of symmetrical MOSFETs because the source and drain of TFET are asymmetrical. Various monolithic 3D inverter (M3D-INV) structures and layouts are possible due to the asymmetric structure, and among them, a simple inverter structure with the minimum metal layer is proposed. Using the proposed M3D-INV, this M3D logic gates such as NAND and NOR gates by sequentially stacking TFETs are proposed, respectively. The simulation results of voltage transfer characteristics of the proposed M3D logic gates are investigated using mixed-mode simulator of technology computer aided design (TCAD), and the operation of each logic circuit is verified. The cell area for each M3D logic gate is reduced by about 50% compared to one for the two-dimensional planar logic gates.

• Korean Journal of Metals and Materials
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• v.48 no.1
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• pp.90-100
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• 2010

Micro-conductive patterns were microfabricated on an insulating substrate ($SiO_2$) surface by a selective electroless nickel plating process in order to investigate the formation of seed layers. To fabricate micro-conductive patterns, a thin layer of metal (Cu.Cr) was deposited in the desired micropattern using laser-induced forward transfer (LIFT). and above this layer, a second layer was plated by selective electroless plating. The LIFT process. which was carried out in multi-scan mode, was used to fabricate micro-conductive patterns via electroless nickel plating. This method helps to improve the deposition process for forming seed patterns on the insulating substrate surface and the electrical conductivity of the resulting patterns. This study analyzes the effect of seed pattern formation by LIFT and key parameters in electroless nickel plating during micro-conductive pattern fabrication. The effects of the process variables on the cross-sectional shape and surface quality of the deposited patterns are examined using field emission scanning electron microscopy (FE-SEM) and an optical microscope.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.810-813
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• 2003

Wide spread using of mobile and handy electronic apparatus is giving rise to a question on the harmfulness of health and causing troubles when electical and electronic equipments are in use. This paper reports on the experimental results obtained by using a pliable and structured specimen that has a long shape aperture, made of stainless steel fibers. Based on the TEM mode transfer structure that was designed and manufactured through HFSS, we measured electromagnetic shielding effectives, where the network analyzer was applied. We could draw a conclusion from this research that the metal fabric showed a good electromagnetic shielding effect, mainly by means of the good reflex loss at the fiber surface. Even though the material itself possesses a good absorption loss. the specimen revealed that structural factors. e.g.. the shape of the aperture. the size of the aperture, etc., can have a more influence on the shielding effect than the components of material have. A special notice is required for modeling and analyzing the electromagnetic characteristics of metal fabrics, because there exists a strong possibility that multiple reflection can happen on the surface of metal fibers. which can presume a model of fiber bundle and fabric structure.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.5
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• pp.360-366
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• 2020

Focused electron beams with high energy acceleration are versatile probes. Focused electron beams can be used for high-resolution imaging and multi-mode nanofabrication, in combination with, molecular precursor delivery, in an electron microscopy environment. A high degree of control with atomic-to-microscale resolution, a focused electron beam allows for precise engineering of a graphene-based field-effect transistor (FET). In this study, the effect of electron irradiation on a graphene FET was systematically investigated. A separate evaluation of the electron beam induced transport properties at the graphene channel and the graphene-metal contacts was conducted. This provided on-demand strategies for tuning transfer characteristics of graphene FETs by focused electron beam irradiation.

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.105-108
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• 2001

4 32-bit RISC core is designed for embedded application and DSP. This processor offers low power consumption by fully static operation and compact code size by efficient instruction set. Processor performance is improved by wing conditional instruction execution, block data transfer instruction, multiplication instruction, bunked register file structure. To support compact code size of embedded application, It is capable cf executing both 16-bit instructions and 32-bit instruction through mixed mode instruction conversion Furthermore, for fast MAC operation for DSP applications, the processor has a dedicated hardware multiplier, which can complete a 32-bit by 32-bit integer multiplication within seven clock cycles. These result in high instruction throughput and real-time interrupt response. This chip is implemented with 0.35${\mu}{\textrm}{m}$, 4- metal CMOS technology and consists of about 50K gate equivalents.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.8
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• pp.433-437
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• 2000

We fabricated switch module of ATM(Asynchronous Transfer Mode) exchange system with MCM-C(MultiChip Module Co-fired) technology and measured its electrical characteristics. Green tape was used as substrate and Au/Ag paste was used to form the interconnect layers. The via holes were made by drill and filled with metal paste usign screen method. After manufacturing the substrate, chips and passive components were assembled on the substrate. In electrical test, the module showed the output signal of 46.9MHz synchronized with input signal. In the view of substrate size reduction, the area of MCM switch module was 35% of conventional hybrid switch module.