• 한국산학기술학회논문지
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• 제13권3호
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• pp.1002-1007
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• 2012

Pillar의 제조 방법은 진공유리 및 반도체 디스플레이 분야에서 사용되는 핵심공정 중 하나이다. Pillar는 스크린 인쇄 방식을 통하여 배치할 수 있으나 시료의 성분에 따라 메탈마스크의 패턴을 전부 통과하지 못하거나 점도에 따라 통과된 혼합물이 본래의 형상을 유지 못하는 경우가 발생한다. 본 연구에서는 알루미나와 실리카 기반의 무기화합물을 이용하여 스크린 인쇄를 통해 pillar를 배치하였다. 실험계획법의 하나인 혼합물 설계를 이용함으로써 실험횟수를 줄이고 진공유리 pillar의 조성을 설계할 수 있는 방법을 제시하고자 한다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.163-166
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• 2003

Laser-Induced Thermal Imaging (LITI) is a laser addressed patterning process and has unique advantages, such as high-resolution patterning with over-all position accuracy of the imaged stripes within 2.5 micrometer and scalability to large-size mother glass. This accuracy is accomplished using real-time error correction and a high -resolution stage control system that includes laser interferometers. Here the new concept of mixed hybrid system which complement the advantages of small molecular and polymeric materials for use as an OLED; our system can realize the easy processing of polymers and high luminance efficiency of recently developed small molecules. LITI process enables to pattern the stripes with excellent thickness uniformity and multi-stacking of various functional layers without using any type of fine metal shadow mask. In this study, we report a full-color hybrid OLED using the multi-layered structure of small molecular/polymeric species.

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.65-68
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• 2013

A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process. A selective solder bumping mechanism without the mask is based on the material design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 ${\mu}m$ is, successfully, formed.

• Journal of Welding and Joining
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• 제27권1호
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• pp.85-89
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• 2009

Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengos were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under $5^{\circ}$ and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips.

• 한국생산제조학회지
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• 제24권3호
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• pp.314-319
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• 2015

Invar is a compound metal of Fe-Ni system contained 36.5% Ni. The characteristic of invar is that the coefficient of thermal expansion is $1.0{\times}10^{-6}cm/^{\circ}C$. It is approximately 10 times smaller than series of steel. Because of this low thermal expansion characteristic of Invar, it is used to shadow mask of display device such as UHDTV or OLED TV. In this study, pulse current from pulse generator instead of DC current is used to overcome the disadvantages of the conventional electrochemical machining. Pulsed current with different duty factor in PECM affect the precise geometry. Pulse electrochemical machining is conducted to machine the micro hole to the invar sheet with different duty factor. The machined shape and overcut of invar sheet with different duty factor is observed by optical microscope and scanning electron microscope (SEM).

• E2M - 전기 전자와 첨단 소재
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• 제10권10호
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• pp.1029-1033
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• 1997

A prototype MFSFET using ferroelectric fluoride BaMgF$_4$as a gate insulator has been successfully fabricated with the help of 2 sheets of metal mask. The fluoride film was deposited in an ultrai-high vacuum system at a substrate temperature of below 30$0^{\circ}C$ and an in-situ post-deposition annealing was conducted for 20 seconds at $650^{\circ}C$ in the same chamber. The interface state density of the BaMgF$_4$/Si(100) interface calculated by a MFS capacitor fabricated on the same wafer was about 8$\times$10$^{10}$ /cm$^2$.eV. The I$_{D}$-V$_{G}$ characteristics of the MFSFET show a hysteresis loop due to the ferroelectric nature of the BaMgF$_4$film. It is also demonstrated that the I$_{D}$ can be controlled by the “write” plus which was applied before the measurements even at the same “read”gate voltage.ltage.

• 반도체디스플레이기술학회지
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• 제11권1호
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• pp.73-78
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• 2012

In this study, the optimal process condition was induced about the pillar arrangement process of applying the screen printing method in the manufacture process of vacuum glazing panel. The high precision screen printing is technology which pushes out the paste and spreads it by using the squeegee on the stainless steel plate in which the pattern is formed. The screen printing method is much used in the flat panel display field including the LCD, PDP, FED, organic EL, and etc for forming the high precision micro-pattern. Also a number of studies of screen printing method have been conducted as the method for the cost down through the improvement of productivity. The screen printing method has many parameters. So we used Taguchi method in order to decrease test frequencies and optimize this parameters efficiently. In this study, experiments of pillar arrangement were performed by using Taguchi experimental design. We analyzed experimental results and obtained optimal conditions which are 4 m/s of squeegee speed, $40^{\circ}$ of squeegee angle and distance between metal mask and glass.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.90.2-90.2
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• 2013

Vertically-aligned silicon nanostructure arrays (SNAs) have been drawing much attention due to their useful electrical properties, large surface area, and quantum confinement effect. SNAs are typically fabricated by chemical vapor deposition, reactive ion etching, or wet chemical etching. Recently, metal-assisted chemical etching process, which is relatively simple and cost-effective, in combination with nanosphere lithography was recently demonstrated for vertical SNA fabrication with controlled SNA diameters, lengths, and densities. However, this method exhibits limitations in terms of large-area preparation of unperiodic nanostructures and SNA geometry tuning independent of inter-structure separation. In this work, we introduced the layerby- layer deposition of polyelectrolytes for holding uniformly dispersed polystyrene beads as mask and demonstrated the fabrication of well-dispersed vertical SNAs with controlled geometric parameters on large substrates. Additionally, we present a new means of building in vitro neuronal networks using vertical nanowire arrays. Primary culture of rat hippocampal neurons were deposited on the bare and conducting polymer-coated SNAs and maintained for several weeks while their viability remains for several weeks. Combined with the recently-developed transfection method via nanowire internalization, the patterned vertical nanostructures will contribute to understanding how synaptic connectivity and site-specific perturbation will affect global neuronal network function in an extant in vitro neuronal circuit.

• 한국초전도ㆍ저온공학회논문지
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• 제25권4호
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• pp.24-27
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• 2023

Until now, many research activities have been conducted to commercialize high-temperature superconducting (HTS) wires for electric applications. Most of all researchers have focused on enhancing the piece length, critical current density, mechanical strength, and throughput of HTS wires. Recently, HTS magnet for generating high magnetic field shows degraded performance due to the deformation of HTS wire by high electro-magnetic force. The deformation can be derived from widthwise thickness non-uniformity of HTS wire mainly caused by wet processes such as electro-polishing of metal substrate and electro-plating of copper. Gradient sputtering process is designed to improve the thickness uniformity of HTS wire along the width direction. Copper stabilizing layer is deposited on HTS wire covered with specially designed mask. In order to evaluate the thickness uniformity of HTS wire after gradient sputtering process, the thickness distribution across the width is measured by using the optical microscope. The results show that the gradient deposition process is an effective method for improving the thickness uniformity of HTS wire.

• 한국산업보건학회지
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• 제26권2호
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• pp.147-158
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• 2016

Objectives: The objective of this study was to evaluate the assessment of exposure to welding fume and heavy metals among construction welders. Methods: Activity-specific personal air samplings(n=206) were carried out at construction sites of three apartment, two office buildings, and two plant buildings using PVC(poly vinyl chloride) filters with personal air samplers. The concentration of fumes and heavy metals were evaluated for five different types of construction welding jobs: general building pipefitter, chemical plant pipefitter, boiler maker, ironworker, metal finishing welder. Results: The concentration of welding fumes was highest among general building pipefitters($4.753mg/m^3$) followed by ironworkers($3.765mg/m^3$), boilermakers($1.384mg/m^3$), metal finishing welders($0.783mg/m^3$), chemical pipefitters($0.710mg/m^3$). Among the different types of welding methods, the concentration of welding fumes was highest with the $CO_2$ welding method($2.08mg/m^3$) followed by SMAW(shield metal arc welding, $1.54mg/m^3$) and TIG(tungsten inert gas, $0.70mg/m^3$). Among the different types of workplace, the concentration of welding fumes was highest in underground workplaces($1.97mg/m^3$) followed by outdoor($0.93mg/m^3$) and indoor(wall opening as $0.87mg/m^3$). Specifically comparing the workplaces of general building welders, the concentration of welding fumes was highest in underground workplaces($7.75mg/m^3$) followed by indoor(wall opening as $2.15mg/m^3$). Conclusions: It was found that construction welders experience a risk of expose to welding hazards at a level exceeding the exposure limits. In particular, for high-risk welding jobs such as general building pipefitters and ironworkers, underground welding work and $CO_2$ welding operations require special occupational health management regarding the use of air supply and exhaust equipment and special safety and health education and fume mask are necessary. In addition, there is a need to establish construction work monitoring systems, health planning and management practices.