Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Research of Optimum Reflow Process Condition for 0402 Electric Parts

0402칩의 무연솔더링 최적공정 연구

  • Bang, Jung-Hwan (Advanced Welding & Joining Service Center, Korea Institute of Industrial Technology) ;
  • Lee, Se-Hyung (Advanced Welding & Joining Service Center, Korea Institute of Industrial Technology) ;
  • Shin, Yue-Seon (Advanced Welding & Joining Service Center, Korea Institute of Industrial Technology) ;
  • Kim, Jeong-Han (Advanced Welding & Joining Service Center, Korea Institute of Industrial Technology) ;
  • Lee, Chang-Woo (Advanced Welding & Joining Service Center, Korea Institute of Industrial Technology)
  • Published : 2009.02.28
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Abstract

Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengos were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under $5^{\circ}$ and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips.

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References

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