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http://dx.doi.org/10.5781/KWJS.2009.27.1.085

Research of Optimum Reflow Process Condition for 0402 Electric Parts  

Bang, Jung-Hwan (Advanced Welding & Joining Service Center, Korea Institute of Industrial Technology)
Lee, Se-Hyung (Advanced Welding & Joining Service Center, Korea Institute of Industrial Technology)
Shin, Yue-Seon (Advanced Welding & Joining Service Center, Korea Institute of Industrial Technology)
Kim, Jeong-Han (Advanced Welding & Joining Service Center, Korea Institute of Industrial Technology)
Lee, Chang-Woo (Advanced Welding & Joining Service Center, Korea Institute of Industrial Technology)
Publication Information
Journal of Welding and Joining / v.27, no.1, 2009 , pp. 85-89 More about this Journal
Abstract
Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengos were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under $5^{\circ}$ and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips.
Keywords
Surface mount technology; Pb-free soldering; Joining strength; 0402 chips; Self alignment;
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