• The Journal of Korean Institute of Communications and Information Sciences
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• v.38C no.8
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• pp.725-732
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• 2013

Recently, various applications for LED lightings are growing continuously due to their better performances such as low power consumption, longer life time, operation speed, controllability, high quality color rendering, and sustainability. However, in developing the high-powered LEDs illumination system, heat-sink problem is one of the important obstacle. In this paper, a heat-sink design with multi-layered structure for high-powered LEDs is proposed, which is composed of metal core PCB, heat-pipes, heat-sink plates, and fans. And also, in this paper, a design for LED controls using DMX512 protocols through RS-485 communications is proposed, which is considered as de facto international standard in LEDs illumination control and is widely used in landscape lighting and stage lighting. In this paper, LED control and its application techniques are introduced and the method of wireless remote control for main controller is proposed.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• Journal of the Korean Society of Safety
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• v.27 no.3
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• pp.57-62
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• 2012

The purpose of this paper is to find dangerous factors of a water purifier when water leaks due to inappropriate use and analyze the patterns of damaged parts in order to provide data for the examination of the cause of the problem. If the water purifier is inspected and managed by a non-specialist, when the FLC(Float Level Controller) at the top is inclined, water leakage may occur to the water purifier. The leaked water flows onto the cables and hoses and enters the thermostat terminal, heater, PCB, power supply connection connector, etc., becoming a dangerous factor that may cause a system failure, fire, etc. Due to the water that entered the input terminal, low noise and white smoke were generated at first. However, the flame gradually propagated due to the continuous inflow of moisture. It was found that when moisture reached the PCB, a carbonized conductive path was formed at the varistor terminal, input terminal, semiconductor device terminal, etc., and the flame became larger, which might result in a fire. From the metal microscope analysis of a damaged condenser terminal, it was found that the amorphous structure unique to copper cable disappeared, and voids, boundary surface and disorderly fine particles occurred. Also, in the case of the connector into which moisture penetrated, fusion and deformation occurred at the cable connection clips. The result of analysis of the power supply cable connector using a thermal image camera showed that most of the heat was generated from the cable connection clips and the temperature at the connection center was normal.

• Resources Recycling
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• v.28 no.1
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• pp.62-72
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• 2019

Generally, $H_2SO_4$ and Cu metal are used as raw materials for producing copper sulfate. The study relates to a method for producing copper sulfate using electrowinning from a waste solution of copper chloride. Uses are used for copper plating for industry, plating, feed, agriculture, electronic grade PCB. Conventional methods for producing copper sulfate have a problem of a large amount of waste water and a high energy cost. A study on the production method of copper sulfate ($CuSO_4$), which is the most used among copper (Cu) compounds, has a low process operation ratio, a small amount of waste water, and a simple manufacturing process. It is easy to remove Na, Ca, Mg, and Al as impurities by using a cationic membrane. At the same time, high purity copper powder could be recovered by an electrowinninng method. Using the recovered copper powder, high purity copper sulfate could be produced.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.49 no.2
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• pp.116-125
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• 2013

Jigging and angling fishery is prevalent in the East Sea of Korea and this fishery needs many lamps to attract the fish. And the fishing boat uses 24~47 ballasts by the vessel's tonnage to turn on the fishing lamp. A 3.5kW magnetic-type ballast being currently used at many fishing boats can drive two 1.5kW metal-halide lamps. Meanwhile, this ballast has large weight (25kg) and volume. Therefore it is one of reason for the over-consumption of energy and the fire, resulted from overheat and electrical short, occurs occasionally because the ballast is installed at narrow and hot engine room. In addition, most of magnetic ballast has several problems such as periodic condenser replacement, low energy efficiency and making lamp short life, etc. So it is necessary to improve or develop newly the electronic ballast, which has to be smaller, lighter and more efficient. An electronic ballast was designed for the fishing boat by considering duration and electromagnetic interference in the study. Its weight and volume are respectably 40% and 66% compared to current ballast on the basis of PCB. The metal-halide lamp's spectrum of the designed ballast was nearly same to that of the current ballast in the test of lighting. In particular, the light stability was improved and there isn't any radio interference. As mentioned above, it is expected that the developed electronic ballast can replace current magnetic ballast because of many advantages related to energy-saving.

• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.530-538
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• 2016

There is a close relationship between the performance and the heat generation of the electronic device. Heat generation causes a significant degradation of the durability and/or efficiency of the device. It is necessary to have an effective method to release the generated heat. Based on demands of the printed circuit board (PCB) manufacturing, it is necessary to develop a robust and reliable plating technique for substrates with high thermal conductivity, such as alumina ($Al_2O_3$), aluminium nitride (AlN), and silicon nitride ($Si_3N_4$). In this study, the plating of metal layers on an insulating silicon nitride ($Si_3N_4$) ceramic substrate was developed. We formed a Pd-$TiO_2$ adhesion layer and used APTES(3-Aminopropyltriethoxysilane) to form OH groups on the surface and adhere the metal layer on the insulating $Si_3N_4$ substrate. We used an electroless Ni plating without sensitization/activation process, as Pd particles were nucleated on the $TiO_2$ layer. The electrical resistivity of Ni and Cu layers is $7.27{\times}10^{-5}$ and $1.32{\times}10^{-6}ohm-cm$ by 4 point prober, respectively. The adhesion strength is 2.506 N by scratch test.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.30 no.2
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• pp.104-110
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• 2019

In this paper, a complementary metal oxide semiconductor(CMOS) power amplifier(PA) integrated circuit operating in the 900 MHz band for long-term evolution(LTE) communication systems is presented. The output matching network based on a transformer was implemented on a printed circuit board for low loss. Simultaneously, to achieve high efficiency of the PA, the second harmonic impedances are controlled. The CMOS PA was fabricated using a $0.18{\mu}m$ CMOS process and measured using an LTE uplink signal with a bandwidth of 10 MHz and peak to average power ratio of 7.2 dB for verification. The implemented CMOS PA module exhibits a power gain of 24.4 dB, power-added efficiency of 34.2%, and an adjacent channel leakage ratio of -30.1 dBc at an average output power level of 24.3 dBm.

• Korean Journal of Environmental Biology
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• v.26 no.4
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• pp.330-342
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• 2008

A comprehensive quality survey for PCDDs/PCDFs and coplanar PCBs as well as heavy metals (Cu, Zn, Cd and Pb) in sediments has been investigated in August 2006, Korea. Monitoring was undertaken at five streams representing different surrounding environments throughout Juwang and Gapyeong streams (reference sites), Jungrang stream (dense population site), Ansan stream (mixed small population and industrial site), and Siheung stream (heavy industrial site). The levels of heavy metal in samples were found to be significantly higher in sediment from Siheung stream compared to those of other stream sites. The heavy metal concentrations (dry weight basis) in sediment from Siheung stream were as follows; Cd (3.7 ${\mu}g$/g), Pb (1,295 ${\mu}g$/g), Cu (713.4 ${\mu}g$/g) and Zn (358.1 ${\mu}g$/g). Among 12 coplanar PCBs and 17 PCDDs/PCDFs selected as target compounds in this study, PCB (IUPAC no. 118) and OCDD were the most abundant congeners found in all sediment samples, followed by 1,2,3,4,6,7,8-HpCDD, OCDF and 1,2,3,4,6,7,8HpCDF as well as PCB (IUPAC no. 105). These results were shown to be in the same trend as the sediment samples of other countries. The levels of PCDDs/PCDFs/coplanar PCBs in sediment samples were expressed as concentrations and WHO- TEQ values. The PCDDs/PCDFs/coplanar PCBs concentrations and their WHO-TEQ values in sediment from Siheung stream were remarkably high. The levels detected were 788.16 pg/g and 36.080 pg WHO-TEQ/g dry weight for PCDDs/ PCDFs and 314 pg/g and 0.4189 pg WHO-TEQ/g dry weight for coplanar PCBs, respectively, beyond the safety level of sediment value 20 pg WHO-TEQ/g. Sediment samples of the five streams were also monitored by sensitive biomarkers using insect immune responses: hemocyte-spreading behavior and immune-associated enzyme activities of phospholipase A$_2$ (PLA$_2$) and phenoloxidase. Organic extracts of Siheung and Jungrang sediments significantly interfered with the hemocytespreading behavior, whereas those of Ansan, Gapyeong, and Juwang did not. These organic extracts did not inhibit the PLA$_2$ and phenoloxidase activities. However, phenoloxidase was highly susceptible to exposure to aqueous extracts in all site sediments. In comparison, PLA$_2$ activities of the hemocytes were significantly inhibited only by aqueous extracts of Siheung, Jungrang, and Gapyeong sediments, but not by those of Ansan and Juwang. Despite some disparity between bioand chemical monitoring results, the biomarkers can be recommended as a device warning the contamination of biohazard environmental chemicals because of a fast and inexpensive detection method.

• Resources Recycling
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• v.11 no.2
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• pp.28-35
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• 2002

A study on the grinding characteristics of metal components in printed circuit boards (PCBs) scrap by a swing-hammer typeimpact mill was conducted. The PCBs scrap crushed to sizes less than 3 mm were pulverized to liberate metal components by the impact mill. The effect of rotation speed of hammer on the grinding characteristics was investigated. The particle size distribution and degree of liberation of metals such as copper and solder were measured. The effect of rotation speed and particle size on the shape sorting of metal Particles from milled PCBs was investigated using an inclined vibrating Plate. At the hammer speed of 61.3 m/s about 80% of the copper particles became larger than 297 $\mu$m while 90% of solder particles was smaller than 297 $\mu$m. In the shape sorting method, the recovery location becomes shorter as the rotation speed of hammer increases. The recovery location for particles larger than 297$\mu$m was shorter than for particles sized between 149$\mu$m and 297$\mu$m. As the recovery location becomes shorter, KI value increases towards unity while $\phi_{c}$ value decreases towards unity indicating the more roundness of metal particles.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.34 no.11
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• pp.84-91
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• 2006

Recently, all the electrical parts for satellite application are required more strong against cosmic rays, because spacecraft's life time and function are depending on the their conditions. Also, a TID effect test was undertaken with units and/or subsystems which are already assembled on the PCB in past time. However, it is very hard to know and analyze that some abnormal states are appeared after launch. Moreover, it is necessary to perform a test of TID effects based on the parts level for preparing preliminary data in cosmic rays. Therefore, this paper presents a test-bed to perform a TID effect test of Metal-Oxide Semiconductor Field Effect Transistor (MOSFET) which is a fundamental element for electronics.