• 한국통신학회논문지
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• 제38C권8호
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• pp.725-732
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• 2013

최근 LED의 저전력, 장수명, 동작 속도, 제어성, 고품질의 색 연출성, 지속 가능성 등의 이유로, LED 응용 분야가 확대되고 있다. 그러나 고출력 LED 조명 시스템을 구현하는데 있어, 방열은 큰 걸림돌이 되고 있다. 본 논문에서는 고출력 투광등 설계를 위한 방열 방안으로 메탈 PCB 설계, 열전 소자, 히트 파이프, 방열판, 팬(fan) 등의 적층 연동 구조를 제안하고 구현 방안을 제시하였다. 아울러 본 논문에서는 RS-485 통신을 통한 DMX512 프로토콜 기반 LED 조명 시스템 제어 방안을 제시하였다. DMX512 프로토콜은 조명장치와 조명제어 모듈의 연결에 대한 사실상 세계적 표준이며 이를 활용한 무대 조명이나 경관 조명 시스템 개발이 지속적으로 이루지고 있다. 본 논문에서는 이를 이용한 LED 조명 제어 및 응용 기술을 소개하고 주제어기를 무선으로 원격 제어하는 방안을 제안하였다.

• Corrosion Science and Technology
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• 제6권6호
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• 한국안전학회지
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• 제27권3호
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• pp.57-62
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• 2012

The purpose of this paper is to find dangerous factors of a water purifier when water leaks due to inappropriate use and analyze the patterns of damaged parts in order to provide data for the examination of the cause of the problem. If the water purifier is inspected and managed by a non-specialist, when the FLC(Float Level Controller) at the top is inclined, water leakage may occur to the water purifier. The leaked water flows onto the cables and hoses and enters the thermostat terminal, heater, PCB, power supply connection connector, etc., becoming a dangerous factor that may cause a system failure, fire, etc. Due to the water that entered the input terminal, low noise and white smoke were generated at first. However, the flame gradually propagated due to the continuous inflow of moisture. It was found that when moisture reached the PCB, a carbonized conductive path was formed at the varistor terminal, input terminal, semiconductor device terminal, etc., and the flame became larger, which might result in a fire. From the metal microscope analysis of a damaged condenser terminal, it was found that the amorphous structure unique to copper cable disappeared, and voids, boundary surface and disorderly fine particles occurred. Also, in the case of the connector into which moisture penetrated, fusion and deformation occurred at the cable connection clips. The result of analysis of the power supply cable connector using a thermal image camera showed that most of the heat was generated from the cable connection clips and the temperature at the connection center was normal.

• 자원리싸이클링
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• 제28권1호
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• pp.62-72
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• 2019

일반적으로, 황산동을 제조하기 위한 원료는 $H_2SO_4$ 및 Cu 금속이 사용된다. 본 연구는 폐산, 폐염화동 폐기물부터 전해 채취법을 이용하여 황산동을 제조하는 방법에 관한 것이다. 황산구리의 용도는 공업용, 도금용, 사료용, 농업용, 전자급 PCB 동도금에 사용된다. 종래의 황산동 제조법은 다량의 폐수 및 에너지 비용이 높은 문제점이 있다. 구리(Cu) 화합물 중에서 가장 사용이 많이 되는 황산동($CuSO_4$)의 제조 방법에 관한 연구로서, 공정 운전비가 적고, 폐수 발생이 적으며, 제조 공정이 간단하다. 양이온 맴브레인을 이용하여 Na, Ca, Mg, Al을 불순물로서 제거하기 쉽다. 또한 동시에 전해 채취 방법으로 고 순도 구리 분말을 회수 할 수 있었다. 회수 된 구리 분말을 사용하여 고 순도 황산동을 제조 할 수 있었다.

• 수산해양기술연구
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• 제49권2호
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• pp.116-125
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• 2013

Jigging and angling fishery is prevalent in the East Sea of Korea and this fishery needs many lamps to attract the fish. And the fishing boat uses 24~47 ballasts by the vessel's tonnage to turn on the fishing lamp. A 3.5kW magnetic-type ballast being currently used at many fishing boats can drive two 1.5kW metal-halide lamps. Meanwhile, this ballast has large weight (25kg) and volume. Therefore it is one of reason for the over-consumption of energy and the fire, resulted from overheat and electrical short, occurs occasionally because the ballast is installed at narrow and hot engine room. In addition, most of magnetic ballast has several problems such as periodic condenser replacement, low energy efficiency and making lamp short life, etc. So it is necessary to improve or develop newly the electronic ballast, which has to be smaller, lighter and more efficient. An electronic ballast was designed for the fishing boat by considering duration and electromagnetic interference in the study. Its weight and volume are respectably 40% and 66% compared to current ballast on the basis of PCB. The metal-halide lamp's spectrum of the designed ballast was nearly same to that of the current ballast in the test of lighting. In particular, the light stability was improved and there isn't any radio interference. As mentioned above, it is expected that the developed electronic ballast can replace current magnetic ballast because of many advantages related to energy-saving.

• 한국표면공학회지
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• 제49권6호
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• pp.530-538
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• 2016

There is a close relationship between the performance and the heat generation of the electronic device. Heat generation causes a significant degradation of the durability and/or efficiency of the device. It is necessary to have an effective method to release the generated heat. Based on demands of the printed circuit board (PCB) manufacturing, it is necessary to develop a robust and reliable plating technique for substrates with high thermal conductivity, such as alumina ($Al_2O_3$), aluminium nitride (AlN), and silicon nitride ($Si_3N_4$). In this study, the plating of metal layers on an insulating silicon nitride ($Si_3N_4$) ceramic substrate was developed. We formed a Pd-$TiO_2$ adhesion layer and used APTES(3-Aminopropyltriethoxysilane) to form OH groups on the surface and adhere the metal layer on the insulating $Si_3N_4$ substrate. We used an electroless Ni plating without sensitization/activation process, as Pd particles were nucleated on the $TiO_2$ layer. The electrical resistivity of Ni and Cu layers is $7.27{\times}10^{-5}$ and $1.32{\times}10^{-6}ohm-cm$ by 4 point prober, respectively. The adhesion strength is 2.506 N by scratch test.

• 한국전자파학회논문지
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• 제30권2호
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• pp.104-110
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• 2019

본 논문에서는 long term evolution(LTE) 통신을 위한 900 MHz 대역에서 동작하는 CMOS 전력증폭기 집적회로 설계 결과를 제시한다. 출력단에서의 적은 손실을 위해 트랜스포머를 이용한 출력 정합 회로가 printed circuit board(PCB) 상에 구현되었다. 동시에, 2차 고조파 임피던스의 조정을 통해 전력증폭기의 고효율 동작을 달성하였다. 전력증폭기는 $0.18{\mu}m$ CMOS 공정을 이용하여 설계되었으며, 10 MHz의 대역폭 및 7.2 dB 첨두 전력 대 평균 전력비(PAPR)의 특성을 갖는 LTE up-link 신호를 이용하여 측정되었다. 제작된 전력증폭기 모듈은 평균 전력 24.3 dBm에서 34.2 %의 전력부가효율(PAE) 및 -30.1 dBc의 인접 채널 누설비(ACLR), 그리고 24.4 dB의 전력 이득을 갖는다.

• 환경생물
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• 제26권4호
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• pp.330-342
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• 2008

A comprehensive quality survey for PCDDs/PCDFs and coplanar PCBs as well as heavy metals (Cu, Zn, Cd and Pb) in sediments has been investigated in August 2006, Korea. Monitoring was undertaken at five streams representing different surrounding environments throughout Juwang and Gapyeong streams (reference sites), Jungrang stream (dense population site), Ansan stream (mixed small population and industrial site), and Siheung stream (heavy industrial site). The levels of heavy metal in samples were found to be significantly higher in sediment from Siheung stream compared to those of other stream sites. The heavy metal concentrations (dry weight basis) in sediment from Siheung stream were as follows; Cd (3.7 ${\mu}g$/g), Pb (1,295 ${\mu}g$/g), Cu (713.4 ${\mu}g$/g) and Zn (358.1 ${\mu}g$/g). Among 12 coplanar PCBs and 17 PCDDs/PCDFs selected as target compounds in this study, PCB (IUPAC no. 118) and OCDD were the most abundant congeners found in all sediment samples, followed by 1,2,3,4,6,7,8-HpCDD, OCDF and 1,2,3,4,6,7,8HpCDF as well as PCB (IUPAC no. 105). These results were shown to be in the same trend as the sediment samples of other countries. The levels of PCDDs/PCDFs/coplanar PCBs in sediment samples were expressed as concentrations and WHO- TEQ values. The PCDDs/PCDFs/coplanar PCBs concentrations and their WHO-TEQ values in sediment from Siheung stream were remarkably high. The levels detected were 788.16 pg/g and 36.080 pg WHO-TEQ/g dry weight for PCDDs/ PCDFs and 314 pg/g and 0.4189 pg WHO-TEQ/g dry weight for coplanar PCBs, respectively, beyond the safety level of sediment value 20 pg WHO-TEQ/g. Sediment samples of the five streams were also monitored by sensitive biomarkers using insect immune responses: hemocyte-spreading behavior and immune-associated enzyme activities of phospholipase A$_2$ (PLA$_2$) and phenoloxidase. Organic extracts of Siheung and Jungrang sediments significantly interfered with the hemocytespreading behavior, whereas those of Ansan, Gapyeong, and Juwang did not. These organic extracts did not inhibit the PLA$_2$ and phenoloxidase activities. However, phenoloxidase was highly susceptible to exposure to aqueous extracts in all site sediments. In comparison, PLA$_2$ activities of the hemocytes were significantly inhibited only by aqueous extracts of Siheung, Jungrang, and Gapyeong sediments, but not by those of Ansan and Juwang. Despite some disparity between bioand chemical monitoring results, the biomarkers can be recommended as a device warning the contamination of biohazard environmental chemicals because of a fast and inexpensive detection method.

• 자원리싸이클링
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• 제11권2호
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• pp.28-35
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• 2002

충격형 분채기에 의한 폐프린트배선기판(PCBs)의 분쇄과정에서 일어나는 금속성분의 분쇄특성에 대한 연구가 수행되었다. PCBs로부터 금속성분들을 단체분리하기 위하여 -3 mm로 파쇄한 다음 충격형 분쇄기를 사용하여 분쇄하였으며 햄머의 회전속도가 금속성분의 분쇄에 미치는 영향을 관찰하였다. 동과 땜납 등과 같은 금속성분들의 입도분포 및 단체분리도를 조사하였다. 경사진동판을 사용하는 PCBs 분쇄물로부터 금속입자들의 형상분리에서 햄머의 회전속도와 입자크기가 미치는 영향을 검토하였다 61.3 m/s 햄머속도에서 동 성분은 +297$\mu$m 입자가 80% 이었지만 땜납성분은 -297$\mu$m 입자가 90%에 달했다. 형상분리법에 의한 금속입자의분리 시 햄머의 회전속도가 클수록 회수위치가 짧았으며 +297 $\mu$m 입자의 회수위치가 -297~+149$\mu$m 입자보다 짧았다. 회수위치가 짧을수록 금속입자의 구형도가 좋았으며 KI 값은 KI=1 로 증가하고, $\phi_{c}$ 값은 $\phi_{c}$ =1로 감소하였다.

• 한국항공우주학회지
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• 제34권11호
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• pp.84-91
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• 2006

최근에 인공위성용 전자소자는 우주방사선에 좀 더 강한 소자를 요구되어진다. 왜냐하면, 인공위성의 수명과 기능은 우주방사선으로부터 영향을 받기 때문이다. 또한, 과거에는 부품단위의 우주방사선 시험을 수행하지 않고 유닛 또는 서브시스템 단위의 우주방사선 시험을 수행하였다. 게다가, 발사된 인공위성이 작동오류 상태에 있을 때 그 이유를 분석하기에는 그다지 쉬운 일은 아니다. 따라서, 발사 전 부품 단위 우주방사선 시험을 수행하여 주요 소자에 대한 우주방사선에 의한 영향을 분석 할 필요가 있으며, 지상에서 데이터를 확보할 필요가 있다. 그러므로, 본 논문에서는 모든 전자소자의 기본이라 할 수 있는 금속-산화막 반도체 전계효과 트랜지스터의 총이온화선량에 대한 영향 시험을 수행하기 위한 테스트 베드를 제안한다.