• Korean Journal of Materials Research
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• v.16 no.3
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• pp.151-156
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• 2006

A method for fabrication of nano-scale GaN structure by inductively coupled plasma etching is proposed, exploiting a thermal dewetting of Pt thin film as an etch mask. The nano-scale Pt metal islands were formed by the dewetting of 2-dimensional film on $SiO_2$ dielectric materials during rapid thermal annealing process. For the case of 30 nm thick Pt films, pattern formation and dewetting was initiated at temperatures greater $600^{\circ}C$. Controlling the annealing temperature and time as well as the thickness of the Pt metal film affected the size and density of Pt islands. The activation energy for the formation of Pt metal island was calculated to be 23.2 KJ/mole. The islands show good resistance to dry etching by a $CF_4$ based plasma for dielectric etching indicating that the metal islands produced by dewetting are suitable for use as an etch mask in the fabrication of nano-scale structures.

• Korean Journal of Materials Research
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• v.28 no.4
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• pp.208-213
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• 2018

Epitaxial ($11{\bar{2}}0$) a-plane GaN films were grown on a ($1{\bar{1}}02$) R-plane sapphire substrate with photoresist (PR) masks using metal organic chemical vapor deposition (MOCVD). The PR mask with striped patterns was prepared using an ex-situ lithography process, whereas carbonization and heat treatment of the PR mask were carried out using an in-situ MOCVD. The heat treatment of the PR mask was continuously conducted in ambient $H_2/NH_3$ mixture gas at $1140^{\circ}C$ after carbonization by the pyrolysis in ambient $H_2$ at $1100^{\circ}C$. As the time of the heat treatment progressed, the striped patterns of the carbonized PR mask shrank. The heat treatment of the carbonized PR mask facilitated epitaxial lateral overgrowth (ELO) of a-plane GaN films without carbon contamination on the R-plane sapphire substrate. Thhe surface morphology of a-plane GaN films was investigated by scanning electron microscopy and atomic force microscopy. The structural characteristics of a-plane GaN films on an R-plane sapphire substrate were evaluated by ${\omega}-2{\theta}$ high-resolution X-ray diffraction. The a-plane GaN films were characterized by X-ray photoelectron spectroscopy (XPS) to determine carbon contamination from carbonized PR masks in the GaN film bulk. After $Ar^+$ ion etching, XPS spectra indicated that carbon contamination exists only in the surface region. Finally, the heat treatment of carbonized PR masks was used to grow high-quality a-plane GaN films without carbon contamination. This approach showed the promising potential of the ELO process by using a PR mask.

• Journal of Magnetics
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• v.12 no.2
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• pp.81-83
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• 2007

Etching of NiFe films covered with an organic photo-resist or Ti was successfully performed by an inductively coupled plasma-reactive ion etching (ICP-RIE) system using $CHF_3/O_2/NH_3$ discharges exchanging $CHF_3$ for $CH_4$ gas gradually. Experimental results showed that the organic photo-resist mask can be applied to the NiFe etching. In the case of the Ti metal mask, it was found that the etching-selectivity Ti against NiFe was significantly varied from 7.3 to ${\sim}0$ by changing $CHF_3/CH_4/O_2/NH_3$ to $CH_4/O_2/NH_3$ discharges used in the ICP-RIE system. These results show that the present RIE of NiFe was dominated by a chemical reaction rather than a physical sputtering.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.6
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• pp.214-221
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• 2003

Tension mask assembly is positioned right behind the glass-made front panels of CRT type display devices. The frame-supported thin metal sheet contains numerous slits, through which electron beams are focused to enhance definition. Pretension is imposed on the masks, especially for enlarged flat screens, in order to avoid vibration due to acoustic or mechanical impact. High temperature assembly process subsequent to pretensioning, however, degenerates the creep resistance of common mask materials, and if tensile stress is high enough, tension on the mask may be loosened substantially due to creep deformation. In this study, the assembly is modeled as a combined structure of beams and wire array, and a numerical simulation is attempted for pretensioning followed by high temperature process. According to a model study, small amount of creep strain is likely to be generated, but its adverse influence is not negligible. Some structural modification measures to reduce the creep-induced tension loosening are proposed and evaluated. Also, optimal configuration of frame structure is sought for, which maintains high tension of masks and minimizes the possible creep of frame simultaneously.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.7
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• pp.37-41
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• 2004

We have formulated an empirical analytic model for the static characteristics of implanted vertical-cavity surface-emitting lasers (VCSELs). Specifically, we have derived analytic formulas for the threshold current, slope efficiency, dynamic resistance, and the output power and forward voltage at the operation current of 12 ㎃ in terms of the implant and metal-aperture radii by fitting the measured results. The radii of the metal aperture and implant mask of the 850 nm VCSELs range from 4 to 12.5 ${\mu}{\textrm}{m}$ and 7 to 17.5 ${\mu}{\textrm}{m}$ respectively. The model shows the way of tailoring the VCSEL characteristics by changing the mask dimensions only.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.12.1-12.1
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• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.6
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• pp.1034-1040
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• 2003

Tension mask is a part of CRT type devices, which is installed right behind glass-made front panel. Numerous slits on the thin metal sheet enable the electron beams emitted from posterior gun to be focused, resulting in enhanced definition. Flattened and enlarged displays necessitate the imposition of pretension on the masks, in order to improve the robustness of display quality against vibration or impact. High temperature assembly process subsequent to pretensioning, however, degenerates creep resistance of mask material, and common mask may become susceptible to undesirable elongation due to creep. Once tensile stress becomes high enough to induce creep deformation, pretension is substantially loosened. In this study, tension mask assembly is modeled as a combined structure of beams and wire array, and a numerical simulation is attempted for pretensioning followed by high temperature process. Based on a model study, creep occurrence is found to be probable and its adverse influence is quantified. As fur maintaining high tensile force, simply increasing pretension does not seem to be helpful. Instead, the structure of frame needs to be modified somehow, or material for mask needs to be selected properly.

• Information Display
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• v.22 no.3
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• pp.43-47
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• 2021

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.318-321
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• 2005

FIB (Focused ion Beam) milling on a 500-nm-thick silicon nitride membrane was studied in order to fabricate a high-resolution shadow mask, or called a nanostencil. The silicon nitride membrane was fabricated by MEMS processes of LPCVD, photolithography, ICP etching and bulk silicon etching. The apertures made by FIB milling and normal photolithography were compared. The square metal pattern deposited through FIB milled shadow mask showed 6 times smaller comer radius than the case of photolithography. The results show high resolution patterning could be achieved by local deposition through FIB milled shadow-mask.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.86-91
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• 2005

The stack, the core unit of the MCFC system, is composed of the three main parts which are the electrodes, the matrix keeping the electrolyte and the separator. Among these, the separator made of low carbon steel is manufactured by some sheet metal forming processes. The flatness of flange of the mask plate of the separator is crucial not only to enhance the stack performance but also to reduce the production cost. This study has focused on the enhancement of flatness of the mask plate flange by controlling some process parameters like the punch and die comer radii, the blank holding force, the friction coefficient and so on. The springback phenomenon occurring in the flange drawing process has been studied first using the finite element method (FEM) in order to understand what causes the springback. The distribution pattern of local longitudinal stress in the flanged part has been revealed very important in predicting the final shape of the flange. This fact has been backed up by the experimental results carried out with the developed test dies.