• Title/Summary/Keyword: Mechanics

Search Result 11,145, Processing Time 0.049 seconds

A Survey of Game Mechanics Simulation Methods (게임 메카닉스 시뮬레이션 방법에 관한 조사연구)

  • Chang, Hee-Dong
    • The KIPS Transactions:PartA
    • /
    • v.12A no.5 s.95
    • /
    • pp.441-450
    • /
    • 2005
  • As game markets are rapidly growing, the cost and period of game development are both increasing. These imply that the game development projects require more professional management of the project. Game mechanics is an algorithm of the gameplay on a specific game-platform. Game mechanics is concentrated on engineering elements of the game and its quality should be continuously managed from the design phase to the implementation phase. In the design phase, useful methods that can analyze the quality of game mechanics are the simulations. There are several simulation methods of the game mechanics but each method has limited use range because of its characteristics. In this Paper, we survey the game mechanics simulation methods and analyze the characteristics of each method. By the analyzed results, the Petri net model simulation method is good for analyzing total quality of no-error, optimization, and play-balance of the game mechanics but others are not.

Effects of Glass Frit Size on the Sintering Behavior of Cu Termination Paste in MLCC (Glass Frit의 입도가 MLCC 외부전극 Paste의 소결거동에 미치는 영향)

  • Lee, Kyu-Ha;Jeon, Byung-Jun;Kim, Chang-Hoon;Kwon, Young-Geun;Park, Myung-Jun;Gu, Hyun-Hee;Uhm, Ji-Won;Kim, Young-Tae;Hur, Kang-Heon
    • Journal of the Korean Ceramic Society
    • /
    • v.46 no.2
    • /
    • pp.175-180
    • /
    • 2009
  • Multilayer ceramic capacitors (MLCCs) have continually been made smaller in size and larger in capacity in resent years. However, the end termination electrode is still thick in many MLCCs. In this study, we used small grain glass frit to embody thin film and highly densification in the end termination by improve sintering driving force with well-dispersion and rising surface energy. Pastes were fabricated using size changed glass frit, such as 0.1 ${\mu}m$, 0.5 ${\mu}m$, 1.0 ${\mu}m$, 4.0 ${\mu}m$. Fabricated pastes were applied 05A475KQ5 chip and fired various sintering temperatures to analyze sintering behavior of pastes. Consequently, small glass frit used pastes have many merits than larger, such as well-dispersion, improve cornercoverage and surface roughness, possibility of low temperature sintering. However, we confirmed that small glass frit used pastes have narrow sintering window by rapid completion of sintering densification.

Development of High Spectral Resolution Lidar System for Measuring Aerosol and Cloud

  • Zhao, Ming;Xie, Chen-Bo;Zhong, Zhi-Qing;Wang, Bang-Xin;Wang, Zhen-Zhu;Dai, Pang-Da;Shang, Zhen;Tan, Min;Liu, Dong;Wang, Ying-Jian
    • Journal of the Optical Society of Korea
    • /
    • v.19 no.6
    • /
    • pp.695-699
    • /
    • 2015
  • A high spectral resolution lidar (HSRL) system based on injection-seeded Nd:YAG laser and iodine absorption filter has been developed for the quantitative measurement of aerosol and cloud. The laser frequency is stabilized at 80 MHz by a frequency locking system and the absorption line of iodine cell is selected at the 1111 line with 2 GHz width. The observations show that the HSRL can provide vertical profiles of particle extinction coefficient, backscattering coefficient and lidar ratio for cloud and aerosol up to 12 km altitude, simultaneously. For the measured cases, the lidar ratios are 10~20 sr for cloud, 28~37 sr for dust, and 58~70 sr for urban pollution aerosol. It reveals the potential of HSRL to distinguish the type of aerosol and cloud. Time series measurements are given and demonstrate that the HSRL has ability to continuously observe the aerosol and cloud for day and night.

Etch resist patterning of printed circuit board by ink jet printing technology (잉크젯 인쇄기술을 이용한 인쇄회로기판의 에칭 레지스터 패터닝)

  • Seo, Shang-Hoon;Lee, Ro-Woon;Kim, Yong-Sik;Kim, Tae-Gu;Park, Sung-Jun;Yun, Kwan-Soo;Park, Jae-Chan;Jeong, Kyoung-Jin;Joung, Jae-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2007.06a
    • /
    • pp.108-108
    • /
    • 2007
  • Inkjet printing is a non-contact and direct writing associated with a computer. In the industrial field, there have been many efforts to utilize the inkjet printing as a new way of manufacturing, especially for electronic devices. The etching resist used in this process is an organic polymer which becomes solidified when exposed to ultraviolet lights and has high viscosity of 300 cPs at ambient temperature. A piezoelectric-driven ink jet printhead is used to dispense $20-40\;{\mu}m$ diameter droplets onto the copper substrate to prevent subsequent etching. In this study, factors affecting the pattern formation such as printing resolution, jetting property, adhesion strength, etching and strip mechanism, UV pinning energy have been investigated. As a result, microscale Etch resist patterning of printed circuit board with tens of ${\mu}m$ high have been fabricated.

  • PDF

12-year LIDAR Observations of Tropospheric Aerosol over Hefei (31.9°N, 117.2°E), China

  • Wu, Decheng;Zhou, Jun;Liu, Dong;Wang, Zhenzhu;Zhong, Zhiqing;Xie, Chenbo;Qi, Fudi;Fan, Aiyuan;Wang, Yingjian
    • Journal of the Optical Society of Korea
    • /
    • v.15 no.1
    • /
    • pp.90-95
    • /
    • 2011
  • 12-year LIDAR observations of tropospheric aerosol vertical distribution using a Mie scattering LIDAR in Hefei ($31.9^{\circ}N$, $117.2^{\circ}E$) from 1998 to 2009 are presented and analyzed in this paper. Characters of temporal variation and vertical distribution of tropospheric aerosol over Hefei are summarized from the LIDAR measurements. The impacts of natural source and human activities on the aerosol vertical distribution over Hefei could be seen clearly. Dust particles from the north in spring could affect the aerosol distributions below about 12 km over Hefei, and aerosol scale height in April reaches $2.29{\pm}0.68\;km$. Both LIDAR measurements and surface visibility imply that aerosols in the lower troposphere have been increasing since about 2005.

A study of properties for phosphorous content of ENIG against Sn-3Ag-0.5Cu solders (Sn-3Ag-0.5Cu solder에 대한 무전해 Ni-P층의 P함량에 따른 특성 연구)

  • Shin, An-Seob;Ok, Dae-Yool;Jeong, Gi-Ho;Park, Chang-Sik;Kim, Min-Ju;Heo, Cheol-Ho;Kong, Jin-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2009.11a
    • /
    • pp.24-24
    • /
    • 2009
  • ENIG(Electroless Nickel Immersion Gold) is the surface treatment method that is used most widely at fine pitch's SMT and BGA packaging process. In this paper, we have studied the effect of P content variation during ENIG process on those phenomena related to the solder joint. The effect of P content was discussed using the results obtained from FE-SEM, EPMA, EDS and FIB. Finally, it was concluded that the more P-content in Ni layer, the thicker P-rich layer.

  • PDF

Polymer Wafer bonding of MEMS device and Cap Wafer with deep cavity (Deep cavity를 가진 Cap Wafer와 MEMS 소자의 Polymer Wafer bonding)

  • Lee, Hyun-Kee;Park, Tae-Joon;Yoon, Sang-Kee;Park, Nam-Su;Park, Hyung-Jae;Min, Jong-Hwan;Lee, Yeong-Gyu
    • Proceedings of the KIEE Conference
    • /
    • 2011.07a
    • /
    • pp.1702-1703
    • /
    • 2011
  • MEMS 소자의 Wafer level Package 관련하여 Deep cavity를 가진 Cap Wafer와 Polymer bonding 중 cavity 단차로 인한 Polymer Patterning 및 접합 불량의 어려움을 극복할 수 있는 새로운 공정 flow를 제안하였다. Cavity를 형성할 때 사용하는 Si deep etching Mask인 기존의 Photoresist를 접합용 감광성 Polymer로 대체하고, cavity 형성 후, 별도의 추가 공정 없이 이 Polymer를 이용해 Wafer bonding을 진행하였다. 이를 통해 cavity 단차에 따른 문제를 해결함과 동시에 공정이 단순하고 제작 비용이 저렴하며, 신뢰성 있는 Wafer level Package를 구현하였다.

  • PDF

Development Trends of EMI Filter Block for LED-TV Power (LED-TV용 전원장치의 EMI filter단 개발동향 및 사례)

  • Won, Jae-Sun;Kim, Jong-Hae;Ju, Jae-Cheol;Lee, Young-Min;Park, Geun-Young;Kim, Don-Sik;Oh, Dong-Seong
    • Proceedings of the KIPE Conference
    • /
    • 2011.07a
    • /
    • pp.308-309
    • /
    • 2011
  • 최근 PDP와 LCD등의 FPD용(用) 전원 시스템에 고효율화, 고밀도화 및 Slim화를 위한 전원 회로 기술이 요구됨에 따라 이를 실현하기 위해서는 전원 회로를 구성하는 각 컨버터의 최적 Topology 확보뿐만 아니라, 전원 회로에 사용되는 부품들에 대한 차별화된 핵심 부품 기술 확보가 필수적이다. 이러한 요구에 부합하기 위해서 FPD용(用) 전원에 적용되는 자성부품구조도 기존의 성능을 유지하면서 박형화, 저비용화 및 자동 권선화를 구현할 수 있는 방안에 대한 연구가 필요하다. 본 논문에서는 LED-TV용 전원장치의 EMI Filter부의 개발사례 및 특히 EMI Filter부의 대책부품 중에 자동권선형 공통모드 초크의 개발동향 및 사례에 대해서 소개하고자 한다.

  • PDF

Effects on Optical Characteristics of GaN Polarity Controlled by Substrate

  • Kang, Sang-Won;Shim, Hyun-Wook;Lee, Dong-Yul;Han, Sang-Heon;Kim, Dong-Joon;Kim, Je-Won;Oh, Bang-Won;Kryliouk, Olga;Anderson, Timothy J.
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.6 no.2
    • /
    • pp.79-86
    • /
    • 2006
  • N-polar, Ga-polar, and non-polar GaN was grown by MBE and MOVPE using various substrates and influence of polarity has been investigated. The GaN growth by MOVPE is along cplane (0001), c-plane (0001), and a-plane (11-20) direction on c-plane (0001), a-plane (11-20) and r-plane (1-102) sapphire substrate respectively. The polarity of the film has a strong influence on the morphology and the optical properties of PA-MBE grown As-doped GaN layers. Strong blue emission from As-doped GaN was observed only in the case of N-polarity (000-1) layers, which was attributed to the highest concentration of Ga dangling bonds for this polarity of a GaN surface.

Studies on Fine Metal Droplet Jetting using Piezoelectric Inkjet Head (압전 잉크젯 헤드를 이용한 미세금속액적 토출 연구)

  • Park, Chang-Sung;Kim, Young-Jae;Sim, Won-Chul;Park, Jung-Hoon;Kang, Pil-Joong;Yoo, Young-Seuck;Joung, Jae-Woo
    • Proceedings of the KIEE Conference
    • /
    • 2007.07a
    • /
    • pp.1550-1551
    • /
    • 2007
  • 노즐 직경 $30\;{\mu}$인 MEMS 압전 잉크젯 헤드를 이용하여 Ag 나노 잉크를 PDMS 처리된 PI(Polyimide) 기판 위에 토출하였다. 구동주파수 5 KHz에서 액적부피 1.5 pl, 속도가 약 4.5 m/s인 액적이 토출 되었다. 인쇄된 액적의 크기는 직경 약 $12\;{\mu}m$이었다. 메니스커스의 거동에 맞춘 구동파형의 입력에 의해 새틀라이트 없는 매우 작은 액적을 토출할 수 있었다.

  • PDF