• Journal of the Korean Society for Precision Engineering
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• v.20 no.1
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• pp.85-90
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• 2003

Removal rate and Within Wafer Non-Uniformity (WIWNU), the most critical issues in Chemical Mechanical Polish (CMP) process, are related to the pressure distribution, wafer shape, slurry flow, mechanical property of pad and etc. Among them, wafer warp generated by other various manufacturing process of wafer may induce the deviation of pressure distribution on the backside of wafer. In the convex shaped wafer the pressure onto the backside of wafer is higher than that of perfectly flat shaped wafer. Besides, such an added pressure is in proportion to the curvature of wafer. That is, the bigger the curvature of wafer becomes the higher the removal rate goes. And the WIWNU is known to be directly related to the pressure distribution on the wafer as well. In other words, the deviation of pressure distribution is in proportion to the WIWNU. In this paper, it is found that the wafer shape may be modified through heating the backside of it and thus properly changed pressure onto the backside of it may improve the WIWNU.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1296-1301
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• 2003

The chemical mechanical polishing(CMP) is necessarily applied to manufacturing the dielectric layer and metal line in the semiconductor device. The conditioning of polishing pad in CMP process additionally operates for maintaining the removal rate, within wafer non-uniformity, and wafer to wafer non-uniformity. But the fixed abrasive pad(FAP) using the hydrophilic polymer with abrasive that has the swelling characteristic by water owns the self-conditioning advantage as compared with the general CMP. FAP also takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing due to the reduction of abrasive concentration. This paper introduces the manufacturing technique of FAP. And the tungsten CMP using FAP achieved the good conclusion in point of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.378-381
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• 2003

The chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

• Journal of the Korean Society of Safety
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• v.17 no.4
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• pp.153-159
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• 2002

This experimental study is aimed to increasing the velocity in the sewerage and also development of easy removal method for a corrosion and sand in the flow pipe. And the result by the increasing the out flow per unit time, diameter of sewerage pipe is becoming small size, cut down the construction fee and the same time reducing the tubulent flow pattern in the flow pipe. As a result of detected experimental velocity signal from the probe in the test wall surface, reducing the pump power and increasing the out flow unit time. Apparent water velocity decreases as the value of void ratio increases depends on the varies center of pipe.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.567-568
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• 2006

To investigate the recycle possibility of slurry for the oxide-chemical mechanical polishing (oxide-CMP) application, three kinds of retreated methods were introduced as follows: First, the effects on the addition of silica abrasives and the diluted silica slurry (DSS) on CMP performances were investigated. Second, the characteristics of mixed abrasive slurry (MAS) using non-annealed and annealed alumina ($Al_2O_3$) powder as an abrasive added within DSS were evaluated to achieve the improvement of removal rates (RRs) and within-wafer non-uniformity (WIWNU%). Third, the oxide-CMP wastewater was examined in order to evaluate the possible ways of reusing it. And then, we have discussed the CMP characteristics of silica slurry retreated by mixing of original slurry and used slurry (MOS).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.7
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• pp.707-712
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• 2015

During the welding process, welding distortion is caused by the non-uniformity of the temperature distribution in the weldment. Welding distortion is redistributed because the residual stress and rigidity change according to the removal of the welded structure. In shipbuilding in particular, this phenomenon may be observed during the cutting process of lugs that are attached to blocks for transfer. The redistribution of welding distortion also causes problems, such as damage to the cutting tool. The aim of this study is to experimentally analyze the redistribution of welding distortion because of the partial removal of the welded structure. In the experiments conducted in this study, fillet welding and cutting were performed, and longitudinal bending and angular distortion in the welded structures were then investigated and analyzed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.497-498
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• 2006

Tribological properties of a Magneto-Rheological(MR) fluid in a polishing process are studied. For this polishing process, abrasive wear model is proposed as a function of shear force, normal force and actual mean velocity of MR particles at workpiece surface. Experimental conditions are changed by varying the gap distance between workpiece and tool and the rotational speed of tool. From the experimental results, a modified Stribeck curve is obtained, and the friction coefficient turns out to have linear relationship with a modified Sommerfeld number. The validity of the wear model is supported by additional experiments performed for measuring material removal rates.

• The Journal of Korean Academy of Prosthodontics
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• v.32 no.1
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• pp.148-169
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• 1994

The concept of biologic attachment of load-bearing implants has developed over the past decades as an alternative to the difficulties associated with long term implantation using mechanical fixation and bone cement. The choice of implant material is also as critical an element as site preparation or insertion procedure. The properties of implants that affect host tissue responses are not limited to chemical composition alone, but also include shape, surface characteristics, site of implantation, and mechanical interaction with host tissues. Initial mechanical interlocking prevents micromotion and may be a prerequisite for direct bone apposition. A hard tightening of screws does not necessarily mean a stronger fixation and final tightening of the fixtures is dependent on the experience of the operator. Removal torque is lower than insertion torque. The purpose of this study was to investigate differences in the removal torques at the bone-implant interface of polished and sandblasted Titanium. This experiment will give insight into important factors that must be considered when interpreting in vivo screwing forces on implants during the connection of the transmucosal abutments. We evaluated the significance of different surface textures by comparison of the withdrawal forces necessary for removal of otherwise identical rough and polished implants of Titanium and also evaluated interfacial response on the light microscopic level to implant surface. And the priority of the area of insertion on osseointegration were evaluated. 9 Titanium implants - among them, 3 were for the developmental - of either a smooth or rough surface finish were inserted in the dog mandible in the right side. 3 months later Kanon Torque Gauge was used to unscrew the implants. The results were as follows : 1. No significant difference was seen in the removal torque due to variation in surface treatment, 23 Ncm for the sandblasted and 23.33 Ncm for the polished surface (p>0.05). 2. Implants in the anterior (25 Ncm) mandible showed better resistance to unscrewing in comparison to ones in the posterior (18 Ncm) region (p<0.05). 3. Developmental fixtures (22 Ncm) had similar pullout strength to the control group (p>0.05).

• Journal of IKEEE
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• v.23 no.4
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• pp.1175-1181
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• 2019

In this paper, we have studied the chemical mechanical polishing(CMP) characteristics of mixed abrasive silica slurry(MAS) retreated by adding of manganese oxide(MnO₂) abrasives within 1:10 diluted silica slurry. A slurry designed for optimal performance should produce high removal rates, acceptable polishing selectivity with respect to the underlying layer, low surface defects after polishing, and good slurry stability. The polishing performances of MnO₂ abrasive-added MAS are evaluated with respect to their particle size distribution, surface morphology, and CMP performances such as removal rate and non-uniformity. As an experimental result, we obtained the comparable slurry characteristics compared to original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, our proposed MnO₂-MAS can be useful to save on the high cost of slurry consumption since we used a 1:10 diluted silica slurry.

• Transactions on Electrical and Electronic Materials
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• v.8 no.2
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• pp.53-57
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• 2007

In this study, a novel slurry containing ceria as the abrasive particles was analyzed in terms of its frictional, thermal and kinetic attributes for interlayer dielectric (ILD) CMP application. The novel slurry was used to polish 200-mm blanket ILD wafers on an $IC1000_{TM}$ K-groove pad with in-situ conditioning. Polishing pressures ranged from 1 to 5 PSI and the sliding velocity ranged from 0.5 to 1.5 m/s. Shear force and pad temperature were measured in real time during the polishing process. The frictional analysis indicated that boundary lubrication was the dominant tribological mechanism. The measured average pad leading edge temperature increased from 26.4 to $38.4\;^{\circ}C$ with the increase in polishing power. The ILD removal rate also increased with the polishing power, ranging from 400 to 4000 A/min. The ILD removal rate deviated from Prestonian behavior at the highest $p{\times}V$ polishing condition and exhibited a strong correlation with the measured average pad leading edge temperature. A modified two-step Langmuir-Hinshelwood kinetic model was used to simulate the ILD removal rate. In this model, transient flash heating temperature is assumed to dominate the chemical reaction temperature. The model successfully captured the variable removal rate behavior at the highest $p{\times}V$ polishing condition and indicates that the polishing process was mechanical limited in the low $p{\times}V$ polishing region and became chemically and mechanically balanced with increasing polishing power.