Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2006.06a
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- Pages.567-568
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- 2006
Methodological Study for Recycle of Chemical Mechanical Polishing Slurry
슬러리 Modification 에 대한 연구
- Park, Sung-Woo (Daebul Univ.) ;
- Seo, Yong-Jin (Daebul Univ.) ;
- Lee, Woo-Sun (ChoSun Univ.)
- Published : 2006.06.22
Abstract
To investigate the recycle possibility of slurry for the oxide-chemical mechanical polishing (oxide-CMP) application, three kinds of retreated methods were introduced as follows: First, the effects on the addition of silica abrasives and the diluted silica slurry (DSS) on CMP performances were investigated. Second, the characteristics of mixed abrasive slurry (MAS) using non-annealed and annealed alumina (
Keywords
- Chemical mechanical polishing (CMP);
- Recycle slurry;
- Diluted silica slurry (OSS);
- Mixed abrasive slurry(MAS);
- Mixing of slurry (MOS);
- Removal rate (RR);
- Within-wafer non-uniformity (WIWNU%)