• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.523-524
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• 2007

This paper discusses the planarization process of thick copper film structure used for power supply device. Chemical mechanical polishing(CMP) has been used to remove a metal film and obtain a surface planarization which is essential for the semiconductor devices. For the thick metal removal, however, the long process time and other problems such as dishing, delamination and metal layer peeling are being issued, Compared to the traditional CMP process, Electro-chemical mechanical planarization(ECMP) is suggested to solve these problems. The two-step process composed of the ECMP and the conventional CMP is used for this experiment. The first step is the removal of several tens ${\mu}m$ of bulk copper on patterned wafer with ECMP process. The second step is the removal of residual copper layer aimed at a surface planarization. For more objective comparison, the traditional CMP was also performed. As an experimental result, total process time and process defects are extremely reduced by the two-step process.

• 대한가정학회지
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• 제35권4호
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• pp.257-268
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• 1997

The effects of water-and oil-repellent finishes on the deposition and removal of oily soils from polyseter fabrics were investigated in this study. The polyester fabrics treated with three kinds of fluoropolymers(TG-410H, TG-990) were soiled with mixed oily soils and washed by using Terg-O-Tometer at various conditions. It was found that TG-410H and TG-527 treated polyester fabrics reduced significantly the deposition of oily soils than untreated and TG-990 treated polyester fabrics. The removal of oily soils from polyester fabrics was increased in porportion to increasing of surfactant concentration up to a certain point(0.2% owb) but it levelled off above the point. The removal effect was high in the order of TG-990 treated polyester fabrics > untreated polyester fabrics > TG-527 treated polyester fabrics > TBG-410H treasted polyester fabrics. Especially the removal of oily soils from polyester fabrics was more effectively removed in triton X-100 solution. In general the removal of oily soils from polyester fabrics treated with fluoropolymers was increased up to a miximum near 6$0^{\circ}C$ and than decreased above 6$0^{\circ}C$. And efficient removal could be achieved within relatively short time (30min) The removal of oily soils from polyester fabrics was increased in proportion to increasing of pH range up to a certain point(9.5 or 11.0) but it began to decrease above the point. Furthermore the removal of oily soils was increased with th increase of mechanical agitation, but it began to decrease above 160 rpm.

• Clinical and Experimental Reproductive Medicine
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• 제48권4호
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• pp.362-367
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• 2021

Objective: The impact of early mechanical removal of cumulus cells on fertilization and embryonic development is not yet precisely known. This study aimed to investigate the effects of early and late cumulus cell removal on fertilization, polyspermy, embryonic development potential, blastocyst development, and clinical outcomes. Methods: A prospective study was conducted of patients who underwent in vitro fertilization between September 2019 and October 2020. Sibling oocytes were randomly allocated after insemination to early cumulus cell removal at 6 hours (group I) and late cumulus cell removal at 16-18 hours (group II). If total fertilization failure (TFF) was determined to have occurred at early cumulus cell removal, rescue intracytoplasmic sperm injection (ICSI) was performed. Fertilization, embryonic development, and pregnancy outcomes were compared. Results: A total of 912 oocytes were assigned to group I (458 oocytes) and group II (454 oocytes). Fertilization, polyspermy, embryo quality, and pregnancy outcomes were not significantly different between both groups. Rescue ICSI enabled fertilization of 79.2% of the TFF oocytes. Conclusion: Early cumulus cell removal at 6 hours had no significant difference in fertilization, polyspermy, embryo development, or obstetric and perinatal outcomes compared to late removal. Early cumulus cell removal combined with early rescue ICSI may have the potential to help couples with TFF.

• 한국전기전자재료학회논문지
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• 제18권4호
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• pp.303-308
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• 2005

In this paper, the effects of oxidants on tungsten chemical mechanical polishing (CMP) process were investigated using three different oxidizers such as Fe(NO₃)₃, KIO₃ and H₂O₂. Moreover, the interaction between the tungsten film and the oxidizer was discussed by potentiodynamic polarization measurement with three different oxidizers, in order to compare the effects of W-CMP and electrochemical characteristics on the tungsten film as a function of oxidizer. As an experimental result, the tungsten removal rate reached a maximum at 5 wt％ Fe(NO₃)₃concentration, and when 5 wt％ H₂O₂was added in the slurry, the removal rate of W increased. Also, the microstructures of surface layer by atomic force microscopy(AFM) image were greatly influenced by the slurry chemical composition of oxidizers. It was shown that the surface roughness and removal rate of the polished surface were improved in Fe(NO₃)₃than KIO₃. The electrochemical results indicate that the corrosion current density of the 5 wt％ H₂O₂ and 5 wt％ H₂O/sub 2+/＋ 5 wt％ Fe(NO₃)₃was higher than the other oxidizers. Therefore, we conclude that the W-CMP characteristics are strongly dependent on the kinds of oxidizers and the amounts of oxidizer additive.

• Journal of Electrochemical Science and Technology
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• 제11권4호
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• pp.346-351
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• 2020

The removal characteristics of copper (Cu) from electrochemical surface by voltage-activated reaction were reviewed to assess the applicability of electrochemical-mechanical polishing (ECMP) process in three types of electrolytes, such as HNO₃, KNO₃ and NaNO₃. Electrochemical surface conditions such as active, passive, transient and trans-passive states were monitored from its current-voltage (I-V) characteristic curves obtained by linear sweep voltammetry (LSV) method. In addition, the oxidation and reduction process of the Cu surface by repetitive input of positive and negative voltages were evaluated from the I-V curve obtained using the cyclic voltammetry (CV) method. Finally, the X-ray diffraction (XRD) patterns and energy dispersive spectroscopy (EDS) analyses were used to observe the structural surface states of a Cu electrode. The electrochemical analyses proposed in this study will help to accurately control the material removal rate (MRR) from the actual ECMP process because they are a good methodology for predicting optimal electrochemical process parameters such as current density, operating voltage, and operating time before performing the ECMP process.

• Tribology and Lubricants
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• 제27권1호
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• pp.7-12
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• 2011

Interest in advanced machining process such as AJM(abrasive jet machining) and CMP(chemical-mechanical polishing) using micro/nano-sized abrasives has been on the increasing demand due to wide use of super alloys, composites, semiconductor and ceramics, which are difficult to or cannot be processed by traditional machining methods. In this paper, the effects of pressure, wafer moving velocity and fluid viscosity were investigated by 2-dimensional finite element analysis method considering slurry fluid flow. From the investigation, it could be found that the simulation results quite corresponded well to the Preston's equation that describes pressure/velocity dependency on material removal. The result also revealed that the stress and corresponding material removal induced by the collision of particle may decrease under relatively high wafer moving speed due to the slurry flow resistance. In addition, the increase in slurry fluid viscosity causes the reduction of material removal rate. It should be noted that the viscosity effect can vary with the shape of abrasive particle.

• 설비공학논문집
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• 제26권2호
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• pp.55-60
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• 2014

The present study has been conducted to develope a heating system for a green house with heat from underground air at Jeju Island. The temperature of the air deposited in the underground is $16{\sim}18^{\circ}C$ throughout the year, and it also has a large amount of moisture. Therefore, the air could not directly used for the heating of a green house. In this study, a heat pump with dehumidification function has been developed, which consisted of three evaporators, where the moisture removal occurs, accompanied by temperature drop. The dropped temperature is recovered, while passing through a series condenser. The air temperature increased from $17^{\circ}C$ to 35 with a 2.1 kg/h of moisture removal rate. The developed system moisture removal performance shows 0.91 kg/kWh.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.41-44
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• 2003

As the device feature size is reduced to the deep sub-micron regime, the chemical mechanical polishing (CMP) technology is widely recognized as the most promising method to achieve the global planarization of the multilevel interconnection for ULSI applications. However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1384-1385
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• 2006

Platinum is a candidate of top and bottom electrode in ferroelectric random access memory and dynamic random access memory. High dielectric materials and ferroelectric materials were generally patterned by plasma etching, however, the low etch rate and low etching profile were repoted. We proposed the damascene process of high dielectric materials and ferroelectric materials for patterning process through the chemical mechanical polishing process. At this time, platinum as a top electrode was used for the stopper for the end-point detection as Igarashi model. Therefore, the control of removal rate in platinum chemical mechanical polishing process was required. In this study, an addition of $H_{2}O_{2}$ oxidizer to alumina slurry could control the removal rate of platinum. The removal rate of platinum rapidly increased with an addition of 10wt% $H_{2}O_{2}$ oxidizer from 24.81nm/min to 113.59nm/min. Within-wafer non-uniformity of platinum after chemical mechanical polishing process was 9.93% with an addition of 5wt% $H_{2}O_{2}$ oxidizer.

• Structural Engineering and Mechanics
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• 제73권5호
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• pp.501-513
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• 2020

In the present work, the optimization of machining parameters to achieve the desired technological parameters such as surface roughness, tool radial vibration and material removal rate have been carried out using response surface methodology (RSM). The hard turning of EN19 alloy steel with coated carbide (GC3015) cutting tools was studied. The main problem faced in manufacturer of hard and high precision components is the selection of optimum combination of cutting parameters for achieving required quality of surface finish with maximum production rate. This problem can be solved by development of mathematical model and execution of experiments by RSM. A face centred central composite design (FCCD), which comes under the RSM approach, with cutting parameters (cutting speed, feed rate and depth of cut) was used for statistical analysis. A second-order regression model were developed to correlate the cutting parameters with surface roughness, tool vibration and material removal rate. Consequently, numerical and graphical optimization were performed to obtain the most appropriate cutting parameters to produce the lowest surface roughness with minimal tool vibration and maximum material removal rate using desirability function approach. Finally, confirmation experiments were performed to verify the pertinence of the developed mathematical models.