• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.8
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• pp.704-710
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• 2000

Metal electrode materials for plasma display panel should have low electrical resistivity in order to maintain stable gas discharge and have fast response time. They should also hae good film uniformity adhesion and thermal stability. In this study Cr/Cu/Cr metal electrode structure is formed by DC magnetron sputtering. Cr and Cu films were deposited on ITO coated glasses with various DC power density and main pressures as the major parameters. After metal electrodes were formed a heat treatment was followed at 55$0^{\circ}C$ for 20 min in a vacuum furnace. The intrinsic stress of the sputtered Cr film passed a tensile stress maximum decreased and then became compressive with further increasing DC power density. Also with increasing the main pressure stress turned from compression to tension. After heat the treatment the electrical resistivity of the sputtered Cu film of 2${\mu}{\textrm}{m}$ in thickness prepared at 1 motor with the applied power density of 3.70 W/cm$^2$was 2.68 $\mu$$\Omega$.cm With increasing the main pressure the DC magnetron sputtered Cu film became more open structure. The heat treatment decreased the surface roughness of the sputtered Cr/Cu/Cr metal electrodes.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.7
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• pp.116-123
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• 2008

In the fossil power plant, the reliability of the components which consist of the many welded parts depends on the quality of welding. The residual stress is occurred by the heat flux of high temperature during weld process. This decreases the mechanical properties as the strength of fatigue and fracture or causes the stress corrosion cracking and fatigue fracture. Especially, the accidents due to the residual stress occurred at the weld parts of high-temperature and high-pressure pipes and steam headers. Also, the residual stress of the welded part in the recently constructed power plants has been brought into relief as the cause of various accidents. The aim of this study is the measurement of the residual stress using the x-ray diffraction method. The merits of this are more accurate and applicable than other methods. The materials used for the study is P92 steel for the use of high temperature pipe on super critical condition. The variables of tests are the post-weld heat treatment, the surface roughness and the depth from the original surface. The test results were analyzed by the distributed characteristics of the full width at half maximum intensity (FWHM) in x-ray diffraction intensity curve and by the relation of hardness with FWHM.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.7
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• pp.481-485
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• 2003

Amorphous silicon (a-Si:H) based TFT process has been studied at the maximum temperature of 15$0^{\circ}C$ with 25${\mu}{\textrm}{m}$ thick flexible and adhesive tape type polyimide foil substrate, which has benefit on handling a rugged, flexible plastic substrate trough sticking simply it to glass. This paper summarize the process procedure of the TFT on the plastic substrate and shows its electrical characteristics in comparison with glass substrate using primarily the ON/OFF current ratio and the field effect mobility as the quality criterion. The a-SiN:H coating layer played an important role in decreasing surface roughness of plastic substrate, so leakage current of TFT was decreased and mobility was increased. The results show that high quality a-Si:H TFTs can be fabricated on the plastic substrates through coating a rough plastic surface with a-SiN:H.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.2
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• pp.132-135
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• 2014

The Sr based ceramic thin films were deposited on Si substrate by RF magnetron sputtering method. And Sr based thin films were annealed at $500{\sim}700^{\circ}C$ using RTA. The surface roughness showed about 2.4 nm in annealed thin film at $600^{\circ}C$. The capacitance density of Sr based thin films were increased with the increase of annealing temperature. The maximum capacitance density of $0.6{\mu}F/cm^2$ was obtained by annealing temperature at $700^{\circ}C$. The voltage dependence of dielectric loss showed about 0.02 in voltage ranges of -10~+10 V. The leakage current density of annealing temperature of $600^{\circ}C$ was the $4.0{\times}10^{-6}\;A/cm^2$ at applied voltage of -5~+5 V.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.367-367
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• 2008

Aluminum nitride (AlN) thin films have been deposited on Si substrate by using reactive RF magnetron sputtering method in a gas mixture of Ar and $N_2$ at different $N_2$ concentration. It was found that $N_2$ concentration was varied in the range up to 20-100%, highly c-axis oriented film can be obtained at 50% $N_2$ with full width at half maximum (FWHM) $4.5^{\circ}$. Decrease in surface roughness from 7.5 nm to 4.6 nm found to be associated with decrease in grain size, with $N_2$ concentration; however, the AlN film fabricated at 20% $N_2$ exhibited a granular type of structure with non-uniform grains. The absorption peak was observed around 675 $cm^{-1}$ in fourier transform infrared spectroscopy (FTIR). It is concluded that the AlN film deposited at $N_2$ concentration of 50% exhibited the most desirable properties for the application of high-frequency surface acoustic devices.

• The Journal of the Acoustical Society of Korea
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• v.29 no.1E
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• pp.38-44
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• 2010

This paper is based on our comments and proposed amendments to the documents, Annex A, Phantom for determining Maximum Depth of Penetration, and Annex B, Local Dynamic Range Using Acoustical Test Objects 87/400/CDV. IEC 61391-2 Ed. 1.0 200X, prepared by IEC technical Committee 87; Ultrasonics. The documents are concerned with the influence of microstructure of reference target material on the ultrasonic backscattering. Previous works on the attenuation due to backreflection and backscattering of reference target materials are reviewed. The drawback to the use of ungraded stainless steel and metallic materials without microstructural data such as, crystal structure, basic acoustic data of sound velocity and attenuation, grain size, roughness and elastic constants has been discussed. The analysis suggested that the insightful conclusion can be made by differentiating the influence arising from target size and microstructure on the backscattering measurements. The microstructural parameters are associated with physical, geometrical, acoustical and mechanical origins of variation with frequency. Further clarification of such a diverse source mechanisms for ultrasonic backscattering would make the target material and its application for medical diagnosis and therapy simpler and more reliable.

• Korean Journal of Materials Research
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• v.18 no.3
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• pp.117-122
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• 2008

Micro-sized bumps on a multi-layered build-up PCB were fabricated by pulse-reverse copper electroplating. The values of the current density and brightener content for the electroplating were optimized for suitable performance with maximum efficiency. The micro-bumps thus electroplated were characterized using a range of analytical tools that included an optical microscope, a scanning electron microscope, an atomic force microscope and a hydraulic bulge tester. The optical microscope and scanning electron microscope analyses results showed that the uniformity of the electroplating was viable in the current density range of $2-4\;A/dm^2$; however, the uniformity was slightly degraded as the current density increased. To study the effect of the brightener concentration, the concentration was varied from zero to 1.2 ml/L. The optimum concentration for micro-bump electroplating was found to be 0.6 ml/L based on an examination of the electroplating properties, including the roughness, yield strength and grain size.

• Korean Journal of Materials Research
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• v.12 no.5
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• pp.387-390
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• 2002

A new approach of using double buffer layers of AlN and GaN for growth of GaN films on Si has been undertaken via molecular beam epitaxy using ammonia. The first buffers layer of AlN was grown using $N_2$plasma and the second of GaN was grown using ammonia. The surface roughness of the grown films was investigated by atomic force microscope and was compared with the normally grown films on sapphire. Double crystal x-ray rocking curve and low temperature photoluminescence techniques were employed for structural and optical properties examination. Donor bound exciton peak at 3.481 eV with full width half maximum of 41 meV was observed at 13K.

• Journal of the Korean institute of surface engineering
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• v.26 no.1
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• pp.3-9
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• 1993

Chemical vapor deposited tungsten films were formed in a cold wall reactor at pressures higher (10~120torr) than those conventionally employed (<1torr). SiH4, in addition to H2, was used as the reduction gas. The effects of pressure and reaction temperature on the deposition rate and morphology of the films were ex-amined under the above conditions. No encroachment or silicon consumption was observed in the tungsten de-posited specimens. A high deposition rate of tungsten and a good step coverage of the deposited films were ob-tained at 40~80 torr and at a temperature range of $360~380^{\circ}C$. The surface roughness and the resistivity of the deposited film increased with pressure. The deposition rate of tungsten increased with the total pressure in the reaction chamber when the pressure was below 40 torr, whereas it decreased when the total pressure ex-ceedeed 40 torr. The deposition rate also showed a maximum value at $360^{\circ}C$ regardless of the gas pressure in the chamber. The results suggest that the deposition mechanism varies with pressure and temperature, the surface reac-tion determines the overall reaction rate and (2) at higher pressures(>40 torr) or temperatures(>36$0^{\circ}C$), the rate is controlled by the dtransportation rate of reactive gas molecules. It was shown from XRD analysis that WSi2 and metastable $\beta$-W were also formed in addition to W by reactions between WF6 and SiH4.

• Journal of the Korean institute of surface engineering
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• v.52 no.6
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• pp.310-315
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• 2019

The use of a silicon carbide (SiC)-based composite ceramic layer for the mold of a curved cover glass was demonstrated. The stress of SiC/VDR/graphite-based mold structure was evaluated via finite element analysis. The results revealed that the maximum tensile stress primarly occured at the edge region. Moreover, the stress can be reduced by employing a relatively thick SiC coating layer and, therefore, layers of various thicknesses were deposited by means of chemical vapor deposition. During growth of the layer, the orientation of the facets comprising the SiC grain became dominant with additional intense SiC(220) and SiC(004). However, the roughness of the SiC layer increased with increasing thickness of the layer and. Hence, the thickness of the SiC layer needs to be adjusted by values lower than the tolerance band of the curved cover glass mold.