• 제목/요약/키워드: Material balance

검색결과 526건 처리시간 0.027초

Evaluation of Water Retentive Pavement as Mitigation Strategy for Urban Heat Island Using Computational Fluid Dynamics

  • Cortes, Aiza;Shimadera, Hikari;Matsuo, Tomohito;Kondo, Akira
    • Asian Journal of Atmospheric Environment
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    • 제10권4호
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    • pp.179-189
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    • 2016
  • Here we evaluated the effect of using water retentive pavement or WRP made from fly ash as material for main street in a real city block. We coupled computational fluid dynamics and pavement transport (CFD-PT) model to examine energy balance in the building canopies and ground surface. Two cases of 24 h unsteady analysis were simulated: case 1 where asphalt was used as the pavement material of all ground surfaces and case 2 where WRP was used as main street material. We aim to (1) predict diurnal variation in air temperature, wind speed, ground surface temperature and water content; and (2) compare ground surface energy fluxes. Using the coupled CFD-PT model it was proven that WRP as pavement material for main street can cause a decrease in ground surface temperature. The most significant decrease occurred at 1200 JST when solar radiation was most intense, surface temperature decreased by $13.8^{\circ}C$. This surface temperature decrease also led to cooling of air temperature at 1.5 m above street surface. During this time, air temperature in case 2 decreased by $0.28^{\circ}C$. As the radiation weakens from 1600 JST to 2000 JST, evaporative cooling had also been minimal. Shadow effect, higher albedo and lower thermal conductivity of WRP also contributed to surface temperature decrease. The cooling of ground surface eventually led to air temperature decrease. The degree of air temperature decrease was proportional to the surface temperature decrease. In terms of energy balance, WRP caused a maximum increase in latent heat flux by up to $255W/m^2$ and a decrease in sensible heat flux by up to $465W/m^2$.

대화면 LCD TV용 CCFL 병렬 구동에 관한 연구 (A Study on the CCFL Parallel Driving Circuit for the large LCD TV)

  • 장영수;윤석;권기현;한상규;홍성수;사공석진;노정욱
    • 전력전자학회논문지
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    • 제11권5호
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    • pp.454-462
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    • 2006
  • 현재 LCD 인버터의 경쟁력을 키우기 위해 인버터 하나로 다수의 램프를 병렬 구동하는 방식이 많이 사용되고 있다. 본 논문에서는 병렬 구동방식 중 Jin Balance와 O2Micro 방식에 대해 이론적으로 분석하고, 특히 각각의 램프 전류 편차를 일정하게 유지하기 위한 자화 인덕턴스 값의 설계에 대하여 설명하였다. 위의 결과를 이용하여 새로운 전류 평형 방식을 제안하고 수학적으로 분석하였으며, 모의실험을 통해 제안 방식의 정확성을 검증하였다.

하수슬러지 소각시설의 중금속 배출특성에 관한 연구 (Study on the Emission Characteristics of Heavy metals in sewage sludge Incinerator)

  • 박정민;이상보;김민정;김진필;김종춘;이석조;이상학
    • 환경위생공학
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    • 제24권3호
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    • pp.28-36
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    • 2009
  • We have closely examined the concentration change characteristics, emission amounts, and the material balance of hazardous air pollutants at both early and later stages of the prevention facilities. These results will be uses as the basic data when preparing for the regulatory and management plans for hazardous air pollutants. The results of the study on heavy metals illustrated that the content of heavy metals in sludge across five facilities were as follows: copper> zinc> chrome> nickel> cadmium> mercury. In terms of heavy metal content in swage sludge, the sludge in incinerating facilities other than the sludge in the D incinerating facility containing industrial water waste, was examined in order to satisfy the ocean contamination standard and fertilizer specifications. Most of the items were shown to have satisfied the emission tolerance standards in the latter part of the prevention facilities(The average elimination rate was over 90%). Therefore, it is concluded that swage sludge containing high-concentrate heavy metals needs to be incinerated rather than recycled as fertilizer.

슈퍼 듀플렉스 스테인리스강 다층용접부의 미세조직 및 공식(Pitting Corrosion)에 미치는 용접열사이클의 영향 (Effect of Welding Thermal Cycle on Microstructure and Pitting Corrosion Property of Multi-pass Weldment of Super-duplex Stainless Steel)

  • 남성길;박세진;나혜성;강정윤
    • Journal of Welding and Joining
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    • 제28권4호
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    • pp.18-25
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    • 2010
  • Super-duplex stainless steels (SDSS) have a good balance of mechanical property and corrosion resistance when they consist of approximately equal amount of austenite and ferrite. The SDSS needs to avoid the detrimental phases such as sigma(${\sigma}$), chi(${\chi}$), secondary austenite(${\gamma}2$), chromium carbide & nitride and to maintain the ratio of ferrite & austenite phase as well known. However, the effects of the subsequent weld thermal cycle were seldom experimentally studied on the micro-structural variation of weldment & pitting corrosion property. Therefore, the present study investigated the effect of the subsequent thermal cycle on the change of weld microstructure and pitting corrosion property at $40^{\circ}C$. The thermal history of root side was measured experimentally and the change of microstructure of weld root & the weight loss by pitting corrosion test were observed as a function of the thermal cycle of each weld layer. The ferrite contents of root weld were reduced with the subsequent weld thermal cycles. The pitting corrosion was occurred in the weld root region in case of the all pitted specimen & in the middle weld layer in some cases. And the weight loss by pitting corrosion was increased in proportional to the time exposed at high temperature of the root weld and also by the decrease of ferrite content. The subsequent weld thermal cycles destroy the phase balance of ferrite & austenite at the root weld. Conclusively, It is thought that as the more subsequent welds were added, the more the phase balance of ferrite & austenite was deviated from equality, therefore the pitting corrosion property was deteriorated by galvanic effect of the two phases and the increase of 2nd phases & grain boundary energy.

CMP 프로세스의 통계적인 다규모 모델링 연구 (A Statistical Study of CMP Process in Various Scales)

  • 석종원
    • 대한기계학회논문집A
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    • 제27권12호
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    • pp.2110-2117
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    • 2003
  • A physics-based material removal model in various scales is described and a feature scale simulation for a chemical mechanical polishing (CMP) process is performed in this work. Three different scales are considered in this model, i.e., abrasive particle scale, asperity scale and wafer scale. The abrasive particle and the asperity scales are combined together and then homogenized to result in force balance conditions to be satisfied in the wafer scale using an extended Greenwood-Williamson and Whitehouse-Archard statistical model that takes into consideration the joint distribution of asperity heights and asperity tip radii. The final computation is made to evaluate the material removal rate in wafer scale and a computer simulation is performed for detailed surface profile variations on a representative feature. The results show the dependence of the material removal rate on the joint distribution, applied external pressure, relative velocity, and other operating conditions and design parameters.

The Study of Luminescence Efficiency by change of OLED's Hole Transport Layer

  • Lee, Jung-Ho
    • International Journal of Precision Engineering and Manufacturing
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    • 제7권2호
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    • pp.52-55
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    • 2006
  • The OLEDs(Organic Light-Emitting Diodes) structure organizes the bottom layer using glass, ITO(indium thin oxide), hole injection layer, hole transport layer, emitting material layer, electron transport layer, electron injection layer and cathode using metal. OLED has various advantages. OLEDs research has been divided into structural side and emitting material side. The amount of emitting light and luminescence efficiency has been improved by continuing effort for emitting material layer. The emitting light mechanism of OLEDs consists of electrons and holes injected from cathode and anode recombination in emitting material layer. The mobilities of injected electrons and holes are different. The mobility of holes is faster than that of electrons. In order to get high luminescence efficiency by recombine electrons and holes, the balance of their mobility must be set. The more complex thin film structure of OLED becomes, the more understanding about physical phenomenon in each interface is needed. This paper observed what the thickness change of hole transport layer has an affection through the below experiments. Moreover, this paper uses numerical analysis about carrier transport layer thickness change on the basis of these experimental results that agree with simulation results.

소형펀치 시험과 역해석에 의한 재료의 유동응력 결정 (Inverse Analysis Approach to Flow Stress Evaluation by Small Punch Test)

  • 천진식
    • 대한기계학회논문집A
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    • 제24권7호
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    • pp.1753-1762
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    • 2000
  • An inverse method is presented to obtain material's flow properties by using small punch test. This procedure employs, as the objective function of inverse analysis, the balance of measured load-di splacement response and calculated one during deformation. In order to guarantee convergence to global minimum, simulated annealing method was adopted to optimize the current objective function. In addition, artificial neural network was used to predict the load-displacement response under given material parameters which is the most time consuming and limits applications of global optimization methods to these kinds of problems. By implementing the simulated annealing for optimization along with calculating load-displacement curve by neural network, material parameters were identified irrespective of initial values within very short time for simulated test data. We also tested the present method for error-containing experimental data and showed that the flow properties of material were well predicted.

LED용 리드프레임 상의 Sn-3.5Ag 솔더 도금의 젖음성 및 반사율 (Wetting Property and Reflectivity of Sn-3.5Ag Solder by Plating for LED Lead Frame)

  • 기세호;허증봉;김원중;정재필
    • 대한금속재료학회지
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    • 제50권8호
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    • pp.563-568
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    • 2012
  • The wetting property and reflectivity of Sn-3.5Ag solder which was dip coated on a LED lead frame were investigated. The wettability of molten solder on Cu substrate was evaluated by the wetting balance tester, and surface tension was calculated from maximum withdrawal force and withdrawal time. Temperature of the molten solder in a bath was varied in the range of $250-290^{\circ}C$. With increasing temperature, the surface tension decreased a little. The reflectivity of Sn-3.5Ag coated on a substrate became a little lower than the highest current LED lead frame reflectivity.