• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 연구회
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• pp.212-216
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• 2001

The conventional tracking testing as IEC-60587 is widely used in surface aging measurement of outdoor insulator because those testing can carry out very short time in Lab-testing. Also IEC-60587 testing is able to offer the standard judgement of relative degradation level of outdoor HV machine/system. Therefore it is very useful method compare to previous conventional tracking testing method and effective Lab-testing method. But surface discharges(SD) have very complex characteristics of discharge pattern so it is required estimation research to development of precise analysis method. In recent, the study of IRR-camera is carrying out discover of temperature of power equipment through condition diagnosis and system development of degradation diagnosis. In this study, SD occurred from procelain insulator, used 22.9[KV] distribution, is measured with partial temperature distribution in real time, the degradation grade of SD is analyzed through produced patterns in SD concentration according to applied time.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2009년도 세계 도시지반공학 심포지엄
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• pp.1415-1424
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• 2009

Measuring dynamic properties of gravel-sized materials demands large specimens. Due to the difficulties in experiment as well as equipment, the dynamic properties of gravel-sized material has rarely been investigated. To realize free-free end condition more properly and stabilize specimen during testing with new specimen support system, a free-free resonant column testing device, which is capable of testing gravel-sized materials and constraining a specimen in free-free boundaries, is developed. We report the calibration of the equipment and preliminary testing results on Jumunjin sand. The testing data are compared with the previous data obtained from the existing fixed-free resonant column test.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 춘계학술대회 논문집 유기절연재료 방전 플라즈마
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• pp.59-63
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• 2000

The conventional tracking testing as IEC-60587 is widely used in surface aging measurement of outside insulator because those testing can carry out very short time in Lab testing. Also IEC-60587 testing is able to offer the standard judgement of relative degradation level of outside HV machine. Therefore it is very useful method compare to previous conventional tracking testing method and effective Lab testing method. But surface discharges(SD) have very complex characteristics of discharge pattern so it is required estimation research to development of precise analysis method. In recent, the study of IIR-camera is carrying out discover of temperature of power equipment through condition diagnosis and system development of degradation diagnosis. In this study, SD occurred from IEC-60587 is measured with partial temperature distribution in real time, the degradation grade of SD is analyzed through produced patterns in IEC-60587 according to applied time.

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 2005년도 춘계학술발표회
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• pp.974-975
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• 2005

• 한국신뢰성학회지:신뢰성응용연구
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• 제16권3호
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• pp.202-207
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• 2016

Purpose: The purpose of this study is main factors (environmental conditions, pattern spacing, pattern material) that effect the ion-migration of PCB. Methods: Recently, the electronic components are becoming more high density of electronic device, so that electronic circuits have smaller pitches between the patten and more vulnerable to insulation failure. so the reliability of electric insulation of device has become an ever important issue as device contact pitches of pattern. Usually, ion-migration occurs in high temperature and high humidity environment as voltage is applied to the circuit. Under high temperature and high humidity, voltage applied electronic components respond to applied voltages by metals's electrochemical ionization and a conducting filament forms between the anode and cathode across a nonmetallic medium. This leads to short-circuit failure of the electronic component. Results: we studied ion-migration that occurs in accordance with the main factors (environmental conditions, pitches, pattern material). The PCB pattern material was made by two different types of material (free solder, OSP) for this research and pitches of pattern is 0.15mm, 0.3mm, 0.5mm. PCB was experimented in the environmental conditions (high temperature $120^{\circ}C$, high temperature and high humidity $85^{\circ}C$, 85%RH) and was analyzed for ion-migration through the experiment results. Conclusion: We confirmed that environmental condition, pitches of pattern, pattern material had effect on ion-migration of PCB.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.1493-1494
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• 2013

• 비파괴검사학회지
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• 제29권3호
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• pp.256-263
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• 2009

After several PWSCCs were found in Bugey(France), Ringhals(Sweden), Tihange(Belgium), Oconee, Arkansas, Crystal Fever, Davis-Basse, VC Summer(U.S.A.), Thuruga(Japan), USNRC and PNNL started the research on PWSCC, that is, the PINC project. USNRC required KINS to participate in the PINC project in May 2005. KINS organized the Korean consortium at March 2006 and Pre-RRT for RVHP were performed for the preparation of PINC RRT. Through these preliminary RRT, Korea NDE teams can learn and develop the detection and sizing technique for RVHP dissimilar metal weld. These techniques are now being prepared in Korea and need to be utilized for the In-service inspection of the RVHP and BMI of Korea Nuclear Power Plants. PINC RRT mock-ups will be helpful to training.

• 공학교육연구
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• 제21권4호
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• pp.20-27
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• 2018

In this paper, we conducted an analysis of existing materials of material mechanics, surveying educational demands, and selecting art fields for mechanical engineering in collaboration with experts in the fields of aesthetics and renaissance in order to develop educational materials conversed with humanities and arts. In addition, as a core education tool for convergence education, it was developed with an education kits that can be disassembled, assembled and carried by students. As a results of research, education materials were introduced various arts, linked to the engineering thinking. And measurement experiments of material characteristics were carried in a general classroom using developed education kits. From a paper results, the artistic sensitivity of the students will be enhanced and the students' creative problem solving ability will be improved as the ultimate goal of convergence education.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.1254-1257
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• 2004

This paper presents a built-in current sensor(BICS) that can detect defects in CMOS integrated circuits through current testing technique - Iddq test. Current test has recently been known to a complementary testing method because traditional voltage test cannot cover all kinds of bridging defects. So BICS is widely used for current testing. but there are some critical issues - a performance degradation, low speed test, area overhead, etc. The proposed BICS has a two operating mode- normal mode and test mode. Those methods minimize the performance degradation in normal mode. We also used a current-mode differential amplifier that has a input as a current, so we can realize higher speed current testing. Furthermore, only using 10 MOSFETS and 3 inverters, area overhead can be reduced by 6.9%. The circuit is verified by HSPICE simulation with 0.25 urn CMOS process parameter.

• 한국전기전자재료학회논문지
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• 제18권5호
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• pp.431-438
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• 2005

In this paper, we propose the built-in current testing circuit for improving reliability As the integrated CMOS circuits in a chip are increased, the testability on design and fabrication should be considered to reduce the cost of testing and to guarantee the reliability In addition, the high degree of integration makes more failures which are different from conventional static failures and introduced by the short between transistor nodes and the bridging fault. The proposed built-in current testing method is useful for detecting not only these failures but also low current level failures and faster than conventional method. In normal mode, the detecting circuit is turned off to eliminate the degradation of CUT(Circuits Under Testing). The differential input stage in detecting circuit prevents the degradation of CUT in test mode. It is expected that this circuit improves the quality of semiconductor products, the reliability and the testability.