• Title/Summary/Keyword: Material Removal rate

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Removal Characteristics of Nitrogen Oxide in Electromagnetic-Catalytic Plasma Reactor (전자계-촉매형 플라즈마 반응기의 질소 산화물 제거 특성)

  • 이현수;박재윤;이동훈;한병성
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.15 no.7
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    • pp.640-648
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    • 2002
  • This study is to develop electromagnetic-catalyst application plasma reactors for indoor air purification. Nitrogen Oxide(NOx) removal characteristics are measured in the electromagnetic catalyst application plasma reactors with various parameters and the effect of catalyst or/and magnetic field are investigated on the NOx removal. And AC or DC high voltage is applied for corona discharge, flow rates are 150~1500 $\ell/min$ and NO initial concentration is about 10 ppm. $Mn0_2$ and $TiO_2$ catalysts to increase NOx removal rate are used. In the results, NOx removal rate by AC power is about 10 % higher than that by DC power under the experimental condition of 700 $\ell/min$, 5 magnets, $MnO_2$ and $Ti)_2$ catalysts. When magnet is applied to the reactor, NOx removal rate increased. Also, the reactor with $MnO_2$ and $Ti)_2$ catalyst and magnet have the best removal rate.

미세조류의 Methane 발효특성

  • 강창민;최명락
    • Microbiology and Biotechnology Letters
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    • v.24 no.5
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    • pp.597-603
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    • 1996
  • This study was carried out to examine degradation characteristics of microalgae Chlorella vulgaris in methane fermentation. We measured COD and VS reduction, gas and methane productivity, VFA (volatile fatty acid), respectively. Then we calculated material balance and hydrolysis rates in soluble and solid material. The substrate concentration was controlled from 14 gCOD$_{cr}$/l to 64 gCOD$_{cr}$/l in batch cultures, and HRT (hydraulic retention time) controlled from 2 days to 30 days in continuous experi- ments. The results were as follows. In batch culture, accumulated gas productivity increased with the increase of the substrate concentration. The SS and VSS was removed all about 30% increase of substrate concentration and the most of the degradable material removed during the first 10 days. The curve of gas and methane production rate straightly increased until substrate concentration is 26 gCOD$_{cr}$/l. In continuous culture experiments, the removal rates at HRT 10days were 20% for total COD and TOC, respectively. At longer HRT, there was no increase in the removal efficiency. At HRT 15 days, the removal rates were 30% for SS and VSS, respectively. Soluble organic materials were rapidly degraded, and so there was no accumulated. Soluble COD concentration was not increase regardless of HRT-increasing. That meaned the hydrolysis was one of the rate-limiting stage of methane fermentation. The first-order rate constants of hydrolysis were 0.23-0.28 day$^{-1}$ for VSS, and 0.07-0.08 day$^{-1}$ for COD.

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A Study of Material Removal Characteristics by Friction Monitoring System of Sapphire Wafer in Single Side DMP (사파이어 웨이퍼 DMP에서 마찰력 모니터링을 통한 재료 제거 특성에 관한 연구)

  • Jo, Wonseok;Lee, Sangjik;Kim, Hyoungjae;Lee, Taekyung;Lee, Seongbeom
    • Tribology and Lubricants
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    • v.32 no.2
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    • pp.56-60
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    • 2016
  • Sapphire has a high hardness and strength and chemical stability as a superior material. It is used mainly as a material for a semiconductor as well as LED. Recently, the cover glass industry used by a sapphire is getting a lot of attention. The sapphire substrate is manufactured through ingot sawing, lapping, diamond mechanical polishing (DMP) and chemical mechanical polishing (CMP) process. DMP is an important process to ensure the surface quality of several nm for CMP process as well as to determine the final form accuracy of the substrate. In DMP process, the material removal is achieved by using the mechanical energy of the relative motion to each other in the state that the diamond slurry is disposed between the sapphire substrate and the polishing platen. The polishing platen is one of the most important factors that determine the material removal characteristics in DMP. Especially, it is known that the geometric characteristics of the polishing platen affects the material removal amount and its distribution. This paper investigated the material removal characteristics and the effects of the polishing platen groove in sapphire DMP. The experiments were preliminarily carried out to evaluate the sapphire material removal characteristics according to process parameters such as pressure, relative velocity and so on. In the experiment, the monitoring apparatus was applied to analyze process phenomena in accordance with the processing conditions. From the experimental results, the correlation was analyzed among process parameters, polishing phenomena and the material removal characteristics. The material removal equation based on phenomenological factors could be derived. And the experiment was followed to investigate the effects of platen groove on material removal characteristics.

A Study on Toluene Removal of VOC and Characteristics of Material Using Biofilter (Bio필터를 이용한 VOC 가스 중 Toluene 제거율과 필터특성 연구)

  • 강신묵;하상안
    • Journal of environmental and Sanitary engineering
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    • v.13 no.2
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    • pp.88-94
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    • 1998
  • This study was investigated the application of biofiltration using cometabolic process to remediate gaseous toluene that are highly recalcitrant to adsorption, absorption and biodegradation. The investigation was conducted using specially built steel columns packed with granular activated carbon for removal of toluene and G.A.C was also coated with Pseudomonas putida microorganisms by addition of KH$_{2}$PO$_{4}$. The biofilter unit was operated in the condition of dry and 27.5% moisture content at gas loading rate of 12.5 l/min. Gaseous toluene taken from tedlar bag was analyzed by the use of G.C. equipped with F.I.D. detector. The removal efficiency of gaseous toluene was 85% at average inlet concentration of 970 ppm during dry operating condition. For gaseous toluene, 91% removal efficient was obtained at the filter material with moisture content and 97% removal efficiency was obtained with Pseudomonas putida microorganisms at gas loading rate of 12.5 l/min.

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Variable Feedrate Interpolator for NURBS Curve Considering Material Removal Rate (소재 제거율을 고려한 이송속도 가변형 NURBS 보간기)

  • 마르첸코티혼;고태조;김희술;김정현
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.12 no.2
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    • pp.1-8
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    • 2003
  • Conventionally used linear or circular interpolator is undesirable for the precision machining of 3D free-form surface as the following reason: the transmission errors due to the huge number of data, discontinuity of segmentation, unsmooth motion speed. To this regard, modern CNC machine tools are designed with the function of machining arbitrary parametric curves. However, these systems don't consider the adaptive federate, which dominates the quality of the machining process. This paper proposes a NURBS interpolator for the constant material removal rate. That is accomplished by the variable federate using curvature of curve. The curvature-compensated feederate system has important Potential applications in ensuring part accuracy and protecting cutting tool. The simulated result show it can be applicable to the real machining.

Characteristics of Material Removal Rate According to Discharge Area and Capacitance in MEDM (미세 방전 가공에서 방전 면적과 축전 용량에 따른 가공율 특성)

  • 박동희;류시형;김보현;주종남
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.12
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    • pp.183-190
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    • 2003
  • In this paper, investigated are the machining characteristics such as material removal rate and machining time with respect to discharge area and capacitance in micro electrical discharge machining (MEDM). As discharge area determined by the electrode size and capacitance change, the optimal feedrate to allow the minimum machining time changes. The smaller discharge area is, the lower MRR becomes because of the area effect. As the capacitance increases, MRR also increases. However there is the limit capacitance beyond which the MRR does not increase anymore. As the discharge area increases, the limit capacitance also increases.

The Effects of Groove Dimensions of Pad on CMP Characteristics (패드 그루브의 치수가 CMP 연마특성에 미치는 영향)

  • Park Ki-Hyun;Kim Hyoung-Jae;Choi Jae-young;Seo Heon-deok;Jeong Hae-do
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.29 no.3 s.234
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    • pp.432-438
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    • 2005
  • CMP characteristics such as material removal rate and edge effect were measured and investigated in accordance with pad grooving effect, groove width, depth and pitch. GSQ (Groove Stiffness Quotient) and GFQ (Groove Flow Quotient) were proposed to estimate pad grooving characteristics. GSQ is defined as groove depth(D) divided by pad thickness(T) and GFQ is defined as groove width(W) divided by groove pitch(P). As GFQ value increased, material removal rate increased some point but gradually saturated. It seems that material removal rate is not affected by each parameter respectively but by interaction of these parameters such as groove dimensions. In addition, an increase in GFQ and GSQ causes edge effect to be improved. Because, pad stiffness decreases as GSQ and GFQ increase. In conclusion, groove influences relative pad stiffness although original mechanical properties of pad are unchanged by grooving. Also, it affects the flow of slurry that has an effect on the lubrication regime and polishing results. The change of groove dimensions has influence on pad stiffness and slurry flow, so that polishing results such as removal rate and edge effect become changed.

Effects of Oxidizer Additive on the Performance of Copper-Chemical Mechanical Polishing using Tungsten Slurry (텅스텐 슬러리를 사용한 Cu-CMP 특성에서 산화제 첨가의 영향)

  • 이우선;최권우;이영식;최연옥;오용택;서용진
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.2
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    • pp.156-161
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    • 2004
  • We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. In order to compare the removal rate and non-uniformity as a function of oxidizer contents, we used alumina-based tungsten slurry and copper blanket wafers deposited by DC sputtering method. According to the CMP removal rates and particle size distribution, and the microstructures of surface layer by SEM image as a function or oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2$O$_3$abrasive particles in CMP slurry.

A Study on Microbial Degradation for Removal of Toluene Vapour by Biofilter (Bio 필터를 이용한 Toluene 제거에서 미생물분해에 관한 연구)

  • 하상안;강신묵
    • Journal of environmental and Sanitary engineering
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    • v.14 no.1
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    • pp.24-30
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    • 1999
  • A biological filter for treatment of toluene among volatile organic compounds was studied. The investigation was conducted using specially built stainless steel columns packed with granular activated carbon and cold for removal of toluene. The G.A. and mold as filter material was also coated with Pseudomonas putida microorganisms.The biofilter unit was operated in the condition of moisture content vairation at gas loading rate of 12.5 l/min. Gaseous toluene taken from tedlar bag was analyzed by the use of G.C equipped with F.I.d detector. The removal efficiency of gaseous toluene was 95% at average inlet concentration of 950 ppm during bio-degradation operating condition. Effective removal efficiency was obtained with moisture content 27.5% at activated carbon and 32% at mold in this study. The effective operating condition were obtained with pH 6-8, temperature 28-42℃ for microbial degradation at gas loading rate of 12.5 l/min in packed material.

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Machining Characteristics of WEDM due to Electrical Conductivity of Dielectric (방전액의 전도율의 변화에 따른 와이어방전가공의 가공특성)

  • Kim, Chang-Ho;Kang, Jae-Won
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.15 no.6
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    • pp.15-21
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    • 2006
  • This work deals with the electrical conductivity of dielectric on output parameters such as metal removal rate and surface roughness value of a carbon steel(SM25C) and sintered carbides cut by wire electrical discharge machining (WEDM). Dielectric has several functions like insulation, ionization, cooling, the removal of waste metal particles. The presence of minute metal particles(debris) in spark gap contaminates and lowers the breakdown strength of dielectric. And it is considered that too much debris in spark gap is generally believed to be the cause of arcing. Experimental results show that increases of cobalt amount in carbides affects the metal removal rate and worsens the surface quality as a greater quantity of solidified metal deposits on the eroded surface. Lower electrical conductivity of the dielectric results in a lower metal removal rate because the gap between wire electrode and workpiece reduced. Especially, the surface characteristics of rough-cut workpiece and wire electrode were analyzed too. Debris were analyzed also through scanning electron microscopy(SEM) and surface roughness tester. Micro cracks and some of electrode material are found on the workpiece surface by energy dispersive spectrometer(EDS).