References
- Proceeding of CMP-MIC Investigation of CMP Micro-Scratch in the Fabrication of Sub-quarter Micron VLSI circuit J.Huang;H.C.Chen;J.Y.Wu;W.Lur
- Proceedings of CMP-MIC Improved STI CMP Technology for Micro-scratch Issue M.Lin;C.Y.Chang;D.C.Liao;B.Wang;Allen Henderson
- Journal of the Electrochemical Society v.146 no.6 Chemical mechanical polishing of polyarylether low dielectric constant layers by manganese oxide slurry T.Hara;T.Tomisawa;T.Kurosu;T.Doy https://doi.org/10.1149/1.1391936
- 전기전자재료학회논문지 v.16 no.12S 혼합 산화제가 W-CMP 특성에 미치는 영향 박창준;서용진;김상용;이우선 https://doi.org/10.4313/JKEM.2003.16.12S.1181
- Solid State Technology v.38 Giant Magnetoresistance for Tomorrow's Hard Drives K.Derbyshire;Ed Korczynski
- Critical Reviews in Solid State and Materials Science v.20 Copper Metalization for ULSI and Beyond Shyam P. Murarka;Steve W. Hymes https://doi.org/10.1080/10408439508243732
- MICRO Magazine. Feb. Developing effective inspection systems and strategies for monitoring CMP processes C.Dennison
- 20th VMIC Conference Proceedings Effects of Oxidizer Additive on the Performance of Copper Chemical Mechanical Polishing Using Tungsten Slurry W.S.Lee;G.W.Choi;Y.J.Seo;Y.O.Choi;K.J.Hong
- Journal of Materials Science Materials in Electronics v.12 An optimization of tungsten plug chemical mechanical polishing (CMP) using different consumables W.S.Lee;S.Y.Kim;Y.J.Seo;J.K.Lee https://doi.org/10.1023/A:1011276830620
- Department of Materials Science and Engineering and Engineering Research Center For Particle Science and Technology Optimal Size Distribution of CMP Slurry for Enhanced Polishing with Minimal Defects G.B.Basim;J.J.Adler;U.Mahajan;R.K.Singh;B.M.Moudgil
- Department of chemical engineering Localized Corrosion Effect and Modifications of Acidic and Alkaline Slurries Copper Chemical Polishing Tzu-Hsuan Tsai;Shi-Chern Yen
- Chemical Mechanical Planarization of Microelectronic Materials J.M.Steigerwald;S.P.Murarka;R.J.Gutmann