• Title/Summary/Keyword: Manufacturing defect

Search Result 413, Processing Time 0.025 seconds

Effective Construction Method of Defect Size Distribution Using AOI Data: Application for Semiconductor and LCD Manufacturing (AOI 데이터를 이용한 효과적인 Defect Size Distribution 구축방법: 반도체와 LCD생산 응용)

  • Ha, Chung-Hun
    • IE interfaces
    • /
    • v.21 no.2
    • /
    • pp.151-160
    • /
    • 2008
  • Defect size distribution is a probability density function for the defects that occur on wafers or glasses during semiconductor/LCD fabrication. It is one of the most important information to estimate manufacturing yield using well-known statistical estimation methods. The defects are detected by automatic optical inspection (AOI) facilities. However, the data that is provided from AOI is not accurate due to resolution of AOI and its defect detection mechanism. It causes distortion of defect size distribution and results in wrong estimation of the manufacturing yield. In this paper, I suggest a size conversion method and a maximum likelihood estimator to overcome the vague defect size information of AOI. The methods are verified by the Monte Carlo simulation that is constructed as similar as real situation.

Defect Type Prediction Method in Manufacturing Process Using Data Mining Technique (데이터마이닝 기법을 이용한 제조 공정내의 불량항목별 예측방법)

  • Byeon Sung-Kyu;Kang Chang-Wook;Sim Seong-Bo
    • Journal of Korean Society of Industrial and Systems Engineering
    • /
    • v.27 no.2
    • /
    • pp.10-16
    • /
    • 2004
  • Data mining technique is the exploration and analysis, by automatic or semiautomatic means, of large quantities of data in order to discover meaningful patterns and rules. This paper uses a data mining technique for the prediction of defect types in manufacturing Process. The Purpose of this Paper is to model the recognition of defect type Patterns and Prediction of each defect type before it occurs in manufacturing process. The proposed model consists of data handling, defect type analysis, and defect type prediction stages. The performance measurement shows that it is higher in prediction accuracy than logistic regression model.

Analysis of Equipment Factor for Smart Manufacturing System (스마트제조시스템의 설비인자 분석)

  • Ahn, Jae Joon;Sim, Hyun Sik
    • Journal of the Semiconductor & Display Technology
    • /
    • v.21 no.4
    • /
    • pp.168-173
    • /
    • 2022
  • As the function of a product is advanced and the process is refined, the yield in the fine manufacturing process becomes an important variable that determines the cost and quality of the product. Since a fine manufacturing process generally produces a product through many steps, it is difficult to find which process or equipment has a defect, and thus it is practically difficult to ensure a high yield. This paper presents the system architecture of how to build a smart manufacturing system to analyze the big data of the manufacturing plant, and the equipment factor analysis methodology to increase the yield of products in the smart manufacturing system. In order to improve the yield of the product, it is necessary to analyze the defect factor that causes the low yield among the numerous factors of the equipment, and find and manage the equipment factor that affects the defect factor. This study analyzed the key factors of abnormal equipment that affect the yield of products in the manufacturing process using the data mining technique. Eventually, a methodology for finding key factors of abnormal equipment that directly affect the yield of products in smart manufacturing systems is presented. The methodology presented in this study was applied to the actual manufacturing plant to confirm the effect of key factors of important facilities on yield.

A Study on Sensor Data Analysis and Product Defect Improvement for Smart Factory (스마트 팩토리를 위한 센서 데이터 분석과 제품 불량 개선 연구)

  • Hwang, Sewong;Kim, Jonghyuk;Hwangbo, Hyunwoo
    • The Journal of Bigdata
    • /
    • v.3 no.1
    • /
    • pp.95-103
    • /
    • 2018
  • In recent years, many people in the manufacturing field have been making efforts to increase efficiency while analyzing manufacturing data generated in the process according to the development of ICT technology. In this study, we propose a data mining based manufacturing process using decision tree algorithm (CHAID) as part of a smart factory. We used 432 sensor data from actual manufacturing plant collected for about 5 months to find out the variables that show a significant difference between the stable process period with low defect rate and the unstable process period with high defect rate. We set the range of the stable value of the variable to determine whether the selected final variable actually has an effect on the defect rate improvement. In addition, we measured the effect of the defect rate improvement by adjusting the process set-point so that the sensor did not deviate from the stable value range in the 14 day process. Through this, we expect to be able to provide empirical guidelines to improve the defect rate by utilizing and analyzing the process sensor data generated in the manufacturing industry.

Image Processing and Deep Learning-based Defect Detection Theory for Sapphire Epi-Wafer in Green LED Manufacturing

  • Suk Ju Ko;Ji Woo Kim;Ji Su Woo;Sang Jeen Hong;Garam Kim
    • Journal of the Semiconductor & Display Technology
    • /
    • v.22 no.2
    • /
    • pp.81-86
    • /
    • 2023
  • Recently, there has been an increased demand for light-emitting diode (LED) due to the growing emphasis on environmental protection. However, the use of GaN-based sapphire in LED manufacturing leads to the generation of defects, such as dislocations caused by lattice mismatch, which ultimately reduces the luminous efficiency of LEDs. Moreover, most inspections for LED semiconductors focus on evaluating the luminous efficiency after packaging. To address these challenges, this paper aims to detect defects at the wafer stage, which could potentially improve the manufacturing process and reduce costs. To achieve this, image processing and deep learning-based defect detection techniques for Sapphire Epi-Wafer used in Green LED manufacturing were developed and compared. Through performance evaluation of each algorithm, it was found that the deep learning approach outperformed the image processing approach in terms of detection accuracy and efficiency.

  • PDF

Auto Defect Repair Algorithm for LCD Panel Review & Repair Machine (LCD 패널 Review & Repair 장비의 결함수정 자동화 알고리즘)

  • Lee, W.C.;Lim, S.M.;Lee, S.K.;Jeong, S.H.;Hong, S.K.
    • Laser Solutions
    • /
    • v.15 no.1
    • /
    • pp.6-9
    • /
    • 2012
  • In TFT-LCD manufacturing process, various defects are generated by manufacturing machine trouble or particle. These defects can be repaired through the TFT-Laser repair process that only can't be automated in TFT-LCD manufacturing Process. In this Paper, we propose auto defect algorithm for TFT-LCD laser repair machine using image processing algorithm in order to automate process. Proposed algorithm can detect very small defects (< 2um) in 98% success ratio, and generated laser repair path guarantee highly precise position accuracy. Through proposed system, much of the work still done the old-fashioned way, by hand, can be automated and manufacturing company can be strengthed the competitiveness of cost.

  • PDF

Data Segmentation for a Better Prediction of Quality in a Multi-stage Process

  • Kim, Eung-Gu;Lee, Hye-Seon;Jun, Chi-Hyuek
    • Journal of the Korean Data and Information Science Society
    • /
    • v.19 no.2
    • /
    • pp.609-620
    • /
    • 2008
  • There may be several parallel equipments having the same function in a multi-stage manufacturing process, which affect the product quality differently and have significant differences in defect rate. The product quality may depend on what equipments it has been processed as well as what process variable values it has. Applying one model ignoring the presence of different equipments may distort the prediction of defect rate and the identification of important quality variables affecting the defect rate. We propose a procedure for data segmentation when constructing models for predicting the defect rate or for identifying major process variables influencing product quality. The proposed procedure is based on the principal component analysis and the analysis of variance, which demonstrates a better performance in predicting defect rate through a case study with a PDP manufacturing process.

  • PDF

Siamese Neural Networks to Overcome the Insufficient Data Problems in Product Defect Detection (제품 결함 탐지에서 데이터 부족 문제를 극복하기 위한 샴 신경망의 활용)

  • Shin, Kang-hyeon;Jin, Kyo-hong
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
    • /
    • 2022.05a
    • /
    • pp.108-111
    • /
    • 2022
  • Applying deep learning to machine vision systems for defect detection of products requires vast amounts of training data about various defect cases. However, since data imbalance occurs according to the type of defect in the actual manufacturing industry, it takes a lot of time to collect product images enough to generalize defect cases. In this paper, we apply a Siamese neural network that can be learned with even a small amount of data to product defect detection, and modify the image pairing method and contrastive loss function by properties the situation of product defect image data. We indirectly evaluated the embedding performance of Siamese neural networks using AUC-ROC, and it showed good performance when the images only paired among same products, not paired among defective products, and learned with exponential contrastive loss.

  • PDF

A Decision Tree Approach for Identifying Defective Products in the Manufacturing Process

  • Choi, Sungsu;Battulga, Lkhagvadorj;Nasridinov, Aziz;Yoo, Kwan-Hee
    • International Journal of Contents
    • /
    • v.13 no.2
    • /
    • pp.57-65
    • /
    • 2017
  • Recently, due to the significance of Industry 4.0, the manufacturing industry is developing globally. Conventionally, the manufacturing industry generates a large volume of data that is often related to process, line and products. In this paper, we analyzed causes of defective products in the manufacturing process using the decision tree technique, that is a well-known technique used in data mining. We used data collected from the domestic manufacturing industry that includes Manufacturing Execution System (MES), Point of Production (POP), equipment data accumulated directly in equipment, in-process/external air-conditioning sensors and static electricity. We propose to implement a model using C4.5 decision tree algorithm. Specifically, the proposed decision tree model is modeled based on components of a specific part. We propose to identify the state of products, where the defect occurred and compare it with the generated decision tree model to determine the cause of the defect.

An AHP Approach to Evaluate the priorities of Manufacturing Performance Criteria in Korean Automobile Parts Manufacturing Company (AHP에 의한 한국자동차부품제조사의 제조성과기준의 중요도 평가)

  • Kim, Tae-Soo
    • Journal of Korean Society of Industrial and Systems Engineering
    • /
    • v.34 no.3
    • /
    • pp.115-122
    • /
    • 2011
  • The critical role played by manufacturing performance measurement systems in achieving competitive success is increasingly recognized. Developing an integrated performance measurement model is significant for strategic management. This study consist of several principal steps. Performance criteria from the literature and an questionnaire were utilized prior to building the performance model. The AHP(Analytic Hierarchy Process) is utilized to evaluate the weight of each criterion when generating the performance measurement model for Korea automobile parts manufacturing company. AHP analysis showed clear difference in the priority between 5 criteria and 24 sub-criteria in terms of manufacturing performance of Korean automobile parts manufacturing company. The result of priority evaluation in the 5 criteria of 2nd level was ranked quality, cost, delivery, employee, flexibility. And the critical sub-criteria in the 24 sub-criteria of 3rd level was ranked claim rate, process defect rate, outsourcing parts defect rate, ability to quality management innovation, claim cost, etc.