• Journal of Sensor Science and Technology
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• v.14 no.5
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• pp.308-312
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• 2005

We present a microfluidic chip designed for the detection of antibody by using quantum dots fluorescence and a microbead-based assay. A custom designed PDMS microfluidic chip with multi-layer channel is utilized for capturing microbeads; antibody injection into each micro-well; QD injection; and fluorescence detection. The experiment using the fabricated microfluidic chip has been performed on solutions with various concentrations of antibody and has shown correlated fluorescent intensities.

• Applied Microscopy
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• v.51
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• pp.8.1-8.7
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• 2021

Growing demands for comprehending complicated nano-scale phenomena in atomic resolution has attracted in-situ transmission electron microscopy (TEM) techniques for understanding their dynamics. However, simple to safe TEM sample preparation for in-situ observation has been limited. Here, we suggested the optical microscopy based micro-manipulating system for transferring TEM samples. By adopting our manipulator system, several types of samples from nano-wires to plate-like thin samples were transferred on micro-electro mechanical systems (MEMS) chip in a single step. Furthermore, the control of electrostatic force between the sample and the probe tip is found to be a key role in transferring process.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2004.03a
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• pp.601-604
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• 2004

Precise position and attitude control of pico-satellite requires huge number of impulses of the order of 10$^{-6}$ Ns. MEMS solid rocket array is a promising propulsion system but the higher degree of miniaturization causes unreliable operation mainly due to quenching. In order to breakthrough this situation, a novel design of solid micro-rocket is proposed, which generates tiny impulses repetitively from a single rocket not from array. This unique micro-rocket is based on the utilization of quenching, which causes propellant reaction to sustain only in a small area. A test chip of a micro solid propellant tank and micro heater array is fabricated and ignition test is conducted. Obtained results show the feasibility of this concept and future direction of this quenching-based propulsion is discussed.

• Proceedings of the KIEE Conference
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• 2005.11a
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• pp.30-32
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• 2005

This paper reports on an LTCC-based packaging method using Au/Sn eutectic bonding process for RF MEMS applications. The proposed packaging structure was realized by a micromachining technology. An LTCC substrate consists of metal filled vertical via feedthroughs for electrical interconnection and Au/Sn sealing rim for eutectic bonding. The LTCC capping substrate and the glass bottom substrate were aligned and bonded together by a flip-chip bonding technology. From now on, shear strength and He leak rate will be measured then the fabricated package will be compared with the LTCC package using BCB adhesive bonding method which has been researched in our previous work.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2781-2784
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• 2007

Early detection of a disease is important to tackle treatment issues in a better manner. Several diagnostic techniques are in use, these days; for such purpose and tremendous research is going on to develop newer and newer methods. However, more work is required to be done to develop cheap and reliable early detection techniques. Micro-fluidic chips are also playing key role to deliver new devices for better health care. The present study focuses on a review of recent developments in the interrogation of different techniques and present state-of-the-art of microfluidic sensor for better, quick, easy, rapid, early, inexpensive and portable POCT (Point of Care testing device) device for a particular study, in this case, bone disease called osteoporosis. Some simulations of the microchip are also made to enable feasibility of the development of a blood-chip-based system. The proposed device will assist in early detection of diseases in an effective and successful manner.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.7
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• pp.1218-1223
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• 2007

A surface micro machined angular rate sensor utilizing a vibrating MEMS structure on a silicon has been developed. These tuning fork angular rate sensors are extremely rugged, inherently balanced, and easy to fabricate. The device is fabricated using a temperature compensation method based on automatic gain control technique. A linearity of approximately 0.6%, limited by the on-chip electronics has been obtained with this new sensor. Tests of the sensor demonstrate that its performance is equivalent to that required for implementation of a yaw control system. Vehicle handling and safety are substantially improved using the sensor to implement yaw control.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.237-240
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• 2005

The demand of micro electrical mechanical system (MEMS) bio/chemical sensor is rapidly increasing. To prevent the contamination of sensing area, a filtration system is required in on-chip total analyzing MEMS bio/chemical sensor. A nano-filter was mainly applied in some application detecting submicron feature size bio/chemical products such as bacteria, fungi and so on. We suggested a simple nano-filter fabrication process based on replication process. The mother pattern was fabricated by holographic lithography and reactive ion etching process, and the replication process was carried out using polymer mold and UV-imprinting process. Finally the nano-filter is obtained after removing the replicated part of metal deposited replica. In this study, as a practical example of the suggested process, a nano-dot array was replicated to fabricate nano-filter fur bacteria sensor application.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.12
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• pp.1844-1852
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• 2001

Recent developments in microfluidic devices based on microelectromechanical systems (MEMS) technique find many practical applications, which include electronic chip cooling devices, power MEMS devices, micro sensors, and bio-medical devices among others. For the design of such micro devices, flows characteristics inside a microchannel have to be clarified which exhibit somewhat different characteristics compared to conventional flows in a macrochannel. In the present study microchannels of various hydraulic diameters are fabricated on a silicon wafer to study the pressure drop characteristics. The effect of abrupt contraction and expansion is also studied. It is found from the results that the friction factor in a straight microchannel is about 15% higher than that in a conventional macrochannel, and the loss coefficients in abrupt expansion and contraction are about 10% higher than that obtained through conventional flow analysis.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.1
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• pp.15-21
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• 2013

In this paper, a MEMS tunable capacitor was successfully designed and fabricated using an aluminum nitride film and a gold suspended membrane with two air gap structure for commercial RF applications. Unlike conventional two-parallel-plate tunable capacitors, the proposed tunable capacitor consists of one air suspended top electrode and two fixed bottom electrodes. One fixed and the top movable electrodes form a variable capacitor, while the other one provides necessary electrostatic actuation. The fabricated tunable capacitor exhibited a capacitance tuning range of 375% at 2 GHz, exceeding the theoretical limit of conventional two-parallel-plate tunable capacitors. In case of the contact state, the maximal quality factor was approximately 25 at 1.5 GHz. The developed fabrication process is also compatible with the existing standard IC (integrated circuit) technology, which makes it suitable for on chip intelligent transceivers and radios.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.1-9
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• 2010

Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.