• Journal of the Korean Society for Precision Engineering
• /
• v.20 no.11
• /
• pp.180-187
• /
• 2003

A CAD-based seamless design system for MEMS named DS/MEMS was developed which performs coupled-field analysis, optimal and robust design. DS/MEMS has been developed by means of integrating commercial codes and inhouse code-SolidWorks, FEMAP, ANSYS and CA/MEMS. This strategy results in versatility that means to include various analysis model, corresponding analyses and approximated design sensitivity analysis and user friendliness that design variables are taken to be selectable directly from a CAD model, that the problem is formulated under a window environment and that the manual job during optimization process is almost eliminated. DS/MEMS works on a parametric CAD platform, integrating CAD modeling, analysis, and optimization. Nonlinear programming algorithms, the Taguchi method, and response surface method are made available for optimization. One application problem is taken to illustrate the proposed methodology and show the feasibility of DS/MEMS as a practical tool.

• Journal of Sensor Science and Technology
• /
• v.29 no.5
• /
• pp.354-359
• /
• 2020

The high vacuum hermetic sealing technique ensures excellent performance of MEMS resonators. For the high vacuum hermetic sealing, the customization of anodic bonding equipment was conducted for the glass/Si/glass triple-stack anodic bonding process. Figure 1 presents the schematic of the MEMS resonator with triple-stack high-vacuum anodic bonding. The anodic bonding process for vacuum sealing was performed with the chamber pressure lower than 5 × 10^-6 mbar, the piston pressure of 5 kN, and the applied voltage was 1 kV. The process temperature during anodic bonding was 400 ℃. To maintain the vacuum condition of the glass cavity, a getter material, such as a titanium thin film, was deposited. The getter materials was active at the 400 ℃ during the anodic bonding process. To read out the electrical signals from the Si resonator, a vertical feed-through was applied by using through glass via (TGV) which is formed by sandblasting technique of cap glass wafer. The aluminum electrodes was conformally deposited on the via-hole structure of cap glass. The TGV process provides reliable electrical interconnection between Si resonator and aluminum electrodes on the cap glass without leakage or electrical disconnection through the TGV. The fabricated MEMS resonator with proposed vacuum packaging using three-layer anodic bonding process has resonance frequency and quality factor of about 16 kHz and more than 40,000, respectively.

• Journal of the Korean Society for Precision Engineering
• /
• v.22 no.11 s.176
• /
• pp.165-172
• /
• 2005

In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• Journal of Sensor Science and Technology
• /
• v.24 no.5
• /
• pp.287-290
• /
• 2015

Liquid crystal polymer (LCP) is a thermoplastic polymer with superior mechanical and thermal properties. In addition, its characteristics include very low water absorption rate and possibility to apply bonding process under low temperature. In this study, LCP is utilized as a packaging material for a microelectronic system (MEMS) based safety device with suggestion of a low temperature packaging process. Highly sensitive and stable capacitive type humidity sensor is fabricated to investigate hermeticity of the packaged MEMS device.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.05a
• /
• pp.1433-1434
• /
• 2010

• Proceedings of the Optical Society of Korea Conference
• /
• 2000.08a
• /
• pp.154-155
• /
• 2000

Optical switches using MEMS(Micro Electro Mechanical Systems) process have been widely developed since conventional optical switches cannot meet the requirements of new systems. $N_2$ type micro-mirror switches are easy to control, have simple optical systems but have difficulties in expanding the ports. Micromirrors of 2N type switches must be tilted at various angles and have relatively complicated optical systems but have advantage in expanding ports. Another type of optical switch using MEMS process is micro-waveguide type. It is reliable than other types since it has no moving parts.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.31 no.7
• /
• pp.53-62
• /
• 2003

• The Journal of the Korea institute of electronic communication sciences
• /
• v.8 no.7
• /
• pp.979-986
• /
• 2013

Recently, in the electric, electronic, robotic, and medical industries, a great attention has been paid to the development of MEMS-based smart devices with a compact size and highly intelligency. The MEMS technology is very effective in designing into a compact size and lightweight by combining into one the complex electrical, mechanical, chemical, and biological features which are required by smart devices, and at the same time, in bulk batch manufacturing. Therefore, this study, to prepare for upcoming new MEMS-based technological paradigm, analyzes MEMS processes and then considers its Applications.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2011.06a
• /
• pp.177-178
• /
• 2011

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2003.11a
• /
• pp.946-969
• /
• 2003

Vibration analysis for a coupled MEMS gyroscope design is presented in this paper. MEMS gyroscopes have shown that slight mistuning in fabricated process often leads to significant difference of vibration characteristics between expected and real designs. The difference frequently affects the MEMS gyroscope design in a negative way. As long as the coupling between excited and sensed motions exists, such difference occurs inevitably. In this paper, dimensionless parameters that govern the vibration characteristics of coupled MEMS gyroscope are identified and the effects of the parameters on the vibration characteristics are investigated for the design of the MEMS gyroscope.