• 한국정밀공학회지
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• 제28권2호
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• pp.245-250
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• 2011

A high-resolution shadow mask, a nanostencil, is widely used for high resolution lithography. This high-resolution shadowmask is often fabricated by a combination of MEMS processes and focused ion beam (FIB) milling. In this study, FIB milling on 500-nm-thin SiN membrane was tested and characterized. 500 nm thick and $2{\times}2$ mm large membranes were made on a silicon wafer by micro-fabrication processes of LPCVD, photolithography, ICP etching and bulk silicon etching. A subsequent FIB milling enabled local membrane thinning and aperture making into the thinned silicon nitride membrane. Due to the high resolution of the FIB milling process, nanoscale apertures down to 60 nm could be made into the membrane. The nanostencil could be used for nanoscale patterning by local deposition through the apertures.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.230-232
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• 2006

Eutectic Au-20Sn solder has been widely used for optoelectronic packages because of fluxless soldering process and thus are particularly valuable for many applications such as biomedical, photonic, and MEMS devices that can not use any flux. Also when good joint strength, superior resistance to corrosion, whisker-free, and good thermal conductivity are demanded, eutectic Au-20Sn solder can be satisfied with above-mentions best. In this study, we tried to know the interfacial reactions between Au-20Sn solder and Cu substrate with or without ENIG plating layer In the results, Au-Cu-Sn ternary phases were formed at the Au-20Sn/Cu substrate, and Au-Ni-Sn, Au-Ni-Cu-Sn phases were formed at the Au-20Sn/ENIG substrate.

• 대한기계학회논문집A
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• 제28권8호
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• pp.1065-1074
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• 2004

A robust optimal design considering fabrication influence has been performed for the decoupled vibratory microgyroscope fabricated by the bulk micromachining. For the analysis of the gyroscope, a design tool has been developed, by which user can perform the system level design considering electric signal process and the fabrication influence as well as mechanical characteristics. An initial design of the gyroscope is performed satisfying the performances of scale factor (or sensitivity) and phase delay, which depend on the frequency difference between driving and sensing resonant frequencies. The objective functions are formulated in order to reduce the variances of the frequency difference and the frequency in itself by fabrication error. To certify the results, the standard deviations are calculated through the Monte Caries Simulation (MCS) and compared initial deviation that is measured fabricated gyroscope chip.

• 한국공작기계학회논문집
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• 제11권3호
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• pp.14-20
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• 2002

Recently, miniaturization and mass production are the main trends in manufacturing fields. Therefore, ultraprecision machining and MEMS technology have been taken more 7md more important position in machining of microparts. Micro endmilling is one of the prominent technology that has wide spectrum of application field ranging from duo parts to micro products, such as PDP md IT components, in precision products manufacturing. However, decreasing of burr is significant problem in making smooth and precise parts in micro endmilling. This paper shows removal characteristics of burr generated by micro endmilling process. This results satisfies micro endmilling for micro barrier ribs of heights is $50{\mu}m$, $100{\mu}m$, $200{\mu}m$, $300{\mu}m$, and observation from of burr. Additionally, it is necessary to understand the formation mechanism of burr of micro barrier ribs to iud proper decreasing method.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.408-411
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• 2003

최근 활발하게 연구가 진행되고 있는 마이크로 인덕터는 자기 데이터 저장을 위한 헤드, 자기장 센서, 마이크로 변압기와 휴대폰의 수동 소자와 같은 다양한 분야에 이용되고 있다. 마이크로 인덕터를 제작하기 위해 UV-LIGA 공정을 개발하였다. 도금 공정을 이용하여 마이크로 인덕터의 철심과 구리선 제작하였다. 도금 공정을 위해 필요한 마이크로 몰드는 여러 종류의 thick photoresist를 이용하여 저응력 공정으로 제작하였다. 도금 공정을 이용하여 toroid형 마이크로 인덕터를 제작하였다. 도금 공정에서 발생 할 수 있는 응력을 최소화할 수 있는 공정을 개발하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.161-162
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• 2006

Micro-stereolithography technology is used for fabricating of 3-dimensional micro-structures. In some cases, this technology is more economical and simpler than MEMS and LIGA technologies based on semiconductor process. In this research, the micro-sterolithography apparatus that is more economical and simpler than current micro-stereolithography apparatus was developed. This apparatus uses UV lamp and optical fiber as a light source and tight delivery system, respectively.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.533-534
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• 2006

Micro pyramid pattern and its array are designed to enhance the brightness and its uniformity of LGP which is one of key parts in LCD. The designed micro pyramid patterns are fabricated on a Si-wafer first through MEMS process and then a Ni-stamper is electro-plated from the Si pattern master. Adopting the fabricated Ni-stamper, LGPs are injection molded at different mold temperatures and the fidelity of the pattern replication is estimated for each molding conditions and pattern locations. The replicated patterns are found to have some defect such as local short shot or micro weld line which are believed to have negative effect on the performance of the LGP.

• 한국공작기계학회논문집
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• 제14권5호
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• pp.35-40
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• 2005

An experimental Investigation of the basic characteristics of a micro-cantilever sensor was performed by inspecting the amplitude and frequency characteristics of a commercial tuning fork (TF). Application of acetone and ethanol with a volume of $1{\mu}l$ on the tine of a vibrating tuning fork causes immediate response in its amplitude and frequency characteristics. It has been shown that the tuning fork has ability to recognize a chemical agent with high sensitivity. The theoretical sensitivity of mass loading is in the range of $\~0.1Hz/ng$. Quartz tuning forks are routinely made using standard microfabrication process, thus suggesting the possibility of microfabrication of micro quart sensors.

• 정보저장시스템학회논문집
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• 제1권2호
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• pp.175-181
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• 2005

SiOB is an essential part of slim optical pickup, where the silicon mirror, LD stand, silicon PD are integrated and LD is flip chip bonded. SiOB is fabricated with bulk micromachining. Especially the fabrication of silicon wafer with stepped concave areas has many extraordinary difficulties. As a matter of fact, experiences and knowledges are rare in the fabrication of the highly stepped silicon wafer. The difficulties occurring in the integration of PD and SiOB, and highly stepped patterning, and silicon mirror roughness and how-to-solve will be discussed.

• 한국전기전자재료학회논문지
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• 제24권2호
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• pp.112-115
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• 2011

To stabilize the electric characteristic of Silicon Thin Film Transistor, reducing the current leakage is most important issue. To reduce the current leakage, many ideas were suggested. But the increase of mask layer also increased the cost. On this research Bird's Beak process was use to present element. Using Silvaco simulator, it was proven that it was able to reduce current leakage without mask layer. As a result, it was possible to suggest the structure that can reduce the current leakage to 1.39nA without having mask layer increase. Also, I was able to lead the result that electric characteristic (on/off current ratio) was improved compare from conventional structure.