• Journal of Sensor Science and Technology
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• v.15 no.1
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• pp.58-64
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• 2006

In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.

• Journal of Biomedical Engineering Research
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• v.42 no.4
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• pp.193-200
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• 2021

Flowmeter and oxygen sensors are listed in COVID-19 essential medical devices. This article reports a Teensy microcontroller-based Oxygen mass flow controller (MFC), core part of the oxygen respirator or extracorporeal membrane oxygenation (ECMO). The developed MFC consisting of the microcontroller, MEMS flow sensor, and solenoid valve was able to accurately control 0 to 100 sccm of oxygen flow rate. The pressure of vacuum chamber increased proportionally to the flow rate (0.998 of Pearson correlation coefficient). The experimental results proved that the developed MFC exhibits comparable performance to a commercial MFC in accuracy, settling time, linearity with pressure, and repeatability of oxygen mass flow control. It is expected that this simple and cheap MFC is utilized for oxygen therapy against the severe acute respiratory syndrome coronavirus 2.

• 전자공학회논문지 IE
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• v.49 no.1
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• pp.12-17
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• 2012

Fast development of ubiquitous technology prompted the broadening of the related application area. Application of ubiquitous techniques and system into the construction sites may give us many benefits. There are always a lot of hazard situations in construction sites, and the falling is known to have the high accident rate. To prevent the falling, there has been a lot of efforts including safety education and use of safety gears. In this study, we designed, fabricated and tested a system that can monitor the worker's safety and location informations in real time by using the wireless technology of TOA and RSSI. We used ATmegal28 that is popular in the industrial equipments as MCU and NanoPan 5357 module from Nanotron and CC2500 chipset from TI for radio circuits. We also used 3-axis accelerometer and pressure MEMS sensors to obtain the environmental information, and therefore to aquire the informations of the worker's movement and altitude. We used Labview software from National Instrument to monitor and control the system. We developed the system to send the warning alarms to the server operator and the workers when the workers in the danger zone did not wear the safety hook.

• Journal of Sensor Science and Technology
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• v.22 no.3
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• pp.175-180
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• 2013

This paper describes the characteristics of cubic silicon carbide (3C-SiC) films grown on a carbonized Si(100) substrate, using hexamethyldisilane (HMDS, $Si_2(CH_3)_6$) as a safe organosilane single precursor in a nonflammable $H_2$/Ar ($H_2$ in Ar) mixture carrier gas by atmospheric pressure chemical vapor deposition (APCVD) at $1280^{\circ}C$. The growth process was performed under various conditions to determine the optimized growth and carbonization condition. Under the optimized condition, grown film has a single crystalline 3C-SiC with well crystallinity, small voids, low residual stress, low carrier concentration, and low RMS. Therefore, the 3C-SiC film on the carbonized Si (100) substrate is suitable to power device and MEMS fields.

• International Journal of Automotive Technology
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• v.7 no.7
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• pp.827-832
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• 2006

Occupant classification and position detection have been significant research areas in intelligent safety systems in the automotive field. The detection and classification of seat occupancy open up new ways to control the safety system. This paper deals with a novel algorithm development, hardware implementation and testing of a prototype intelligent safety system for occupant classification and position detection for in-vehicle environment. Borland C++ program is used to develop the novel algorithm interface between the sensor and data acquisition system. MEMS strain gauge hermatic pressure sensor containing micromachined integrated circuits is installed inside the passenger seat. The analog output of the sensor is connected with a connector to a PCI-9111 DG data acquisition card for occupancy detection, classification and position detection. The algorithm greatly improves the detection of whether an occupant is present or absent, and the classification of either adult, child or non-human object is determined from weights using the sensor. A simple computation algorithm provides the determination of the occupant's appropriate position using centroidal calculation. A real time operation is achieved with the system. The experimental results demonstrate that the performance of the implemented prototype is robust for occupant classification and position detection. This research may be applied in intelligent airbag design for efficient deployment.

• Journal of Sensor Science and Technology
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• v.13 no.6
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• pp.473-478
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• 2004

This study focused on the charateristic of magnetic fluids, the viscosity deviation of magnetic fluids due to temperature changes, and fabrication of a 'purely' liquid type microvalve. The viscosity of magnetic fluids decreases sharply during increasing of temperature. The viscosity of magnetic fluids is rated 1,000 cP at the room temperature and 25 cP when the temperature reaches $100^{\circ}C$. Briefly, it is remarkable that the fluid flow can be controlled by the temperature and this characteristic can be adopted to the microfluidics as a microvalve. The fabrication of a liquid type microvalve is more easy than solid state microvalves and which can increase an efficiency of the controlability with respect to the thermo-pneumatic micropump which is studied broadly for many years. When the magnetic fluid used as a sealant for high level sealing, the pressure leakage is less than solid state microvalve. The experimental results show that the pressure drop in microchannel, filled with the magnetic fluid, is significant in the temperature range of $20^{\circ}C{\sim}50^{\circ}C$ and this result explains why the use of magnetic fluids is possible as a microvalve searcher uses this characteristics. Well known thermo-pnumatic.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.55-59
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• 2018

In this paper, we investigated the characteristics of shear stress type piezoresistor on a diaphragm structure formed by MEMS (Microelectromechanical System) technology of silicon-direct-bonding (SDB) wafers with Si/$SiO_2$/Si-sub. The diaphragm structure formed by etching the backside of the wafer using a TMAH aqueous solution can be used for manufacturing various sensors. In this study, the optimum shape condition of the shear stress type piezoresistor formed on the diaphragm is found through ANSYS simulation, and the diaphragm structure is formed by using the semiconductor microfabrication technique and the shear stress formed by boron implantation. The characteristics of the piezoelectric resistance are compared with the simulation results. The sensing diaphragm was made in the shape of an exact square. It has been experimentally found that the maximum shear stress for the same pressure at the center of the edge of the diaphragm is generated when the structure is in the exact square shape. Thus, the sensing part of the sensor has been designed to be placed at the center of the edge of the diaphragm. The prepared shear stress type piezoresistor was in good agreement with the simulation results, and the sensitivity of the piezoresistor formed on the $2200{\mu}m{\times}2200{\mu}m$ diaphragm was $183.7{\mu}V/kPa$ and the linearity of 1.3 %FS at the pressure range of 0~100 kPa and the symmetry of sensitivity was also excellent.

• Journal of the Korean GEO-environmental Society
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• v.14 no.8
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• pp.45-51
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• 2013

In the construction site of underground buildings which have severe environment such as dust, noise, vibration, the technology of rescue the builders in the construction site when accident occurs by tracking the location of the builders and express the mission of supervisor smoothly. In this study, in order to acquire the location information of the builders in the construction site of underground buildings by using MEMS INS and air pressure sensor, we firstly performed the field test in construction site, analyzed the location and the elevation accuracy based on the detected results, and then verified its practicality and rationality after all. As a result, we could acquire worker's position-accuracy within 10m in horizontal direction and 4m in vertical direction. Therefore we could judge availability in construction fields of underground structure.

• Journal of the Korean Vacuum Society
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• v.12 no.3
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• pp.151-156
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• 2003

Two capacitance diaphragm gauges(CDG) and two resonance silicon gauges(RSG) were calibrated using an ultrasonic interferometer as a national low vacuum standard in KRISS. The CDG has superior pressure resolution and is rugged as well as resistant to over-pressure because of all-metal inner components. Meanwhile, the RSG is a new type of MEMS sensor that has excellent calibration stability and is resistant to mechanical shocks. The calibration uncertainties were analyzed according to the ISO procedures. Results showed that the maximum difference of the expanded uncertainties was $9\times10^{-3}$Pa at the generated pressure of 100 Pa for the two different types. It is remarkable that the RSG can be used as a transfer standard at low vacuum since their accuracies were found to be within 0.5 %.

• Journal of Sensor Science and Technology
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• v.9 no.2
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• pp.134-140
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• 2000

Si wafer direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electronic devices and MEMS applications. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration and applied pressure. The bonding strength was evaluated by tensile strength method. A bond characteristic on the interface was analyzed by using FT-IR, and surface roughness according to HF concentration was analyzed by AFM. Si-F bonds on Si surface after HF pre-treatment are replaced by Si-OH during a DI water rinse. Consequently, hydrophobic wafer was bonded by hydrogen bonding of Si-OH$\cdots$(HOH$\cdots$HOH$\cdots$HOH)$\cdots$OH-Si. The pre-bonding strength depends on the HF pre-treatment condition before pre-bonding. (Min : $2.4kgf/cm^2{\sim}$Max : $14.9kgf/cm^2$)