• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.352-353
• /
• 2006

가스센서용 마이크로 히터 제작에는 표연 마이크로 머시닝 또는 벌크 마이크로머시닝 기술을 이용한다. 표면 마이크로 머시닝에 의한 마이크로 히터 (MHP) 구조의 경우, 기판과 박막간의 폭이 좁기 때문에 에칭 공정 후 세정이 잘 이루어지지 않으면 열적 절연이 잘 이루어지지 않아서 히터와 센서의 성능을 저하시키는 원인이 된다. 본 연구에서는 표면 마이크로 머시닝 기술에 의한 가스 센서용 마이크로 히터를 제작한다. $SiO_2$와 $Si_3N_4$를 성분으로 하며, $100{\mu}m\;{\times}\;100{\mu}m$의 면적과 350 nm 의 두께를 갖는 가스 센서용 마이크로 히터를 제작하였다. 이를 위하여 ANSYS를 통한 유한요소해석에 의한 열분포 해석으로 최적구조를 확인하였다. 센서로의 열 전달 효율을 높이기 위해 센서 박막은 히터 위에 적층하였다. 실리콘 표면과 마이크로 히터와의 간격은 에칭 공정을 통하여 $2{\mu}m$로 하였으며, 이 공간에서는 에칭 및 세정 후에 이물질이 깨끗이 세정되지 않고 남아 있거나, 습식 공정 중에 수분의 장력에 의한 열전연성이 나빠질 수 있는 등 단점이 있다. 이는 건식 등방성 에칭 공정을 통하여 해결하였다.

• Journal of Institute of Control, Robotics and Systems
• /
• v.19 no.2
• /
• pp.81-86
• /
• 2013

In this paper, the parameter identification for localization scheme for the optics-based micro sensor node is conducted. We analyzed short measurement range problem which can be occurred in optical based micro sensor node localization method using a time of flight. And we set up the theory for distance and maximum reflected laser power to overcome the problem by identifying hardware parameters like laser power, effective area of MEMS CCR, sensitivity of photodetector, and so on. Experimental results of measurement of maximum reflected laser power were compared with results of the theory. By using the theory, we can identify hardware parameters of localization scheme to measure particular position of the optics-based micro sensor node.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.238-239
• /
• 2009

The amorphous silicon microbolometer array has been developed by the MEMS design and fabrication technology. Before the bolometer array for the image sensor being designed, the structure of unit cell and $16\times16$ array of it was simulated, designed and fabricated. The properties of bolometer have been measured as such that the TCR -3%/K.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.1210-1213
• /
• 2005

Micro heat flux sensor is used in various industries to measure heat flux. In this study, a micro heat flux sensor is fabricated using the MEMS (Micro Electro Mechanical Systems) techniques. The fabricated sensor is composed in thermopile for sensor and SU-8 for thermal resistance layer. The new method of fabrication SU-8 is proposed in this study. The sensitivity is $44\;\mu{V/(W/cm^2)}$ at steady state and Reynolds number is 91322.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.33 no.5
• /
• pp.350-354
• /
• 2020

In this study, a pressure sensor for each displacement was fabricated based on the silicon-based pressure sensor obtained through simulation results. Wires were bonded to the pressure sensor, and a piezoresistive pressure sensor was inserted into the printed circuit board (PCB) base by directly connecting a micro-electro-mechanical system (MEMS) sensor and a readout integrated circuit (ROIC) for signal processing. In addition, to prevent exposure, a non-conductive liquid silicone was injected into the sensor and the entire ROIC using a pipette. The packaging proceeded to block from the outside. Performing such packaging, comparing simple contact with strong contact, and confirming that the measured pulse wavelength appears accurately.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.56 no.7
• /
• pp.1218-1223
• /
• 2007

A surface micro machined angular rate sensor utilizing a vibrating MEMS structure on a silicon has been developed. These tuning fork angular rate sensors are extremely rugged, inherently balanced, and easy to fabricate. The device is fabricated using a temperature compensation method based on automatic gain control technique. A linearity of approximately 0.6%, limited by the on-chip electronics has been obtained with this new sensor. Tests of the sensor demonstrate that its performance is equivalent to that required for implementation of a yaw control system. Vehicle handling and safety are substantially improved using the sensor to implement yaw control.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.55 no.9
• /
• pp.456-460
• /
• 2006

This paper deals with a novel autocalibration method of three-axis micromachined accelerometers applied to a new digital intelligent putter for golfers. This putter can help golfers monitor and analyze their putting posture and therefore modify their putting action to get better score and enjoy their lives through golf. The micromachined accelerometers to get information of the motion are the essential part of the putter to measure the three-axis acceleration as accurately as possible. This paper presents an efficient autocalibration algorithm to find the offset and sensitivity of accelerometers by only using the static measurement data at six different positions. The experimental results on the developed putters show the validity of the proposed algorithm for the new smart putter.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.07b
• /
• pp.950-952
• /
• 2003

This paper have been studied fabrication and characteristics of disposable pH sensor using MEMS technology. The sensor has two open-well structure, the container for the internal electrolyte and electrode were formed by anisotropically etching a silicon substrate. unlike currently used KCI saturated solution, the structure was introduced hydrogel which take an advantage of miniaturization, bulk product, a low price. PU and CA/TP used to measurement ion detection, one is reference membrane and the other is pH. fabricated sensor is encapsulated entirely with epoxy, finally sensor was estimated various ion sorts and pH ranges.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.4
• /
• pp.317-322
• /
• 2010

This paper reports the fabrication and characterization of surface micromachined poly 3C-SiC capacitive pressure sensors on silicon wafer operable in touch mode and normal mode for high temperature applications. FEM(finite elements method) simulation has been performed to verify the analytical mode. The sensing capacitor of the capacitive pressure sensor is composed of the upper metal and the poly 3C-SiC layer. Measurements have been performed in a temperature range from $25^{\circ}C$ to $500^{\circ}C$. Fabrication process of designed poly 3C-SiC touch mode capacitive pressure sensor was optimized and would be applicable to capacitive pressure sensors that are required high precision and sensitivity at high pressure and temperature.

• Proceedings of the KIEE Conference
• /
• 2008.07a
• /
• pp.1472-1473
• /
• 2008

Polyimide thin films were cured locally using MEMS microhotplates. The polyimide locally cured at temperature over 350$^{\circ}C$ for 1 hour was fully cured. There was no significant difference between polyimide thin films cured in a conventional convection oven and those cured locally on MEMS microhotplates. The locally cured polyimide humidity sensor showed a linearity of 0.9995, a sensitivity of 0.77 pF/%RH, a hysteresis of 0.6 %RH, and a response time of 3s. These results indicate that the locally-cured polyimide films may be used as dielectric material of high speed, highsensitivity humidity sensors.