• 전력전자학회:학술대회논문집
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• 전력전자학회 2010년도 추계학술대회
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• pp.40-43
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• 2010

This paper deals with a new two dimensional clinometer based on dual axis micromachined accelerometers. The clinometer is a small and low-cost product, which is mainly developed to help golfers read easily the tilt of a putting green. First, this paper proposes the principle of two dimensional clinometer and also a calibration method with respect to the offset voltage and sensitivity of a accelerometer. Experimental results on the developed clinometer show that the proposed clinometer can provide useful information on the tilt angle and direction of an inclined plane.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.511-512
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• 2012

• 한국재료학회:학술대회논문집
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• 한국재료학회 2005년도 춘계학술발표대회 및 제8회 신소재 심포지엄 논문개요집
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• pp.125-125
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• 2005

• 세라미스트
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• 제7권3호
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• pp.48-54
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• 2004

반도체 집적화 공정 기술을 바탕으로 기계적 구조물(Micromachined mechanical structure)구현을 가능하게 한 Microelectromechanical systems (MEMS) 기술은 최근 들어 새로운 연구분야로서 크게 각광받고 있다. 이러한 MEMS 기술은 자동차, 산업, 의공학, 정보과학 등에 폭넓게 응용되고 있으며 실리콘 가공 기술 및 미세전기소자 (Microelectronics) 기술이 융합되어 전기$.$기계적인 미세소자를 제작하는데 널리 이용되고 있다. (중략)

• 센서학회지
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• 제15권2호
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• pp.148-152
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• 2006

This paper describes the fabrication of SiCN microstructures for super-high temperature MEMS using photopolymerization of pre-ceramic polymer. In this work, polysilazane liquide as a precursor was deposited on Si wafers by spin coating, microstructured and solidificated by UV lithography, and removed from the substrate. The resulting solid polymer microstructures were cross-linked under HIP process and pyrolyzed to form a ceramic of withstanding over $1400^{\circ}C$. Finally, the fabricated SiCN microstructures were annealed at $1400^{\circ}C$ in a nitrogen atmosphere. Mechanical characteristics of the SiCN microstructure with different fabrication process conditions were evaluated. The elastic modules, hardness and tensile strength of the SiC microstructure implemented under optimum process condtions are 94.5 GPa, 10.5 GPa and 11.7 N/min, respectively. Consequently, the SiCN microstructure proposed in this work is very suitable for super-high temperature MEMS application due to very simple fabrication process and the potential possiblity of sophisticated mulitlayer or 3D microstructures as well as its good mechanical properties.

• 센서학회지
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• 제27권2호
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• pp.99-104
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• 2018

A micro electromagnetic actuator with high vibration efficiency is proposed for use in an implantable hearing device. The actuator, which can be implanted in the middle ear, consists of membranes based on the stainless steel 304 (SUS-304), and other components. In conventional actuators, in which a thick membrane and a silicone elastomer are used, the size reduction was difficult. In order to miniaturize the size of the actuator, it is necessary to reduce the size of the actuation potion that generates the driving force, resulting in reduction of the electromagnetic force. In this paper, the electromagnetic actuator is further miniaturized by the metal membrane and the vibration amplitude is also optimized. The actuator designed according to the simulation results was fabricated by using micro-electro-mechanical systems (MEMS) technology. In particular, a $20{\mu}m$ thick metal membrane was fabricated using the erosion process, which reduced the length of the actuator by more than $400{\mu}m$. In the experiments, the vibration displacement characteristics of the optimized actuator were above 400 nm within the range of 0.1 to 1 kHz when a current of $1mA_{rms}$ was applied to the coil.

• 한국소음진동공학회논문집
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• 제18권8호
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• pp.872-878
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• 2008

Many industrial operations require continuous or nearly-continuous operation of machines, interruption of which can result in significant cost loss. The condition monitoring of these machines has received considerable attentions in recent years. Rapid developments in semiconductor, computing, and communication with a remote site have led to a new generation of sensor called "smart" sensors which are capable of wireless communication with a remote site. The purpose of this research is to develop a new type of smart sensor for on-line condition monitoring. This system is addressed to detect conditions that may lead to equipment failure when it is running. Moreover it will reduce condition monitoring expense using low cost MEMS accelerometer. This system is capable for signal preprocessing task and analog to digital converter which is controlled by CPU. This sensor communicates with a remote site PC using TCP/IP protocols. The developed sensor executes performance tests for data acquisition accuracy estimations.

• 센서학회지
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• 제15권1호
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• pp.53-57
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• 2006

This paper describes a novel processing technique for fabrication of polymer-derived SiCN (silicone carbonitride) microstructures for super-temperature MEMS applications. PDMS (polydimethylsiloxane) mold is fabricated on SU-8 photoresist using standard UV photolithographic process. Liquid precursor is injected into the PDMS mold. Finally, solid polymer structure is cross-linked using HIP (hot isostatic pressure) at $400^{\circ}C$, 205 bar. Optimum pyrolysis and annealing conditions are determined to form a ceramic microstructure capable of withstanding over $1400^{\circ}C$. The fabricated SiCN ceramic microstructure has excellent characteristics, such as shear strength (15.2 N), insulation resistance ($2.163{\times}10^{14}{\Omega}$) and BDV (min. 1.2 kV) under optimum process condition. These fabricated SiCN ceramic microstructures have greater electric and physical characteristics than bulk Si wafer. The fabricated SiCN microstructures would be applied for supertemperature MEMS applications such as heat exchanger and combustion chamber.

• 마이크로전자및패키징학회지
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• 제11권4호
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• pp.13-22
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• 2004

MEMS 소자의 패키지는 일반적으로 패키징 과정에서 큰 온도변화를 받게 되는데, 이에 의한 패키지의 변형은 패키지 및 소자의 신뢰성에 큰 영향을 미칠 수 있다. 본 논문에서는 진동형 MEMS 자이로스코프 센서의 패키지를 대상으로 하여, 온도변화로 인한 열변형 거동에 대한 광학실험과 해석을 수행하였다. 이를 위하여 실시간 모아레 간섭계를 이용하여 각 온도단계에서 변위분포를 나타내는 간섭무늬를 얻고, 그로부터 MEMS 패키지의 굽힘변형 거동 및 인장변형에 대한 해석을 수행하였다. MEMS 칩과 EMC 및 PCB의 열팽창계수 차이로 인하여 패키지는 $125^{\circ}C$ 이하에서는 전체적으로 아래로 볼록한 굽힘변형이 발생하였으며, 온도 $140^{\circ}C$를 정점으로 그 이상의 온도에서는 반대의 굽힘변형이 발생하였다. MEMS의 주파수에 영향을 줄 수 있는 칩 자체의 수축변형률은 약 $481{\times}10^{-6}$로 측정되어서 MEMS 설계시 이를 고려하여야 함을 알 수 있다.

• 한국측량학회지
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• 제28권6호
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• pp.637-643
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• 2010

본 연구에서는 비디오카메라와 GPS/MEMS IMU, UMPC를 결합하여 영상과 위치/자세 데이터를 획득하는 휴대용 멀티센서 시스템을 구축하였다. 구축된 시스템을 통해 획득된 데이터를 이용하여 지상기준점을 이용하지 않고 광속조정법 기반의 영상 geo-referencing을 수행하고 정확도 검증을 통해 시스템의 효용성을 평가하였다. 정확도 검증 결과, 지상점의 상대좌표 정확도는 RMSE가수 cm내외로 상당히 정확함을 확인할 수 있었다. 구축된 시스템은 대상 객체의 3차원 모델과 상대좌표를 획득하는데 있어서 충분히 활용 가능하다고 판단된다. 향후에는 시스템 및 카메라의 엄밀한 보정을 통해 절대좌표의 정확도를 개선할 예정이다.