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http://dx.doi.org/10.5369/JSST.2006.15.1.053

Fabrication of SiCN microstructures for super-high temperature MEMS using PDMS mold and its characteristics  

Chung, Gwiy-Sang (School of Electrical Eng., University of Ulsan)
Woo, Hyung-Soon (School of Electrical Eng., University of Ulsan)
Publication Information
Journal of Sensor Science and Technology / v.15, no.1, 2006 , pp. 53-57 More about this Journal
Abstract
This paper describes a novel processing technique for fabrication of polymer-derived SiCN (silicone carbonitride) microstructures for super-temperature MEMS applications. PDMS (polydimethylsiloxane) mold is fabricated on SU-8 photoresist using standard UV photolithographic process. Liquid precursor is injected into the PDMS mold. Finally, solid polymer structure is cross-linked using HIP (hot isostatic pressure) at $400^{\circ}C$, 205 bar. Optimum pyrolysis and annealing conditions are determined to form a ceramic microstructure capable of withstanding over $1400^{\circ}C$. The fabricated SiCN ceramic microstructure has excellent characteristics, such as shear strength (15.2 N), insulation resistance ($2.163{\times}10^{14}{\Omega}$) and BDV (min. 1.2 kV) under optimum process condition. These fabricated SiCN ceramic microstructures have greater electric and physical characteristics than bulk Si wafer. The fabricated SiCN microstructures would be applied for supertemperature MEMS applications such as heat exchanger and combustion chamber.
Keywords
SiCN; MEMS; PDMS mold; precursor; microstructure; HIP;
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