• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.376-377
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• 2006

Chemical Mechanical Planarization (CMP) has emerged as an enabling technology for the manufacturing of multi-level metal interconnects used in high-density Integrated Circuits (IC). Recently, multi-level structures have been also widely used m the MEMS device such as micro engines, pressure sensors, micromechanical fluid pumps, micro mirrors and micro lenses. Especially, among the thin films available in IC technologies, polysilicon has probably found the widest range of uses in silicon technology based MEMS. This paper presents the characteristic of polysilicon CMP for multi-level MEMS structures. Two-step CMP process verifies that is possible to decrease dishing amount with two type of slurries characteristics. This approach is attractive because two-step CMP process can be decreased dishing amount considerably more then just one CMP process.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.4
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• pp.280-287
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• 2002

We present technical issues involved in the development of actuators and sensors for applications to high-precision Micro Electro Mechanical System (MEMS). The technical issues include fabrication uncertainty and noise disturbance, causing major difficulties for MEMS to achieve high-precision actuation and detection functions. For nano-precision actuators, we solve the fabrication instability and electrical noise problems using digital actuators coupled with nonlinear mechanical modulators. For the high-precision capacitive sensors, we present a branched finger electrodes using high-amplitude anti-phase sensing signals. We also demonstrate the potential applications of the nanoactuators and nanodetectors to high-precision positioning MEMS.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2009.11a
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• pp.282-285
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• 2009

Ignition Safe-Arm-Unit using micro-electromechanical systems(MEMS) for propulsion system was designed and manufactured. MEMS was designed according to the design schemes for conventional mechanical elements. By comparing the design results and the test data of the prototype, small discrepancy was found, which is due to the nonlinear characteristic of the structure and the machining accuracy. The applicability of MEMS for Safe-Arm-Unit was proved by testing MEMS which is assembled into SAU.

• Journal of Positioning, Navigation, and Timing
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• v.3 no.2
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• pp.53-62
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• 2014

In the guided missile and unmanned vehicle system, the navigation system is one of the most important components. Recently, low-cost effective smart projectiles and guided bomb are being developed using MEMS based navigation system which has high-G, low-cost and small size. In this paper, locally developed MEMS based GPS/INS integrated navigation system will be introduced in comparison with the state of the art of MEMS based navigation system. And technical design and development method is described to satisfy the required performance of GPS receiver, MEMS inertial sensor assembly, navigation computer and software.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1407-1412
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• 2003

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temparature change is investigated using high-sensitivity $Moir{\acute{e}}$ interferometry. Using the real-time $Moir{\acute{e}}$ setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compond and the PCB.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.21 no.2
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• pp.106-111
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• 2011

In this paper, assumed mode method on Euler beam theory is employed and signal distortion is considered to obtain the performances of a MEMS accelerometer which are a sensitivity and measurable frequency range(MFR). Not only the sensitivities and MFR but also the variations of dynamic responses and natural frequencies of the MEMS accelerometer are investigated for several sets of beam properties such as length, width, thickness and Young's modulus. It is stated that the variations of beam properties significantly influence the performances of the MEMS accelerometer and the relationship between sensitivities and MFR is inversely proportional to each other.

• JSTS:Journal of Semiconductor Technology and Science
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• v.7 no.3
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• pp.177-182
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• 2007

This paper presents the see-saw type RF MEMS switch based on a single crystalline silicon structure with narrow gap vertical comb. Low actuation voltage and high isolation are key features to be solved in electrostatic RF MEMS switch design. Since these parameters in conventional parallel plate RF MEMS switch designs are in trade-off relationship, both requirements cannot be met simultaneously. In the vertical comb design, however, the actuation voltage is independent of the vertical separation distance between the contact electrodes. Therefore, the large separation gap between contact electrodes is implemented to achieve high isolation. We have designed and fabricated RF MEMS switch which has 46dB isolation at 5GHz, 0.9dB insertion loss at 5GHz and 40V actuation voltage.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.792-797
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• 2004

Dynamic modeling of an eccentric MEMS gyroscope is presented and the dynamic characteristics of the gyroscope are investigated with the modeling method. It is found that the eccentricity of the MEMS gyroscope affects the dynamic characteristics significantly. Different from conventional MEMS gyroscopes, the zero-rate output is significantly reduced in this gyroscope. To obtain general guidelines of the gyroscope design, dimensionless parameters are first identified and the effects of the parameters on the gyroscope performance measures are investigated.

• Journal of Korean Association for Spatial Structures
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• v.17 no.1
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• pp.93-100
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• 2017

With increasing number construction of high-rise building which has about 40 to 60 floors there have been many kinds of problem which related with usage from vibration. To predict response acceleration, it is important to assess correct natural frequency. However, due to the noise of MEMS sensor, it is difficult to measure dynamic characteristic such as natural frequency when measuring ambient vibration using MEMS sensor within cell phone. Therefore, a comparative analysis on vibration measuring applications was performed after measuring ambient vibration of 2 skyscrappers which have height between 133.5~244.3m that are located in Seoul and Observation tower using I-jishin APP with noise reduction function of MEMS sensor in order to verify the effectiveness of low noise type vibration measurement APP.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.11
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• pp.2247-2252
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• 2009

Since the dimensions of MEMS gyroscope are very small compared to those of conventional gyroscope, MEMS gyroscope should be able to measure charge of pico-coulomb caused by very small change of electrodes gap. However, feed-through signal from driving electrodes to the sensing electrodes due to the electromagnetic coupling is much greater than the sensing signal, which degrades the sensitivity of MEMS gyroscope. This paper introduces the feed-through noise canceling technique using dummy port and confirms the feasibility of feed-through noise canceling experimentally. Experimental results shows that, when driving signal is 6 Vpp, 30 kHz, feed-through signal of vacuum packaged Si Gyroscope decreases from -53.2 dBm to -77.1 dBm by using feed-through reduction technique. Q-factor that could not be measured without noise reduction is measured to be about 2500 and resonance frequency to be 7.018 kHz.