• Journal of Advanced Marine Engineering and Technology
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• 제29권5호
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• pp.475-481
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• 2005

• 한국광학회:학술대회논문집
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• 한국광학회 2000년도 하계학술발표회
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• pp.154-155
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• 2000

Optical switches using MEMS(Micro Electro Mechanical Systems) process have been widely developed since conventional optical switches cannot meet the requirements of new systems. $N_2$ type micro-mirror switches are easy to control, have simple optical systems but have difficulties in expanding the ports. Micromirrors of 2N type switches must be tilted at various angles and have relatively complicated optical systems but have advantage in expanding ports. Another type of optical switch using MEMS process is micro-waveguide type. It is reliable than other types since it has no moving parts.

• Journal of Advanced Marine Engineering and Technology
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• 제31권4호
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• pp.377-384
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• 2007

A backscatter Kikuchi diffraction attachment to an SEM enables the convenient investigation of grain orientations on bulk or micro surface. Their relation to micro structural features gives insight into many aspects of anisotropic materials properties. In micro area such as Micro Electro Mechanical Systems(MEMS) devices is required in order to improve understanding of how they may be expected to perform upon the micro scale. Electro Back Scatter Diffraction (EBSD) helps us to find uniform area as MEMS material. The ${\gamma}-TiAl$ has two different lamellar structures ${\gamma}/{\alpha}2-Ti_3Al$ phase which have shows $\{111\}{\gamma}//\{0001\}{\alpha}2$ plane indexing. The micro size testing specimen was successfully made by this structural relation. Interlamellar structure specimen averagely show $20{\sim}25%$ lower fracture toughness value compare with translamellar specimens Moreover micro fracture surface and micro crack progress were observed.

• 대한기계학회논문집A
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• 제27권10호
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• pp.1754-1761
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• 2003

The atomic force microscopy (AFM) based lithographic technique has been used directly to machine material surface and fabricate nano components in MEMS (micro electro mechanical system). In this paper, three-dimensional molecular dynamics (MD) simulations have been conducted to evaluate the characteristic of deformation process at atomistic scale for nano-lithography process. Effects of specific combinations of crystal orientations and cutting directions on the nature of atomistic deformation were investigated. The interatomic force between diamond tool and workpiece of copper material was assumed to be derived from the Morse potential function. The variation of tool geometry and cutting depth was also evaluated and the effect on machinability was investigated. The result of the simulation shows that crystal plane and cutting direction significantly influenced the variation of the cutting forces and the nature of deformation ahead of the tool as well as the surface deformation of the machined surface.

• 세라미스트
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• 제7권3호
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• pp.21-27
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• 2004

MEMS(Micro Electro Mechanical Systems)는 초소형 구조물의 제작 기술인 마이크로머시닝 기술을 이용하여 제작되는 초소형 전자기계 시스템을 말한다. 최근 10여 년간 MEMS 기술이 상당히 진척되었고 다양한 마이크로머시닝 기술이 개발되었다. 이에 따라 이를 이용하여 다양한 MEMS 소자의 개발이 이루어지고 있다. 그 중에서도 MEMS 센서는 비교적 간단한 제작 공정과 작은 크기, 그리고 저비용으로 인하여 상품화가 쉽게 이루어지고 있다. (중략)

• 센서학회지
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• 제15권3호
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• pp.164-167
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• 2006

Calorimeter is one of widely used biosensors. Conventional or existing calorimeters are realized directly on a silicon wafer which has very high thermal conductivity. It results in decreasing temperature difference between junctions and it makes a sensitivity of calorimeter to be decreased. In this study, the microcalorimeter was made by using MEMS(Micro Electro Mechanical Systems)-technology and hot junctions of the microcalorimeter are released from a silicon substrate to reduce loss of generated heat by reactions between biomolecules. Sensitivity of the released microcalorimeter was 18 mV/M which is 1.5 times higher than another calorimeters on silicon substrate by reactions between biotin and streptavidin.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.481-482
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• 2006

Chemical-mechanical polishing, the dominant technology for LSI planarization, is trending to play an important function in micro-electro mechanical systems (MEMS). However, MEMS CMP process has a couple of different characteristics in comparison to LSI device CMP since the feature size of MEMS is bigger than that of LSI devices. Preliminary CMP tests are performed to understand material removal rate (MRR) with blanket wafer under a couple of polishing pressure and velocity. Based on the blanket CMP data, this paper focuses on the consumable approach to enhance MEMS CMP by the adjustment of slurry and pad. As a mechanical tool, newly developed microstructured (MS) pad is applied to compare with conventional pad (IC 1400-k Nitta-Haas), which is fabricated by micro melding method of polyurethane. To understand the CMP characteristics in real time, in-situ friction force monitoring system was used. Finally, the topography change of poly-si MEMS structures is compared according to the pattern density, size and shape as polishing time goes on.

• 대한기계학회논문집A
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• 제31권5호
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• pp.550-555
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• 2007

The effective fracture toughness testing of materials intended for application in Micro Electro Mechanical Systems (MEMS) devices is required in order to improve understanding of how micro sized material used in device may be expected to perform upon the micro scale. ${\gamma}$-TiAl based materials are being considered for application in MEMS devices at elevated temperatures. Especially, in Alloy 4, both ${\alpha}_2$ and ${\gamma}$ lamellae were altered markedly in 3,000 h, $700^{\circ}C$ exposure. Parallel decomposition of coarse ${\alpha}_2$ into bunches of very fine (${\alpha}_2+{\gamma}$) lamellae. Parallel decomposition of coarse ${\alpha}_2$ into bunches of very fine (${\alpha}_2+{\gamma}$) lamellae. The materials were examined 2 types Alloy 4 on heat exposed specimen($700^{\circ}C$, 3,000 h) and no heat exposed one. Micro sized cantilever beams were prepared mechanical polishing on both side at $25{\sim}30{\mu}m$ and electro final stage polishing to observe lamellar orientation of same colony with EBSD (Electron Backscatter Diffraction Pattern). Through lamellar orientation as inter-lamellae or trans-lamellae, Cantilever beam was fabricated with Focused Ion Beam(FIB). The directional behavior of the lamellar structure was important property in single material, because of the effects of the different processing method and variations in properties according to lamellar orientation. In MEMS application, it is first necessary to have a reliable understanding of the manufacturing methods to be used to produce micro structure.

• 한국항공우주학회지
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• 제33권5호
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• pp.106-114
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• 2005

• Transactions on Electrical and Electronic Materials
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• 제7권4호
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• pp.157-162
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• 2006

Chemical-mechanical polishing (CMP), one of the dominant technology for ULSI planarization, is used to flatten the micro electro-mechanical systems (MEMS) structures. The objective of this paper is to achieve good planarization of the deposited film and to improve deposition efficiency of subsequent layer structures by using surface-micromachining process in MEMS technology. Planarization characteristic of poly-Si film deposited on thin oxide layer with MEMS structures is evaluated with different slurries. Patterns used for this research have shapes of square, density, line, hole, pillar, and micro engine part. Advantages of CMP process for MEMS structures are observed respectively by using the test patterns with structures larger than 1 urn line width. Preliminary tests for material selectivity of poly-Si and oxide are conducted with two types of silica slurries: $ILD1300^{TM}\;and\;Nalco2371^{TM}$. And then, the experiments were conducted based on the pretest. A selectivity and pH adjustment of slurry affected largely step heights of MEMS structures. These results would be anticipated as an important bridge stone to manufacture MEMS CMP slurry.