• Journal of Sensor Science and Technology
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• v.24 no.5
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• pp.287-290
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• 2015

Liquid crystal polymer (LCP) is a thermoplastic polymer with superior mechanical and thermal properties. In addition, its characteristics include very low water absorption rate and possibility to apply bonding process under low temperature. In this study, LCP is utilized as a packaging material for a microelectronic system (MEMS) based safety device with suggestion of a low temperature packaging process. Highly sensitive and stable capacitive type humidity sensor is fabricated to investigate hermeticity of the packaged MEMS device.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.2
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• pp.105-109
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• 2021

CNT fiber has been in the spotlight as a conductor, but the conductivity of CNT fibers do not match that of CNT. This study reveals that the conductivity of CNT fiber can be improved by depositing Al/Cu through vacuum evaporation. Cu is commonly used for deposition on CNT fibers. But low bonding strength of the interface between CNT and Cu could be a disadvantage. To overcome this, Al was deposited on the CNT fiber for forming aluminum carbide islands to increase the interfacial bonding strength. The conductivity characteristics were improved as the deposition time increased. The resistance was measured as a function of temperature, demonstrating that the temperature coefficient of resistance (TCR) is improved to be 241 ppm/℃ in comparison with that of as-received CNT fibers at -1,251 ppm/℃, when the CNT fibers are deposited with Al and Cu, respectively, for 90s and for 540s.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.1-10
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• 2022

Recently, semiconductor devices have been used in many fields owing to various applications of mobile electronics, wearable and flexible devices and substrates. During the semiconductor chip bonding process, the mismatch of coefficient of therm al expansion (CTE) between the substrate and the solder, and the excessive heat applied to the entire substrate and components affect the performance and reliability of the device. These problems can cause warpage and deterioration of long-term reliability of the electronic packages. In order to improve these issues, many studies on low-melting temperature solders, which is capable of performing a low-temperature process, have been actively conducted. Among the various low-melting temperature solders, such as Sn-Bi and Sn-In, Sn-58Bi solder is attracting attention as a promising low-temperature solder because of its advantages such as high yield strength, moderate mechanical property, and low cost. However, due to the high brittleness of Bi, improvement of the Sn-Bi solder is needed. In this review paper, recent research trends to improve the mechanical properties of Sn-Bi solder by adding trace elements or particles were introduced and compared.

• Journal of Korea Foundry Society
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• v.32 no.1
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• pp.50-56
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• 2012

Fusion bonding of cast iron and Al alloy is an effective way to improve the properties such as low inertia, high efficiency and corrosion resistance in machinery parts. In case of fusion bonding, intermetallic compound layers are formed at the interface between cast iron and Al alloy interface. It is important to control the intermetallic compound layers for improving bonding strength. The formation behavior of intermetallic compound layer by heat treatment has been investigated. Heat treatment was performed at temperature from $600^{\circ}C$ to $800^{\circ}C$ with $100^{\circ}C$ interval for an hour to investigate the phase transformation during heat treatment. Heat treated specimens were analyzed by using FE-SEM, EPMA and EDS. The EPMA/WDS results revealed that various phases were formed at the interface, which exhibited 4 distinct intermetallic compound layers such as ${\tau}_6-Al_{4.5}FeSi$, ${\tau}_2-Al_3FeSi$, ${\tau}_{11}-Al_5Fe_2Si $and ${\eta}-Al_5Fe_2$. Also, fine precipitation of ${\tau}_1-Al_2Fe_3Si_3$ phase was formed between ${\tau}_{11}$ and ${\eta}$ layer. The phase fraction in intermetallic compound layer was changed by heat treatment temperature. At $600^{\circ}C$, intermetallic compound layer of ${\tau}_6$ phase was mainly formed with increasing heat treatment time. With increasing heat treatment temperature to $800^{\circ}C$, however, ${\tau}_2$ phase was mainly distributed in intermetallic compound layer. ${\tau}_1$ phase was remarkably decreased with increasing heat treatment time and temperature.

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.11a
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• pp.1-1
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• 1994

;The electronic state calculations for various types of ceramic materials have beell performed by the use of $DV-X\;{\alpha}$ cluster method. The molecular orbital levels and wave functions for model clusters have been computed to study the electronic properties ami chemical bonding of the ceramics. For ${\beta}-sialon(Si_{6-z}Al_zO_zN_{8-z})$ which is a high temperature structural material based on ${\beta}-Si_3N_4$, we have made model cluster calculations to estimate the strength of chemical bonding between atoms by the Mulliken population analysis. It is found that the covalent bonding between Si and N atoms is very strong in pure ${\beta}-Si_3N_4$, but the covalency around solute atom is considerably weakened when Si atom is substituted by AI. This tendency is enhanced by an additional substitution of oxygen atom for N. The result calculated can well explain the experimental data of changes in mechanical properties such as the reductions of Young's modulus and Vickers hardness with increment of z-value in ${\beta}-sialon$. Various model clusters for transition metal oxides which show many interesting physical and chemical properties have also been calculated. High-valent perovskite-type iron oxides EMFe0_3E(M=Ca and Sr) possess very interesting magnetic and chemical properties. In these oxides, iron exists as $Fe^{4+}$ state, but the experimental measurement of Mossba~er effect suggests that disproportionation $2Fe^{4+}=Fe^{3+}+Fe^{5+}$ takes place for $CaFe0_3$ at low temperatures. The model cluster calculations for these compounds indicated the existence of considerably strong covalent bonding of Fe-O. The calculations of hyperfine interaction at iron neucleus show very good agreement with the experimental Mossbauer measurements. The result calculated also implies that the disproportionation reaction is strongly possible by assuming the quenching of breathing phonon mode at low temperatures.tures.

• International Journal of Highway Engineering
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• v.15 no.2
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• pp.65-71
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• 2013

PURPOSES : The objective of this study is to evaluate the effect of physical characteristics of emulsion asphalt and aggregate on performance of chip seal pavements. METHODS : In order to evaluate the performance of chip seal materials, the sweep tests and Vialit Plate Shock tests were conducted on the mixtures with five emulsion asphalt binders and three aggregate types. The sweep tests was intended to investigate the change of bonding properties between emulsion asphalt and aggregate with curing time. The Vialit Plate Shock test was used to evaluate the bonding properties of chip seal materials at low temperatures. RESULTS : Results from sweep tests showed that polymer modified emulsion asphalt can reduce the curing time by 1.5 hour comparing with typical emulsion asphalt. It is also found that the Flakiness Index of aggregates and absorption rate of binder are the major factors affecting the bonding properties of chip seal materials. The Vialit Plate Shock test results showed that the average aggregate loss of CRS-2 is ten times higher than CRS-2P No.2 indicating that the use of polymer additives in emulsion asphalt can improve the performance of chip seal materials in low temperature region. CONCLUSIONS : The use of polymer in emulsion asphalt can decrease the curing time of chip seal materials and increase the bonding properties between aggregates and asphalt binder. It is also concluded that the lower Flakiness Index and absorption rate of aggregates can improve the performance of chip seal pavement.

• International Journal of Highway Engineering
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• v.19 no.6
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• pp.37-46
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• 2017

PURPOSES : A composite pavement utilizes both an asphalt surface and a concrete base. Typically, a concrete base layer provides structural capacity, while an asphalt surface layer provides smoothness and riding quality. This pavement type can be used in conjunction with rollercompacted concrete (RCC) pavement as a base layer due to its fast construction, economic efficiency, and structural performance. However, the service life and functionality of composite pavement may be reduced due to interfacial bond failure. Therefore, adequate interfacial bonding between the asphalt surface and the concrete base is essential to achieving monolithic behavior. The purpose of this study is to investigate the bond characteristics at the interface between asphalt (HMA; hot-mixed asphalt) and the RCC base. METHODS : This study was performed to determine the optimal type and application rate of tack coat material for RCC-base composite pavement. In addition, the core size effect, temperature condition, and bonding failure shape were analyzed to investigate the bonding characteristics at the interface between the RCC base and HMA surface. To evaluate the bond strength, a pull-off test was performed using different diameters of specimens such as 50 mm and 100 mm. Tack coat materials such as RSC-4 and BD-Coat were applied in amounts of 0.3, 0.5, 0.7, 0.9, and $1.1l/m^2$ to determine the optimal application rate. In order to evaluate the bond strength characteristics with temperature changes, a pull-off test was carried out at -15, 0, 20, and $40^{\circ}C$. In addition, the bond failure shapes were analyzed using an image analysis program after the pull-off tests were completed. RESULTS : The test results indicated that the optimal application rate of RSC-4 and BD-Coat were $0.8l/m^2$, $0.9l/m^2$, respectively. The core size effect was determined to be negligible because the bond strengths were similar in specimens with diameters of 50 mm and 100 mm. The bond strengths of RSC-4 and BD-Coat were found to decrease significantly when the temperature increased. As a result of the bonding failure shape in low-temperature conditions such as -15, 0, and $20^{\circ}C$, it was found that most of the debonding occurred at the interface between the tack coat and RCC surface. On the other hand, the interface between the HMA and tack coat was weaker than that between the tack coat and RCC at a high temperature of $40^{\circ}C$. CONCLUSIONS : This study suggested an optimal application rate of tack coat materials to apply to RCC-base composite pavement. The bond strengths at high temperatures were significantly lower than the required bond (tensile) strength of 0.4 MPa. It was known that the temperature was a critical factor affecting the bond strength at the interface of the RCC-base composite pavement.

• Fashion & Textile Research Journal
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• v.11 no.4
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• pp.672-677
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• 2009

To reduce the dependence of wool dyeing on the temperature several solvents with different properties and structures were added to the dye bath of C. I. Acid Yellow 42. Nearly the same total solubility parameters(${\delta}_t$) of solvents as those of wool fiber and hydrophobic part of the dyestuff were needed to increase disaggregation of dye molecules, loosening the wool fiber and wickabilty of dyeing solution; besides, the large surface tension(${\gamma}$) value of the solvents and the well balanced values of the three-component Hansen solubility parameters such as dispersion(${\delta}_d$), polar(${\delta}_p$), and hydrogen(${\delta}_h$) bonding parameters were required. Among the added solvents dimethyl phthalate(DMP) and acetophenone(AP) were satisfied with these conditions and worked the most successfully in the low temperature wool dyeing. Their effectiveness proven by the dyeing rate and the activation energy ($E_a$) of the dyeing was in the order of DMP > AP > DBE > CH > M >NONE. In conclusion the total solubility parameters(${\delta}_t$), the three-component Hansen parameters and the surface tension(${\gamma}$) of DMP and AP could be the guidelines to select suitable solvents for low temperature wool dyeing.

• Journal of Sensor Science and Technology
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• v.13 no.3
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• pp.175-181
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• 2004

A pressure sensor for high temperature was fabricated by using a SDB(Silicon-Direct-Bonding) wafer with a Si/$SiO_{2}$/ Si structure. High pressure sensitivity was shown from the sensor using a single crystal silicon of the first layer as a piezoresistive layer. It also was made feasible to use under the high temperature as of over $120^{\circ}C$, which is generally known as the critical temperature for the general silicon sensor, by isolating the piezoresistive layer dielectrically and thermally from the silicon substrate with a silicon dioxide layer of the second layer. The pressure sensor fabricated in this research showed very high sensitivity as of $183.6{\mu}V/V{\cdot}kPa$, and its characteristics also showed an excellent linearity with low hysteresis. This sensor was usable up to the high temperature range of $300^{\circ}C$.

• Restorative Dentistry and Endodontics
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• v.34 no.5
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• pp.397-405
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• 2009

This study compared the effect of an activator, intermediate bonding resin and low-viscosity flowable resin on the microtensile bond strength of a self-curing composite resin used with two-step total etching adhesives. Twenty extracted permanent molars were used. The teeth were assigned randomly to nine groups (n=10) according to the adhesive system and application of additional methods (activator, intermediate adhesive, flowable resin). The bonding agents and additional applications of each group were applied to the dentin surfaces. Self-curing composite resin buildups were made for each tooth to form a core, 5mm in height. The restored teeth were then stored in distilled water at room temperature for 24h before sectioning. The microtensile bond strength of all specimens was examined. The data was analyzed statistically by one-way ANOVA and a Scheffe's test. The application of an intermediate bonding resin (Optibond FL adhesive) and low-viscosity flowable resin (Tetric N-flow) produced higher bond strength than that with the activator in all groups. Regardless of the method selected, Optibond solo plus produced the lowest ${\mu}TBS$ to dentin. The failure modes of the tested dentin bonding agents were mostly adhesive failure but there were some cases showed cohesive failure in the resin.