• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.106-106
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• 2011

Recently, zinc oxide (ZnO) thin films have attracted great attention as a promising candidate for various electronic applications such as transparent electrodes, thin film transistors, and optoelectronic devices. ZnO thin films have a wide band gap energy of 3.37 eV and transparency in visible region. Moreover, ZnO thin films can be deposited in a poly-crystalline form even at room temperature, extending the choice of substrates including even plastics. Therefore, it is possible to realize thin film transistors by using ZnO thin films as the active channel layer. In this work, we investigated influence of oxygen partial pressure on ZnO thin films and fabricated ZnO-based thin film transistors. ZnO thin films were deposited on glass substrates by using a pulsed laser deposition technique in various oxygen partial pressures from 20 to 100 mTorr at room temperature. X-ray diffraction (XRD), transmission line method (TLM), and UV-Vis spectroscopy were employed to study the structural, electrical, and optical properties of the ZnO thin films. As a result, 80 mTorr was optimal condition for active layer of thin film transistors, since the active layer of thin film transistors needs high resistivity to achieve low off-current and high on-off ratio. The fabricated ZnO-based thin film transistors operated in the enhancement mode with high field effect mobility and low threshold voltage.

• 대한금속재료학회지
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• 제50권8호
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• pp.613-618
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• 2012

We report on electrical and mechanical properties of silicon nitride ($SiN_x$) films deposited by a plasma enhanced chemical vapor deposition (PECVD) method at $200^{\circ}C$ from $SiH_4$ highly diluted in $N_2$. The films were also prepared from $SiH_4$ diluted in He for comparison. The $N_2$ dilution was also effective in improving adhesion of the $SiN_x$ films, fascilitating construction of thin film transistors (TFTs). Metal-insulator-semiconductor (MIS) and Metal-insulator-Metal (MIM) structures were used for capacitance-voltage (C-V) and current-voltage (I-V) measurements, respectively. The resistivity and breakdown field strength of the $SiN_x$ films from $N_2$-diluted $SiH_4$ were estimated to be $1{\times}10^{13}{\Omega}{\cdot}cm$, 7.4 MV/cm, respectively. The MIS device showed a hysteresis window and a flat band voltage shift of 3 V and 0.5 V, respectively. The TFTs fabricated by using these films showed a field-effect mobility of $0.16cm^2/Vs$, a threshold voltage of 3 V, a subthreshold slope of 1.2 V/dec, and an on/off ratio of > $10^6$.

• 한국지구과학회지
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• 제26권2호
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• pp.149-159
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• 2005

Simultaneous observations of MODIS (Moderate-resolution Imaging Spectroradiometer) onboard the Aqua and Terra satellites and weather station at ground near the Inchon International Airport (37.2-37.7 N, 125.7-127.2 E) during the period from December 2002 to September 2004 have been utilized in order to analyze the characteristics of satellite-observed infrared (IR) and visible data under fog and clear-sky conditions, respectively. The differences $(T_{3.7-11})$ in brightness temperature between $3.75{\mu}m\;and\;11.0{\mu}m$ were used as threshold values for remote-sensing fog (or low clouds) from satellite during day and night. The $T_{3.7-11}$ value during daytime was greater by about 21 K when it was foggy than that when it was clear, but during nighttime fog it was less by 1.5 K than during nighttime clear-sky. The value was changed due to different values of emission of fog particles at the wavelength. Since the near-IR channel at $3.7{\mu}m$ was affected by solar and IR radiations in the daytime, both IR and visible channels (or reflectance) have been used to detect fog. The reflectance during fog was higher by 0.05-0.6 than that during clear-sky, and varied seasonally. In this study, the threshold values included uncertainties when clouds existed above a layer of fog.

• 마이크로전자및패키징학회지
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• 제14권3호
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• pp.15-20
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• 2007

플라스틱 기판에 적용이 가능한 최대 공정온도 $270^{\circ}C$ 이하에서 ZnO-TFT 소자를 제작하였다. ZnO-TFT 소자는 bottom gate 구조로 제작되었으며, ICP-CVD로 형성된 $SiO_2$ 산화물 게이트 공정을 제외하고는 모든 박막증착 공정은 RF-magnetron sputtering process를 이용하였다. ZnO 박막은 Ar과 $O_2$ gas 유량의 비율에 따라 여러 가지 조건에서 RF-magnetron sputtering 시스템을 이용하여 상온에서 증착하였다. Ar과 $O_2$ gas의 비율에 따라 제작된 TFT 소자는 모두 enhancement 모드의 소자특성을 나타내었고, 또한 가시광선영역에 있어 80% 이상의 높은 투과율을 보였다. ZnO 증착시 순수 Ar을 사용하여 제작된 ZnO-TFT의 경우에, $1.2\;cm^2/Vs$의 field effect mobility, 8.5 V의 threshold voltage, 그리고 $5{\times}10^5$의 높은 on/off ratio, 1.86 V/decade의 swing voltage로 가장 우수한 전기적 특성을 보였다.

• 한국정보통신학회논문지
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• 제12권9호
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• pp.1615-1622
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• 2008

경사형 스페이서와 LDD 영역을 갖는 다결정 실리콘 TFT를 제작하였다. 소자 특성의 신뢰성을 위해 수소($H_2$)와 수소/플라즈마 처리 공정으로 수소 처리된 n-채널 다결정실리콘 TFT 소자를 제작하였다. 소자에 최대 누설전류의 게이트 전압 조건에서 소자에 스트레스를 인가시켰다. 게이트 전압 스트레스 조건에 의해 야기되는 열화 특성인자들인 드레인 전류, 문턱전압($V_{th}$), 부-문턱전압 기울기(S), 최대 전달 컨덕턴스($g_m$), 그리고 파워인자 값을 측정/추출하였으며, 수소처리 공정이 소자 특성의 열화 결과에 미치는 관계를 분석하였다. 특성 파라미터의 분석 결과, 수소화 처리시킨 n-채널 다결정 실리콘 박막 트랜지스터에서 열화특성의 원인들은 다결정실리콘/산화막의 계면과 다결정 실리콘의 그레인 경계에서 실리콘-수소 본드의 해리에 의한 현수 본드의 증가이었다. 따라서 새로 제안한 다결정 TFT의 구조는 제작 공정 단계가 간단하며, 소자 특성에서 누설전류가 드레인 영역 근처 감소된 수평 전계에 의해 감소되었다.

• 한국산학기술학회논문지
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• 제18권2호
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• pp.235-242
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• 2017

능동 파괴 방호 구동제어기는 기계, 항공 및 군사 분야 등에서 사용될 수 있는 제어기로서, 상대의 비행물체를 능동제어를 통해 추적 타격하는데 사용된다. 구동제어기를 이용하여 목표지점까지의 정밀도를 갖고 동작이 유지되어야 하기 때문에, 이에 대한 신뢰성 확보가 대단히 중요하다. 이러한 구동제어기가 사용되는 주위 환경의 온도는 약 $-32^{\circ}C{\sim}50^{\circ}C$($241^{\circ}K{\sim}358^{\circ}K$)이다. 신뢰성을 갖기 위해 구동제어기에서 중요시 간주되는 문제 중의 하나는 구동제어기 내의 열 발생이 어느 한계수준($85^{\circ}C$($358^{\circ}K$))이하로 유지되어야 정밀도와 신뢰성을 확보할 수 있다는 점이다. 따라서 구동제어기 내의 열 유동특성에 대한 연구와 분석이 필요하게 된다. 본 논문의 수치시뮬레이션을 위해 저 레이놀드 수 $k-{\epsilon}$ 난류모델과 비압축성 점성 유동을 가정하였고, 상용 소프트웨어인 Solid-Works Flow Simulation을 사용하였다. 본 논문의 목적은 각종 칩이나 보드 등을 갖는 구동제어기 내부의 열 유동 특성을 해석하여 구동제어기의 안전한 설계를 하는데 있다. 해석으로부터, 보드들과 칩들의 온도분포가 어떤 한계 수준 이내에 있음을 보여준다.

• 한국전기전자재료학회논문지
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• 제24권1호
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• pp.12-16
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• 2011

In this study, we fabricated the flexible pentacene TFTs with the polymer gate dielectric and contact printing method by using the silver nano particle ink as a source/drain material on plastic substrate. In this experiment, to lower the cross-linking temperature of the PVP gate dielectric, UV-Ozone treatment has been used and the process temperature is lowered to $90^{\circ}C$ and the surface is optimized by various treatment to improve device characteristics. We tried various surface treatments; $O_2$ Plasma, hexamethyl-disilazane (HMDS) and octadecyltrichlorosilane (OTS) treatment methods of gate dielectric/semiconductor interface, which reduces trap states such as -OH group and grain boundary in order to improve the OTFTs properties. The optimized OTFT shows the device performance with field effect mobility, on/off current ratio, and the sub-threshold slope were extracted as $0.63cm^2 V^{-1}s^{-1}$, $1.7{\times}10^{-6}$, and of 0.75 V/decade, respectively.

• 한국재료학회지
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• 제33권11호
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• pp.491-496
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• 2023

As the demand for p-type semiconductors increases, much effort is being put into developing new p-type materials. This demand has led to the development of novel new p-type semiconductors that go beyond existing p-type semiconductors. Copper iodide (CuI) has recently received much attention due to its wide band gap, excellent optical and electrical properties, and low temperature synthesis. However, there are limits to its use as a semiconductor material for thin film transistor devices due to the uncontrolled generation of copper vacancies and excessive hole doping. In this work, p-type CuI semiconductors were fabricated using the chemical vapor deposition (CVD) process for thin-film transistor (TFT) applications. The vacuum process has advantages over conventional solution processes, including conformal coating, large area uniformity, easy thickness control and so on. CuI thin films were fabricated at various deposition temperatures from 150 to 250 ℃ The surface roughness root mean square (RMS) value, which is related to carrier transport, decreases with increasing deposition temperature. Hall effect measurements showed that all fabricated CuI films had p-type behavior and that the Hall mobility decreased with increasing deposition temperature. The CuI TFTs showed no clear on/off because of the high concentration of carriers. By adopting a Zn capping layer, carrier concentrations decreased, leading to clear on and off behavior. Finally, stability tests of the PBS and NBS showed a threshold voltage shift within ±1 V.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.281-281
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• 2014

The field emission properties of GaN are reported in the present study. To be a good field emitter, it requires a low work function, high aspect ratio, and strong mechanical stability. In the case of GaN, it has a quite low work function (4.1eV) and strong chemical/mechanical/thermal stabilities. However, so far, it was difficult to fabricate vertical GaN nanostructures with a high aspect ratio. In this study, we successfully achieved vertically well aligned GaN nanostructures with chemical vapor-phase etching methods [1] (Fig. 1). In this method, we chemically etched the GaN film using hydrogen chloride and ammonia gases at high temperature around $900^{\circ}C$. This process effectively forms vertical nanostructures without patterning procedure. This favorable shape of GaN nanostructures for electron emitting results in excellent field emission properties such as a low turn-on field and long term stability. In addition, we observed a uniform fluorescence image from a phosphor film attached at the anode part. The turn-on field for the GaN nanostructures is found to be about $0.8V/{\mu}m$ at current density of $20{\mu}A$/cm^2. This value is even lower than that of typical carbon nanotubes ($1V/{\mu}m$). Moreover, threshold field is $1.8V/{\mu}m$ at current density of $1mA$/cm^2. The GaN nanostructures achieved a high current density within a small applied field range. We believe that our chemically etched vertical nanostructures are the promising structures for various field emitting devices.

• 대한전자공학회논문지SD
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• 제47권2호
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• pp.87-93
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• 2010

이 글은 공정, 전압, 온도 변화를 극복하기 위한 2단계 자동 트랜스컨덕턴스 조절 기능을 가진 저전력, 광대역 전압제어발진기의 설계에 관한 논문이다. 광대역에서 전압제어발진기를 발진시키기 위해, 디지털 자동 트랜스컨덕턴스 조절 루프와 아날로그 자동 진폭조절 루프가 사용되었다. 전압제어발진기의 출력 스윙 크기에 따라 트랜지스터의 바디전압을 조절하는 기능도 저전력 구현을 위해 설계되었다. 소모전류는 1.2 V 공급전압에서 2 mA에서 6 mA까지 1 mA 단위로 조절된다. 전압제어발진기의 튜닝 범위는 2.35 GHz에서 5 GHz까지 2.65 GHz로써 72%이다. 위상잡음은 중심주파수 3.2 GHz를 기준으로 1MHz 떨어진 지점에서 -117 dBc/Hz 이다.