• The Transactions of the Korean Institute of Electrical Engineers D
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• v.49 no.5
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• pp.235-240
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• 2000

A low cost lighting system for line-scan cameras has been developed with 3-phase power. When exposure time of line-scan camera is shorter than fluctuation period of illumination, the average gray value of each acquired 1-D image varies. Detecting defects on the objects's surface under such illuminating environment is very difficult. The proposed lighting system is composed of low-cost fluorescent lights based on 3-phase power. The specially designed lighting pack and the properly selected lighting position enable to get the rippleless lighting. The principle of the proposed lighting system has been explained analytically. The lighting system has been tested for fabric inspection with line-scan camera and it's efficacy has been proved.

• Korean Journal of Optics and Photonics
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• v.19 no.5
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• pp.376-380
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• 2008

This paper presents the Projection Moire method using a line scan camera. The high resolution feature of a line scan camera makes it possible to scan an image quickly, thus enabling a much quicker 3D profile. This method uses a high resolution line scan camera making it possible to scan an image at high speed simultaneously measuring the 3D profile of a large FOV. When using a high resolution scan camera, a full FOV is scanned, thus requiring just one movement of a projection grating. As a result, the number of grating movements is reduced drastically. The end result is a faster and more accurate 3D measurement. Moving the grating too quickly causes vibration in the imaging system, which will normally be required to apply a stitching technique when using an area scan camera. However the technique is not required when using a line scan camera. Compared with the previous techniques, it has the advantages of simple hardware without moving mechanical parts - single exposure for obtaining three-dimensional information. A method using a high resolution line scan camera can be used in mass production to measure the bump height of wafers or the bump height of package substrates.

• Journal of Korea Society of Industrial Information Systems
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• v.7 no.4
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• pp.29-36
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• 2002

In this paper, a new edge detection method for area images is presented based on the scan-line image segmentation technology. The existing algorithms are lack of precision in its detections due to the noise factors such as depth perception and illumination problems when processing the 3D image into a 2D image. The general process of applying the scan-line method is to extract straight line components to determine the shape of the objects. However, we implement this method to an arc curve for precise detections. the paper proved precise detections that from off line to on line.

• Journal of the Korean Home Economics Association
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• v.46 no.9
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• pp.137-146
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• 2008

This study was conducted in order to spread out lower body 3D scan data of men in their twenties. The aim was to achieve slacks pattern with ease allowance through comparison with existing flat patterns. For conversion of 3D scan data into 20 pattern, reference lines were established by using Rapid Foam in 3D shape analysis software. 2C-AN program and Yuka CAD were used to convert 20 pattern earned with straight posture of 3D scan data into slacks pattern by using Triangle Simplification & Runge-Kutta Method. In order to achieve this we needed to set a line 9cm below the hip line, to array vertex of each block to crease line while maintaining the horizontal line. And then we needed to set ease allowance in back crotch and to set waist circumference or hip circumference ease allowance in side seam of slacks. Results showed that long front crotch length can be achieved if 3D scan data is compared with 20 existing flat pattern. Slacks pattern that raise front crotch by about 1.5cm compared to back crotch and also possess ease allowance in back crotch area are great in appearance evaluation.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.1802-1807
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• 2004

When a construction company builds a high structure, many piles should be driven into the ground by a hammer whose weight is 7,000 Kg in order to make the ground under the structure safe and strong. So, it is essential to determine whether a pile is penetrated into the ground enough to support the weight of the structure since ground characteristics at different locations are different each other. This paper proposes a visual measurement system for pile rebound and penetration movement including vibration using a high-speed line-scan camera and a specially designed mark to recognize two-dimensional motion parameters of the mark using only a line-scan camera. A mark stacking white and black right-angled triangles is used for the measurement, and movement information for vertical distance, horizontal distance and rotational angle is determined simultaneously

• Proceedings of the Korean Geotechical Society Conference
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• 2005.10a
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• pp.639-648
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• 2005

Up to now, practical engineers applying simplicity value of rockfall block weight suggested in design manual without considering in-situ rockfall block weight which reflect joint characteristics. However, the size of rockfall block varies with joint spacing of discontinuities and influences over rockfall analysis results. In this paper, we estimate realistic rockfall block weight distribution using statistical invariances of joint spacing derived from scan-line survey result. And, we study whether this distribution is applicable in practical rockfall analysis directly. As the results of this study, rockfall analysis results that using rockfall block weight distribution estimated from scan-line survey show resonable and realistic outcomes.

• Proceedings of the KIEE Conference
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• 1987.07b
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• pp.1492-1494
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• 1987

This paper describes a hardware architecture called Edge Painting Machine for real time generation of scan line images for raster scan graphics display. The Edge Painting Machine consists of Scanline Processor which converts polygon data sorted in their depth priority into a set of scan line commands for each scan line, and Edge Painting Tree which converts the scanline commands set into a raster line image. Edge painting tree has been designed using combinational logic circuit. The designed circuit has been simulated to verify the proper functioning. A salient feature of the EPT is that hardware composition is simple, because each processor is constituted by only combinational logic circuit.

• Proceedings of the IEEK Conference
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• 2002.06d
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• pp.81-84
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• 2002

This paper presents the real-time PCB(Printed circuit board) inspection system that can detect thin open/short error using the line scan camera. After a overall introduction of our system, the outline of our inspection methods are described. The goal of our inspection system is the real time and detailed inspection using the line scan camera. To perform inspection processing in real-time, we utilize double buffering structure. In order to solve the problem of unexpectable pixels of PCB, we propose melting process which eliminates unexpectable pixels of PCB. The design and development of our prototype of PCB ins- pection system is discussed and test results are presented to show the effectiveness of the developed inspection algorithm.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.6
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• pp.1191-1195
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• 2009

We present the efficient test wrapper design methodology considering the layout distance of scan chain. To test the scan chains in SoC, the scan chains must be assigned to external TAM(Test Access Mechanism) lines. The scan chains in IP were placed and routed without any timing violation at normal mode. However, in test mode, the scan chains have the additional layout distance after TAM line assignment, which can cause the timing violation of flip-flops in scan chains. This paper proposes a new test wrapper design considering layout distance of scan chains with timing violation free.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.1037-1040
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• 2002

In micro-stereolithography technology, fabrication conditions that include laser power, laser scan speed, laser scan pitch, and material property of photopolymer such as penetration depth and critical exposure are considered as major process variables. But the existing scan path generation methods based only on CAD model have not taken them into account, which has resulted in cross-section dimension of low accuracy. Thus, to enhance cross-section dimensional accuracy, the physical resin solidification n phenomena should be reflected in laser scan path generation and stage operating code. In this paper, multi-line experiments based on single line solidification model are performed. And the method for improving cross-section dimensional accuracy is presented, which is to apply the database based on experimental results to laser scan path generation.